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7623348 |
Heat sink and cooling apparatus
A heat sink for dissipating a heat from an object includes a plurality of fins. The fins are arranged radially about a center axis to be spaced away from one another, and extend outward in a radial...
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7619888 |
Flat heat column and heat dissipating apparatus thereof
A heat dissipating module includes a heat dissipating apparatus and a fan. The fan is disposed adjacent to a side of the heat dissipating apparatus. A heat dissipating apparatus includes a flat...
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7616444 |
Gimballed attachment for multiple heat exchangers
One or more heat exchangers are coupled to one or more heat sources using a single gimballed joining mechanism. The joining mechanism includes a gimbal plate and a gimbal joint. The gimbal joint...
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7609521 |
Heat dissipation device with a heat pipe
A heat dissipation device includes a fin assembly, a base, a heat pipe soldered with the base, and a heat spreader sandwiched between the heat pipe and the fin assembly. The fin assembly has a...
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7606027 |
Electronic apparatus cooling structure
An electronic apparatus includes a circuit board, circuit elements mounted on the circuit board, and a cooling structure for cooling the circuit elements. The circuit elements include a heat...
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7600908 |
Light source module and backlight system using the same
A light source module includes at least a light source and a housing. The housing includes a base having a slanted reflective surface, a plurality of sidewalls extending out of a peripheral of the...
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7595989 |
Heat dissipation device
A heat dissipation device includes a base, a first heat sink located on the base, a second heat sink located on the first heat sink, and a heat pipe contacting with the base and the first and...
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7595468 |
Passive thermal solution for hand-held devices
The present invention relates to a thermal solution for hand-held devices. In an embodiment, the present invention implements a thermal gap filler and a system enclosure for effective thermal...
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7592695 |
Compound heat sink
A compound heat sink for the removal of thermal energy useful for, inter alia, electronic devices or other components. The compound heat sink includes a die cast base element; an extruded...
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7580263 |
Heat dissipation device with a fan holder
A heat dissipation device includes a heat sink assembly, a fan holder and two fans mounted on the two sides of the fan holder. The heat sink assembly includes a heat spreader for contacting with a...
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7573709 |
Grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers
A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material...
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7567435 |
Heat sink assembly
A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side...
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7564686 |
Heat-dissipating module
A heat-dissipating module dissipating heat generated by a heat-generating element includes a plurality of fins, a fan generating an air current and a heat pipe. Each fin has a first edge facing the...
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7539017 |
Heat dissipating device for central processor
A heat dissipating device includes an electric member, a heat sink having a base to be secured on the electric member. The base includes an upper surface and includes four corner areas, and...
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7539009 |
Cooling unit having a heat radiating portion, and electronic apparatus incorporating a cooling unit
The cooling unit includes a heat receiving portion, a heat radiating portion and a circulation path. The heat radiating portion has an impeller, a heat-radiating member and a case. The...
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7538426 |
Cooling system of power semiconductor module
A cooling system of a power semiconductor module of the invention includes a temperature detection sensor provided in a semiconductor element as a heat source provided in a power semiconductor...
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7529089 |
Heat-dissipating device connected in series to water-cooling circulation system
A heat-dissipating device includes a MOSFET heat dissipator, a south bridge heat dissipator, a north bridge heat dissipator and a water block connector. A heat pipe is provided between each heat...
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7518874 |
Heat sink assembly
A heat sink assembly includes a heat sink and a clip assembly received in the heat sink. The clip assembly comprises a clip and a movable fastener pivotally connected to the clip via a pair of...
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7515412 |
Cooling structure for power supply
A cooling structure for a power supply is disclosed. The power supply has a housing. The cooling structure includes a cooling fan and a cooler. The cooling fan is located on the inner side of the...
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7508669 |
Cooling device for an electronic component, especially for a microprocessor
A cooling device ( 1 ) for an electronic component ( 3 ), especially for a microprocessor, includes a heat sink ( 7, 9 ), which can be connected to the electronic component ( 3 ) to be cooled, such...
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7505273 |
Cooling body and rectifier module for an electrical machine
A heat sink, in particular for a rectifier unit of an electrical machine has at least one diode opening, and disposed around the at least one diode opening at least partially ring-shaped cooling...
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7501844 |
Liquid cooled DUT card interface for wafer sort probing
A water block heat dissipation on a probe card interface for cooling active components and other devices requiring heat dissipation on the probe card is presented.
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7495917 |
Heat dissipation device
A heat dissipation device includes a retention module ( 60 ), a heat sink ( 10 ), a fan bracket ( 50 ), a fan ( 70 ) mounted on the fan bracket, and a pair of wire clips ( 30 ) cooperating with the...
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7492599 |
Heat sink for LED lamp
A heat dissipation device ( 40 ) is used for dissipating heat generated by a plurality of LEDs ( 15 ) mounted on a circuit board ( 12 ). The heat dissipation device comprises two heat sinks ( 30 )...
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7489513 |
Heat dissipation device
A heat dissipation device includes a first heat sink and a second heat sink juxtaposed with the first heat sink. The first heat sink includes a first base and a plurality of first fin extending...
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7486515 |
Fluid circulator for fluid cooled electronic device
An electronic device is provided having a bimetallic fluid circulator for circulating fluid coolant in relation to electrical circuitry to provide enhanced heat exchange. The fluid circulator...
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7477515 |
Electronic apparatus and thermal dissipating module thereof
A thermal dissipating module comprises a heat pipe with a first end and a second end, a first joint component connected to the first end, a second joint component connected to the second end, a...
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7468890 |
Graphics card heat-dissipating device
A graphics card heat-dissipating device includes: a main body, a support seat, and a fixed element. The main body has a first heat-dissipating portion and a second heat-dissipating portion, and the...
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7466552 |
Heat-radiating structure and plasma display device including the same
In a heat-radiating structure and a plasma display device including the same, an uneven shape is formed in a bed of a chassis base, and a heat sink is installed on a cover plate such that heat is...
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7466550 |
Integrated heat dissipating assembly
An integrated heat dissipating assembly includes two heat sinks, a heat dissipating fan mounted between the two sinks and a body provided below the two heat sinks and the heat dissipating fan. The...
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7463484 |
Heatsink apparatus
A heatsink apparatus for dissipating heat generated by electronic parts is provided. The heatsink apparatus includes a fan and a heatsink fin. One end of the heatsink fin is adhered to an...
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7460368 |
Cooling-fan-free system module
A cooling-fan-free system module includes a housing unit, a circuit module, and a heat radiating unit. The housing unit includes a front and a rear case assembled together to define a receiving...
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7457118 |
Method and apparatus for dispersing heat from high-power electronic devices
A heat dissipation apparatus includes a heat absorption device coupled to a board, the heat absorption device configured to absorb heat generated by an electrical device mounted on the board, a...
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7455103 |
Electronic equipment provided with cooling system
An electronic equipment is provided, which comprises a liquid-cooling system and a cooling fan as a cooling system, efficiently cools the liquid-cooling system, and reduces fan noise. The...
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7453695 |
Cooling structure of electric device
A cooling structure of electric devices in a vehicle is structured to hold an inverter ( 300 ) downward of a cooling passage ( 356 ), and to hold a condenser ( 200 ) upward of the cooling passage (...
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7440261 |
Power regulator with a bypass and splice capability
A power regulator with a bypass and splice capacity includes at least one phase member and a driver. Each one of the at least one phase member includes two cooling fins, two SCR thyristors, a...
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7423877 |
Heat dissipation device
A heat dissipation device includes a heat-absorbing member having two arched concave walls formed at opposite sides thereof, and a plurality of fins extending outwardly and slantwise from each of...
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7417859 |
Heat radiating assembly for plasma display apparatus and plasma display apparatus including the same
A heat radiating assembly employable by a plasma display apparatus for radiating heat generated by a signal transmission unit, which transmits electric signals from a circuit unit that drives a...
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7414845 |
Circuit board assembly for a liquid submersion cooled electronic device
A circuit board assembly, for example, a computer motherboard, for use in a liquid submersion cooled electronic device, for example, a computer, is configured to facilitate movement of the cooling...
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7411791 |
Extendable heat dissipation apparatus
An extendable heat dissipation apparatus includes a base, an extendable heat dissipation member and a connecting element. A normal fin is formed on the base, and the connecting element integrates...
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7411290 |
Integrated circuit chip and method for cooling an integrated circuit chip
An integrated circuit chip is provided, the integrated circuit chip having: a base portion, the base portion having a peripheral wall forming an elevated perimeter depending away from a surface of...
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7382616 |
Cooling system for computer hardware
The present invention represents a significant advancement in the field of cooling systems for computer hardware. In one embodiment, a system for cooling a heat-generating electronic device is...
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7371965 |
Modular cage with heat sink for use with pluggable module
A heat sink and module cage assembly for receiving a pluggable electronics component, such as an opto-electronic transceiver module. The heat sink is attached to the module cage and includes a...
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7369410 |
Apparatuses for dissipating heat from semiconductor devices
An apparatus for providing two-phase heat transfer for semiconductor devices includes a vapor chamber configured to carry a cooling liquid, the vapor chamber having base section, and a plurality of...
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7362575 |
Cooling method use diamond pins and heat pipes
An apparatus for cooling a microprocessor includes a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal...
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7359195 |
Heatsink
Provided is a heatsink comprising: a plurality of sheet-shaped heat-dissipating plates stacked on one another, each heat dissipating plate including a heat-absorbing region that has a lower end...
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7352582 |
Reinforcing structure, display device, and electronic apparatus
To provide a display device with high reliability, which is capable of supporting a display panel well even when the display panel is enlarged, and capable of radiating the heat generated in the...
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7345878 |
Plasma display apparatus assembly
A plasma display apparatus assembly having high heat-dissipation efficiency is disclosed. In one embodiment, the plasma display apparatus assembly includes: i) a plasma display panel, ii) a chassis...
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7330353 |
Modular heat sink fin modules for CPU
A modular heat sink and semiconductor chip assembly includes a semiconductor chip, a base plate disposed in a heat conducting relationship with the semiconductor chip and containing a plurality of...
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7310233 |
Apparatus and method for transferring heat from an electrical module
An apparatus for transferring heat from an electrical module includes: (a) a thermally conductive base member having a plurality of edges establishing a polygonal perimeter and having a first side...
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