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9042100 System and method for cooling heat generating components  
An assembly for cooling heat generating components, such as power electronics, computer processors and other devices. Multiple components may be mounted to a support and cooled by a flow of...
9036349 Cooling device  
A cooling device for an electric energy supply (2) has at least one first heat-dissipating part (3). The power components (4) of the first heat-dissipating part are connected to the cooling device...
9029814 LED light source device  
An LED light source device capable of making the amount of light of an emitting region a predetermined amount of light or more and uniformizing the amount of light is provided. The LED light...
9030822 Power module cooling system  
A cooling system is operable to facilitate cooling a power module or other electronic assembly. The cooling system may be configured to facilitate cooling a DC/AC inverter or other electronic...
9030823 Heat dissipation system for power module  
Disclosed herein is a heat dissipation system for a power module, including: first cooling medium flow parts and second cooling medium flow parts allowing cooling media to flow in first and second...
9019704 Heat storage by phase-change material  
Methods and means related to rejecting heat through thermal storage are provided. A heat sink includes internal cavities containing a phase-change material. Heat from a thermal load is rejected by...
9013874 Heat dissipation device  
A heat dissipation device for an electronic device includes a base, a plurality of fins and at least one heat pipe. The base has a front surface and a rear surface opposite to the front surface. A...
9013877 Power semiconductor device  
The purpose of the present invention is to provide a power semiconductor device which has a light weight, high heat dissipation efficiency, and high rigidity. The power semiconductor device...
8995130 Power supply unit using housing in which printed circuit board is housed  
In a power supply unit, a printed circuit board is provided on which two or more different-shape components are mounted. Such components include semiconductor devices. The printed circuit board...
8995129 Heat radiator and manufacturing method thereof  
A back metal layer (16, 31) has a plurality of stress relaxation spaces (17). Each stress relaxation space (17) is formed to open at least at one of the front surface and the back surface of the...
8982558 Cooling device for a power module, and a related method thereof  
A cooling device for a power module having an electronic module disposed on a base plate via a substrate is disclosed. The cooling device includes a heat sink plate having at least one cooling...
8982552 System for providing physically separated compute and I/O resources in the datacenter to enable space and power savings  
An embodiment of a system and method disaggregate I/O resources from a server's compute resources, such as CPU and memory, by moving the server's local I/O devices to a remote location apart from...
8971041 Coldplate for use with an inverter in an electric vehicle (EV) or a hybrid-electric vehicle (HEV)  
A coldplate for use with an inverter in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The inverter includes a direct current (DC) link capacitor comprising multiple film capacitors...
8971038 Coldplate for use in an electric vehicle (EV) or a hybrid-electric vehicle (HEV)  
A coldplate for use with electronic components in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The coldplate includes a main portion having multiple raised features on a surface...
8964373 System for cooling buildings containing heat generating electronics  
A system for cooling portable facilities which include heat generating electronics, interior fans, a heat sink integrally serving as part of a wall or ceiling, and an outer heat pipe assembly in...
8958208 Semiconductor device  
A semiconductor device is disclosed that includes an insulation substrate, a metal wiring layer, a semiconductor element, a heat sink, and a stress relaxation member located between the insulation...
8953321 Cooling arrangement for small form factor desktop computer  
A small form factor desktop computing device having a suitable internal cooling arrangement is disclosed. The device can be formed of a single piece seamless housing machined from a single billet...
8953317 Wicking vapor-condenser facilitating immersion-cooling of electronic component(s)  
Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a...
8941995 Fixing bracket and electronic device using the same  
A fixing bracket includes a bracket body, at least one connecting rod assembly, and at least one elastic buckling arm. One side of the bracket body has a first pivoting point and a second pivoting...
8937810 Electronic assembly with detachable coolant manifold and coolant-cooled electronic module  
Cooled electronic assemblies, and a method of decoupling a cooled electronic assembly, are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more...
8934245 Heat conveying structure for electronic device  
A heat conveying structure for an electronic device according to the present invention includes: an evaporating section that has a chamber structure with first fins erected therein, is thermally...
8929073 Boiling refrigerant type cooling system  
A boiling refrigerant type cooling system to suppress overshoot upon start of heat generation and realize stable start of boiling. In the boiling refrigerant type cooling system, a metal boiling...
8922998 Coolant manifold with separately rotatable manifold section(s)  
A cooling apparatus is provided which includes one or more coolant-cooled structures attached to one or more electronic components, one or more coolant conduits, and one or more coolant manifolds....
8917508 Arrangement of a power semiconductor circuit  
The invention relates to a power electronic assembly (1, 2, 3) with a heat sink (2), a power semiconductor module (1) and a circuit arrangement (3) for controlling the power semiconductor module,...
8913391 Board-level heat transfer apparatus for communication platforms  
An apparatus, comprising a rack and a cooler. The apparatus also comprises a plurality of electronic circuit boards located in corresponding slots of the rack, each of the electronic circuit...
8902589 Semiconductor module and cooler  
A semiconductor module and a cooler capable of cooling a semiconductor element efficiently. The semiconductor module supplies a refrigerant to a water jacket configuring the cooler, to cool a...
8902582 Coldplate for use with a transformer in an electric vehicle (EV) or a hybrid-electric vehicle (HEV)  
A coldplate for use with a transformer in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The coldplate includes a main portion having a recess formed therein, the recess having a...
8897012 Electronic device and heat dissipation module thereof  
The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat...
8897011 Heat dissipation system for power module  
Disclosed herein is a heat dissipation system for a power module, the heat dissipation system including: first and second heat dissipation plates spaced apart from each other while facing each...
8897016 Heat removal in compact computing systems  
A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.
8897010 High performance liquid cooled heatsink for IGBT modules  
A heat sink assembly includes a base plate coupled to a first side of an electronic device. A plurality of fins extend from the base plate and are positioned within a housing. The housing includes...
8897013 Sealed battery charger housing  
A housing or other enclosure used to facilitate fluid cooling of a circuitry of a battery charger, such as but not limited to a battery charger of the type used to facilitate charging a high...
8889489 Metal injection molded heat dissipation device  
A heat dissipation device is provided. The heat dissipation device includes an integrated heat spreader and a base plate coupled to the integrated heat spreader, wherein the base plate comprises a...
8867210 Cooling apparatus for an electrical substrate  
A cooling apparatus is disclosed. The cooling apparatus comprises a first outer portion comprising a fluid inlet and a first exterior cooling surface. A first fluid-diverting structure is in fluid...
8867209 Two-phase, water-based immersion-cooling apparatus with passive deionization  
Cooling apparatuses, cooled electronic modules and methods of fabrication are provided for fluid immersion-cooling of an electronic component(s). The cooled electronic module includes a substrate...
8867205 Fluid cooling system and associated fitting assembly for electronic component  
A fluid cooling system and associated fitting assembly for an electronic component such as a multi-processor computer offer easy and reliable connect and disconnect operations while doing so in a...
8861202 Integrated thermal and structural management solution for Rechargeable Energy Storage System assembly  
A thermal management component for a Rechargeable Energy Storage Systems (RESS) assembly and a method of managing the temperature of a RESS battery module using the component are disclosed. The...
8861201 Electronic apparatus  
According to one embodiment, an electronic apparatus includes a housing, a first heating element in the housing, a heat sink in the housing, a first pressing member, a first heat pipe, and a...
8848372 Nanotube-based fluid interface material and approach  
A thermal interface material facilitates heat transfer between an integrated circuit device and a thermally conductive device. According to an example embodiment, a thermal interface material...
8837148 Device for supporting, housing and cooling radiant modules of an antenna, particularly array antenna  
The present invention relates to a device (1) for supporting, housing and cooling radiant modules (2) of an antenna, comprising a plate (3) for cooling said radiant modules (2) that can be fixed...
8830680 Systems and methods for heat extraction in a power supply  
Power supply and heat sink modules are suitable for use in sealed outdoor enclosures. Circuit elements in the power supply modules are connected to multiple heat sinks. The heat sinks are combined...
8830695 Encapsulated electronic device  
An electronic device includes a substrate (1), an electronic component (2) seated on the substrate (1), and a cover (3) across the electronic component (2) with a space (330) between the cover (3)...
8824147 Fluid-cooled electrical equipment, avionic rack to receive such equipment and aircraft equipped with such racks  
This invention relates to a fluid-cooled electronic equipment item, an avionic rack to receive such an equipment item and an aircraft equipped with such racks. The electronic equipment items are...
8820113 Cooling computing devices in a data center with ambient air cooled using heat from the computing devices  
To reduce power consumption and more efficiently cool computing devices in a data center, an air supply unit supplies air from outside the data center to an air handling unit, which cools servers...
8811015 Motor control device  
A motor controller comprising an inverter module including an inverter circuit coupled to a baseplate, wherein the baseplate includes cooling features; a cooling channel configured to receive a...
8807760 Light source apparatus and projector type image display apparatus  
The present invention is directed to provide a light source apparatus that includes space-saving LED cooling unit, and a projector type image display apparatus including the same. The light source...
8811016 Power converter device  
A power converter device is disclosed herein. The power converter device includes a printed wiring board assembly, a cold plate base and a shell plate assembly. The cold plate base is fastened...
8809697 Passive cooling and EMI shielding system  
An electronics enclosure is disclosed that provides passive cooling of electronic components while reducing electromagnetic interference (EMI) emissions. The electronics enclosure includes an...
8804337 Structural assembly for cold plate cooling  
A device including a structural member having a heat spreader and an electronic device mounted directly to a first surface of the heat spreader of the structural member. The device also includes a...
8797741 Maintaining thermal uniformity in micro-channel cold plates with two-phase flows  
A cold plate system including, in one embodiment, first and second flow paths extending from a common inlet to a common outlet, wherein the first and second flow paths enable two-phase coolant...