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7616444 |
Gimballed attachment for multiple heat exchangers
One or more heat exchangers are coupled to one or more heat sources using a single gimballed joining mechanism. The joining mechanism includes a gimbal plate and a gimbal joint. The gimbal joint...
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7602610 |
Electronic device
According to one embodiment, an electronic device is provided with a heat transfer unit and a pressing member. The heat transfer unit includes a heat receiving portion thermally connected to a heat...
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7595988 |
Thermal management system and method for electronic assemblies
According to an embodiment of the present invention, a thermal management system for an electronic assembly includes an electronic component coupled to a substrate, the substrate coupled to a...
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7593235 |
Thermal conduit
A thermal conduit to extract heat from an electrical component on a circuit board is disclosed. An electronic assembly according to aspects of the present invention includes an integrated circuit...
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7593230 |
Apparatus for absorbing and dissipating excess heat generated by a system
The invention relates to a heatsink. More particularly, the invention relates to a heatsink having tapered geometry that improves passive cooling efficiency. A tapered geometry between heatsink...
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7592695 |
Compound heat sink
A compound heat sink for the removal of thermal energy useful for, inter alia, electronic devices or other components. The compound heat sink includes a die cast base element; an extruded...
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7583504 |
Cooling assembly
A method and apparatus for cooling an electronic application having at least one heat-generating electronic component mounted on a circuit board. A heat transferring heat sink is attached to the...
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7570488 |
Alternator rectifier
An automotive alternator rectifier including a terminal connection portion configured by connecting a terminal leading out of first unidirectional conducting element bodies disposed on a surface of...
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7554804 |
Electronic module configured for air flow therethrough and system including same
An electronic module. The electronic module includes a chassis, a plurality of capacitors, a plurality of bus bars, and a heat sink. The chassis includes a first end and a second end. The first end...
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7551440 |
System and method for cooling an electronic component
A cooling system has at least one heat conducting element in thermal contact with an electronic component. A heat exchanger is in fluid communication with the heat conducting element. The heat...
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7551435 |
Heat-absorbing member, cooling device, and electronic apparatus
Electronic components differing in height (a CPU 2 a, a capacitor 2 b, and coil elements 2 c ) are mounted on a printed circuit board 1. A heat-absorbing member 3 is provided above the...
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7548420 |
Electrical drive unit
The present invention relates to an electrical drive unit comprising a circuit board, a plurality of components, attached to a first side of the circuit board, a heat sink, arranged on the first...
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7543457 |
Systems for integrated pump and reservoir
According to some embodiments, systems for an integrated pump and reservoir may be provided. In some embodiments, a pump may comprise a housing defining an inlet to accept a fluid and an outlet to...
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7542293 |
Thermal module
A thermal module includes a heat spreader ( 50 ) for contacting with a heat-generating electronic device mounted on a printed circuit board, a heat sink ( 60 ), a heat pipe ( 70 ) thermally...
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7529089 |
Heat-dissipating device connected in series to water-cooling circulation system
A heat-dissipating device includes a MOSFET heat dissipator, a south bridge heat dissipator, a north bridge heat dissipator and a water block connector. A heat pipe is provided between each heat...
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7525803 |
Power converter having multiple layer heat sinks
A power converter including a printed circuit board (PCB) having a plurality of heat conductive layers configured to sink heat generated by the power converter electronics. Each of these heat...
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7522422 |
Heat sink
A low-cost heat sink easy to assemble which is designed to be mounted on a power semiconductor module ( 5 ) through the medium of cooling water includes a base member ( 1 ), a heat sink body ( 2 )...
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7518871 |
Liquid-based cooling system for cooling a multi-component electronics system
A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when...
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7518870 |
Card slot apparatus having a movable heat radiating unit and electronic machine having the same
A card slot apparatus of a card and an electronic machine includes a slot body having a slot in which a card is inserted, and a heat radiating unit movable between a first position spaced apart...
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7515418 |
Adjustable height liquid cooler in liquid flow through plate
An arrangement having a cooling function is provided, comprising a circuit board, a plurality of heat generating devices attached to the circuit board, a cooling device thermally connected to one...
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7515416 |
Structures for holding cards incorporating electronic and/or micromachined components
This invention provides a structure for holding cards having electronic and/or micromachined components. A chassis comprises a plurality of bays for receiving cards such that the cards are oriented...
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7511960 |
Balanced chilled fluid cooling system for a data center in a shipping container
A movable data center is disclosed that comprises a movable enclosure having partitions that define a closed-loop air flow path. A plurality of fans and a plurality of data processing modules are...
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7508669 |
Cooling device for an electronic component, especially for a microprocessor
A cooling device ( 1 ) for an electronic component ( 3 ), especially for a microprocessor, includes a heat sink ( 7, 9 ), which can be connected to the electronic component ( 3 ) to be cooled, such...
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7508338 |
Antenna with compact LRU array
An element support and thermal control arrangement for an active array antenna, preferably modular, using line-replaceable units (LRUs), includes a radiating-side liquid-cooled cold plate lying...
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7501844 |
Liquid cooled DUT card interface for wafer sort probing
A water block heat dissipation on a probe card interface for cooling active components and other devices requiring heat dissipation on the probe card is presented.
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7499279 |
Cold plate stability
A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate....
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7495916 |
Low cost cold plate with film adhesive
An electronic assembly is constructed with an enclosed fluid-cooled cold plate. Pressurized cooling fluid is propelled through the cold plate to carry away heat from the electronic assembly. The...
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7486518 |
Cooling device and electronic apparatus
According to one embodiment, a cooling device includes: a heat transfer unit including a passage, through which a coolant circulates, a heat-receiving section, which is thermally connected to a...
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7486514 |
Cooling apparatus with discrete cold plates disposed between a module enclosure and electronics components to be cooled
Cooling apparatuses and methods are provided for cooling an assembly including a substrate supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates,...
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7477516 |
Air cooled computer chip
A cooling assembly includes a housing supporting a nozzle for directing cooling air over an electronic component. A casing rotatably supports a shaft, which in turn, supports a compressor, an...
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7477515 |
Electronic apparatus and thermal dissipating module thereof
A thermal dissipating module comprises a heat pipe with a first end and a second end, a first joint component connected to the first end, a second joint component connected to the second end, a...
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7475175 |
Multi-processor module
An apparatus comprises a plurality of logically independent processors, a system bus, and a cache control and bus bridge device in communication with the plurality of processors such that the cache...
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7471965 |
Mobile terminal having a heat releasing member
A mobile terminal is provided that may conduct heat generated from a print circuit board when a mobile terminal is in operation to a wider area by use of a heat releasing member having excellent...
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7468886 |
Method and structure to improve thermal dissipation from semiconductor devices
A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second...
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7457118 |
Method and apparatus for dispersing heat from high-power electronic devices
A heat dissipation apparatus includes a heat absorption device coupled to a board, the heat absorption device configured to absorb heat generated by an electrical device mounted on the board, a...
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7455103 |
Electronic equipment provided with cooling system
An electronic equipment is provided, which comprises a liquid-cooling system and a cooling fan as a cooling system, efficiently cools the liquid-cooling system, and reduces fan noise. The...
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7440261 |
Power regulator with a bypass and splice capability
A power regulator with a bypass and splice capacity includes at least one phase member and a driver. Each one of the at least one phase member includes two cooling fins, two SCR thyristors, a...
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7433193 |
Techniques for controlling a position of a transceiver module relative to a connector
An improved rail includes two side portions, and a mid portion interconnected between the two side portions. The mid portion and the two side portions form a component that defines three sides of a...
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7430121 |
Heat sink fastener
A heat sink fastener includes a main body, a piercing body and an operating member. The main body has a pressing part for pressing a heat sink toward a heat-generating component. An engaging part...
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7430119 |
Impeller and aligned cold plate
According to some embodiments, an apparatus may comprise a cold plate comprising a plurality of fins and an impeller comprising a plurality of blades. An output fluid velocity angle defined by the...
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7417857 |
Power-electronic-cooling device
A device which is used to cool the power electronics of a vehicle, by circulating a liquid through a cooling circuit which is mounted under a plate bearing the power electronics. According to the...
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7414845 |
Circuit board assembly for a liquid submersion cooled electronic device
A circuit board assembly, for example, a computer motherboard, for use in a liquid submersion cooled electronic device, for example, a computer, is configured to facilitate movement of the cooling...
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7414844 |
Liquid cooled heat sink with cold plate retention mechanism
A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in...
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7411790 |
Heat sink with built-in heat pipes for semiconductor packages
A heat sink with a built-in heat pipe for semiconductor package is disclosed. At least a built-in heat pipe is disposed in a cavity of a metal vessel and sealed by a metal cover. The built-in heat...
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7408776 |
Conductive heat transport cooling system and method for a multi-component electronics system
A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based...
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7405936 |
Hybrid cooling system for a multi-component electronics system
A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least...
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7400507 |
Fastening structure
A fastening structure for securing a heatsink module is provided. The structure includes at least a first fastening piece attached to the circuit board and having a first fastening member, a heat...
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7400505 |
Hybrid cooling system and method for a multi-component electronics system
A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least...
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7400504 |
Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled
Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple...
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7400503 |
Systems for low cost coaxial liquid cooling
According to some embodiments, systems for low cost coaxial liquid cooling may be provided. In some embodiments, a system may comprise an axis. The system may further comprise a heat exchanger...
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