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7619890 |
Heat dissipation module
A heat dissipation module includes a heat dissipation device, a resilient bracket and a cylindrically shaped nut. The heat dissipation device is attached to a heat generating component. The...
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7619889 |
Controllable heat transfer medium system and method for use with a circuit board
A system and method are provided for controlling a transfer of heat between circuit board components. Included is a circuit board with components mounted thereon. Also provided is a controllable...
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7619888 |
Flat heat column and heat dissipating apparatus thereof
A heat dissipating module includes a heat dissipating apparatus and a fan. The fan is disposed adjacent to a side of the heat dissipating apparatus. A heat dissipating apparatus includes a flat...
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7616444 |
Gimballed attachment for multiple heat exchangers
One or more heat exchangers are coupled to one or more heat sources using a single gimballed joining mechanism. The joining mechanism includes a gimbal plate and a gimbal joint. The gimbal joint...
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7613004 |
Heat sink with heat dissipating fins and method of manufacturing heat sink
A heat sink comprising: a heat dissipating portion comprising a plurality of metal fins each having a heat receiving portion and a heat dissipating portion having elasticity; a fin fixing member to...
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7613002 |
Heat dissipation device
A heat dissipation device for a hard disk drive includes a first heat sink and a control circuit. The first heat sink includes an input interface, a counter unit, a controller unit, and an output...
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7613001 |
Heat dissipation device with heat pipe
A heat dissipation device is used for removing heat from at least two adjacent first and second electronic devices in a computer enclosure. The heat dissipation device includes a first heat sink...
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7610948 |
Cooler module
A non-welding cooler module includes a heat sink formed of a stack of radiation fins, a base block tightly fitted into the bottom side of the heat sink, heat pipes tightly inserted through the...
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7609521 |
Heat dissipation device with a heat pipe
A heat dissipation device includes a fin assembly, a base, a heat pipe soldered with the base, and a heat spreader sandwiched between the heat pipe and the fin assembly. The fin assembly has a...
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7609520 |
Heat spreader with vapor chamber defined therein
A heat spreader includes a bottom wall ( 12 ) and a cover ( 14 ) hermetically connected to the bottom wall. Cooperatively the bottom wall and the cover define a space ( 11 ) therebetween for...
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7609519 |
Coolant control unit and cooled electronics system employing the same
A coolant control unit for a liquid cooled electronics system is provided, which includes an external coolant inlet and outlet for receiving and returning external coolant; an internal coolant loop...
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7606031 |
Heat dissipating device
A heat dissipating device includes a circuit board ( 23 ), an electronic component ( 24 ) being arranged on the circuit board, a base ( 211 ) being thermally attached to the electronic component,...
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7606030 |
Heat dissipation device
A heat dissipation device includes a spreader, a heat sink comprising a base plate and a plurality of outer fins extending upwardly from a top surface of the base plate, a heat pipe thermally...
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7606029 |
Thermal management system for distributed heat sources
A thermal management system ( 201 ) is provided herein which comprises a plurality of heat sources ( 203 ), a heat exchanger ( 205 ), a plurality of heat pipes ( 207 ) in thermal communication with...
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7604325 |
Inkjet printhead with reciprocating actuator
An inkjet printhead integrated circuit includes a substrate defining an ink supply channel. An ink chamber structure is arranged on the substrate to define an ink chamber into which ink from the...
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7604040 |
Integrated liquid cooled heat sink for electronic components
A fluid heat exchanger unit cools an electronic device with a cooling fluid supplied to an upper portion of a cooling housing. A refrigerant is disposed in a lower portion of the cooling housing...
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7602618 |
Methods and apparatuses for transferring heat from stacked microfeature devices
Apparatuses for transferring heat from stacked microfeature devices are disclosed herein. In one embodiment, a microfeature device assembly comprises a support member having terminals and a first...
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7602608 |
Narrow gap spray cooling in a globally cooled enclosure
Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and...
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7600558 |
Cooler
A cooler comprises a base, a set of radiator fins and a plurality of heat pipes going through the base and the radiator fins. The lower surface of the base is further provided with a recess wherein...
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7599185 |
Cooling device
A cooling device for dissipating heat generated by an electronic element includes a fixing seat, a cooling body, and a vapor chamber. The fixing seat is arranged an opening. The cooling body...
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7597134 |
Heat dissipation device with a heat pipe
A heat dissipation device comprises at least two heat pipes ( 10 ) and a plurality of fins ( 20 ) thermally connected with the heat pipes ( 10 ). Each of the heat pipes ( 10 ) comprises a flattened...
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7595992 |
Substrate unit, cooling device, and electronic device
According to one embodiment, a substrate unit of the present invention comprises a first substrate, a second substrate and a coupling member. The first substrate has a first substrate main body and...
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7595989 |
Heat dissipation device
A heat dissipation device includes a base, a first heat sink located on the base, a second heat sink located on the first heat sink, and a heat pipe contacting with the base and the first and...
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7595988 |
Thermal management system and method for electronic assemblies
According to an embodiment of the present invention, a thermal management system for an electronic assembly includes an electronic component coupled to a substrate, the substrate coupled to a...
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7593232 |
Electronic apparatus and circuit board unit
An electronic apparatus is provided with a housing, a circuit board section and a heat transfer member. The circuit board section is accommodated in the housing. The circuit board section includes...
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7589972 |
Electrical connector with clip mechanism
An electrical connector assembly ( 100 ) made in accordance with a preferable embodiment of the present invention comprises an electrical socket ( 20 ) with a plurality of contacts received...
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7583506 |
Multi operational system apparatus and method
An apparatus may have a multilayered support base having a structural section made up of operating components and a function support section. The function support section may have transmission...
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7580262 |
Heat dissipation assembly for graphics card and blade server using the same
A heat dissipation assembly mounted to a main board in a blade server includes a graphics card, a heat sink, and a thermal board. The graphics card includes a GPU and a plurality of first graphics...
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7576986 |
Thermal dissipating device
An exemplary thermal dissipating device is for cooling an electronic component of a circuit board. The thermal dissipating device includes a heat conductive plate with a first side and a second...
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7573714 |
Method and apparatus for dissipating heat in a computer system
A cooling system for a computer is provided. In one implementation, the cooling system includes a heat spreader that is in thermal contact with a heat generating component in the computer, a frame...
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7570492 |
Apparatus for venting an electronic control module
An electronic control module comprising a vent assembly is provided. The electronic control module comprises a housing having a first aperture and a substrate disposed within the housing. The...
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7568517 |
Thermal module
A thermal module ( 10 ) for dissipating heat from a heat-generating electronic component ( 20 ) includes a base plate ( 11 ), a heat-dissipating fan ( 16 ) mounted to one side of the base plate, at...
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7564686 |
Heat-dissipating module
A heat-dissipating module dissipating heat generated by a heat-generating element includes a plurality of fins, a fan generating an air current and a heat pipe. Each fin has a first edge facing the...
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7561426 |
Display module
Provided is a display module having an improved heatsink. The display module includes a display panel adapted to display an image, a chassis adapted to support the display panel, a driver circuit...
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7561425 |
Encapsulated multi-phase electronics heat-sink
An apparatus and method for cooling electronics is disclosed. An encapsulated inert non-conductive fluid is used to transfer heat directly from an electrical circuit including a die on a substrate...
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7561424 |
Method for cooling electronic components in an unmanned flying vehicle and a device for carrying out the method
A device for cooling electronic components of a control unit in an unmanned flying vehicle. A container contains a liquid cooling medium. A temperature sensor is adapted to sense the temperature of...
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7558065 |
Air guide with heat pipe and heat sink and electronic apparatus equipped with the same
The invention discloses an air guide with at least one heat sink and at least one heat pipe. The heat pipe of the air guide can conduct the heat generated by a heat source to the heat sink of the...
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7556089 |
Liquid cooled thermosiphon with condenser coil running in and out of liquid refrigerant
The invention provides a fluid heat exchange assembly comprising a housing containing a liquid refrigerant presenting a surface. A tube is coiled in adjacent coils around an axis parallel to the...
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7556086 |
Orientation-independent thermosyphon heat spreader
Device for enhancing cooling of electronic circuit components that is substantially or fully independent of orientation. A thin profile thermosyphon heat spreader mounted to an electronics package...
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7551444 |
Method and computer system with anti-tamper capability and thermal packaging structure for implementing enhanced heat removal from processor circuitry
A method and computer processor system with anti-tamper capability and thermal packaging structure for implementing enhanced heat removal from processor circuitry, such as, a high-performance cell...
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7551443 |
Heat-dissipating module connecting to a plurality of heat-generating components and related device thereof
A heat-dissipating module includes a heat pipe and a heat-dissipating device. The heat pipe has a first end, a second end and a partition pipe section. The first end is connected to a first...
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7551442 |
Embedded heat pipe in a hybrid cooling system
One embodiment of a system for cooling a heat-generating device includes a base adapted to be coupled to the heat-generating device, a housing coupled to the base, a liquid channel formed between...
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7548428 |
Computer device heat dissipation system
A computer device heat dissipation system comprising a heat exchanger having a plurality of fins connected to a heat pipe, at least one of the plurality of fins comprises at least one aperture to...
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7548427 |
Apparatus and docking station for cooling of computing devices
An apparatus with some embodiments is described having cooling capabilities for a computing device. In some embodiments, the apparatus may include a thermoelectric component (TEC) to transfer...
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7548426 |
Heat dissipation device with heat pipes
A heat dissipation device includes a base ( 14 ) for absorbing heat from an electronic device and a plurality of fins ( 20 ) arranged on the base. A heat pipe ( 32 ) thermally contacts the fins and...
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7548424 |
Distributed transmit/receive integrated microwave module chip level cooling system
A radar transmit and receive integrated microwave module with conductively cooled condenser side rails and one or more vacuum brazed fluid distribution manifold cold plates in fluid communication...
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7545646 |
Cooling assembly
A cooling assembly and method of cooling a heat-generating electronic component on a circuit board. A heat collector collects heat from the electronic component. A heat pipe transfers the heat to a...
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7545645 |
Heat dissipation device
A heat dissipation device includes a heat spreader ( 20 ), a heat pipe ( 30 ), a heat sink ( 40 ) and a cooling fan ( 50 ) for generating forced airflow to the heat sink. The heat pipe has an...
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7545644 |
Nano-patch thermal management devices, methods, & systems
Nano-scale thermal management devices, methods, and systems are provided. According to some embodiments, a thermal management device configured to remove heat from a heated area can comprise an...
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7545630 |
Method and apparatus for thermal dissipation
A thermal dissipation apparatus includes a thermal transfer device including a heat pipe member. A temperature sensitive material is coupled to the heat pipe member and is operable to provide a...
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