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9042097 Two-phase electronic component cooling arrangement  
An electronic component assembly includes a housing that provides a cavity filled with a cooling fluid that has a liquid phase and a vapor phase. An electronic element is arranged in the cavity...
9042099 Air-cooling and vapor-condensing door assembly  
A method is provided which includes providing a cooling apparatus which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly...
9042098 Air-cooling and vapor-condensing door assembly  
A cooling apparatus for an electronics rack is provided which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an...
9033028 Heat dissipation module  
A heat dissipation module includes a centrifugal fan and a heat pipe. The centrifugal fan includes an outer housing, a heat dissipation fin array, a retaining wall, an impeller and a...
9025330 Recirculating gas rack cooling architecture  
A cabinet for housing and cooling electronic components with internally circulating air that is cooled at each of a plurality of equipment shelves.
9025332 Inlet-air-cooling door assembly for an electronics rack  
A method is provided which includes providing a cooling apparatus for an electronics rack which includes a door assembly configured to couple to an air inlet side of the electronics rack. The door...
9025331 Inlet-air-cooling door assembly for an electronics rack  
A cooling apparatus for an electronics rack is provided which includes a door assembly configured to couple to an air inlet side of the electronics rack. The door assembly includes: one or more...
9019704 Heat storage by phase-change material  
Methods and means related to rejecting heat through thermal storage are provided. A heat sink includes internal cavities containing a phase-change material. Heat from a thermal load is rejected by...
9013874 Heat dissipation device  
A heat dissipation device for an electronic device includes a base, a plurality of fins and at least one heat pipe. The base has a front surface and a rear surface opposite to the front surface. A...
9013875 Electronic device  
An electronic device includes a housing, a heat source located in a casing, and a heat dissipation device disposed in a casing. The heat dissipation device is kept apart from the heat source. The...
9013876 Electronic device  
An electronic device includes a housing, a heat source in the housing, and a heat dissipation device in the housing and separated from the heat source by a distance. The heat dissipation device...
9007769 Electronic device  
An electronic device includes a housing, a heat source located inside a casing, and a heat dissipation device disposed inside a casing. The heat dissipation device is in thermal contact with the...
9007768 System for thermally controlling an apparatus  
A system for cooling items of equipment likely to give off energy, comprises: an enclosure comprising a membrane that is porous to water vapor and sealed to liquid water, said membrane separating...
9007770 Electronic device  
An electronic device includes a housing, a heat source located in the housing, and a heat dissipation device disposed in the housing. The heat dissipation device thermally contacts the heat...
8988880 Heat transfer assembly with heat pipe brace and method for assembling a heat transfer assembly  
An electronics device and method for assembling a heat transfer assembly of the same. An electronics device includes a circuit board, a chassis that houses the circuit board, a heat pipe...
8982560 Thermal management of an electronic device  
A system for thermal energy storage is disclosed herein. The system includes an electronic device and a docking station to receive the electronic device. The electronic device contains a device...
8982559 Heat sink, cooling module and coolable electronic board  
A heatsink is provided with a base body opposed to a heat generating body and absorbing heat from the heat generating body. Thermal resistance of that opposed portion of the base body which is...
8978739 Heat dissipating device  
A heat dissipating device for dissipating heat from a heat radiation element includes a base, a fixing frame, a fan, and a securing arm. The fixing frame is fixedly attached to the base, and the...
8976526 Providing a cooling system for a medium voltage drive system  
In an embodiment, a medium voltage drive system includes a transformer, multiple power cubes each coupled to the transformer, and a manifold assembly. Each power cube includes cold plates each...
8975838 Electric motor braking using thermoelectric cooling  
An electric motor controller includes controller electronics configured to control an electric motor. The electric motor controller also includes a thermoelectric cooler in thermal communication...
8976528 Fasteners and dual-thickness thermal stages in electronic devices  
The disclosed embodiments provide a system that facilitates heat transfer in an electronic device. The system includes a heat pipe configured to conduct heat away from a heat-generating component...
8964390 Sectioned manifolds facilitating pumped immersion-cooling of electronic components  
Cooling apparatuses and methods are provided for facilitating pumped immersion-cooling of electronic components. The cooling apparatus includes a housing forming a compartment about one or more...
8964391 Sectioned manifolds facilitating pumped immersion-cooling of electronic components  
Cooling methods are provided for facilitating pumped immersion-cooling of electronic components. The cooling method includes: providing a housing forming a compartment about one or more...
8953321 Cooling arrangement for small form factor desktop computer  
A small form factor desktop computing device having a suitable internal cooling arrangement is disclosed. The device can be formed of a single piece seamless housing machined from a single billet...
8953317 Wicking vapor-condenser facilitating immersion-cooling of electronic component(s)  
Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a...
8953320 Coolant drip facilitating partial immersion-cooling of electronic components  
Cooling apparatus and methods are provided for partial immersion-cooling of multiple electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a...
8953318 Passive cooling systems and methods for electronics  
Embodiments of the present disclosure generally pertain to passive cooling systems and methods for electronics. An exemplary passive cooling system for electronics has a circuit package and...
8953319 Heat-dissipating module  
A heat-dissipating module applied to a circuit board having an electronic element is disclosed. The heat-dissipating module includes a plurality of connecting portions, a contacting portion and a...
8944150 Dissipation utilizing flow of refrigerant  
A heat dissipating device includes a chamber with an evaporation portion and a condensation portion, the chamber including a refrigerant. The chamber further includes an evaporation portion...
8941986 Computer system  
A computer system includes a computer case, an enclosure, and a heat dissipating device. The computer case includes a rear plate with a plurality of ventilation holes. The enclosure includes a...
8937806 Flow diversion apparatuses and methods  
Flow diversion apparatuses and methods are provided. A flow diversion apparatus can include a vent configured to permit the flow of a fluid therethrough. The apparatus can also include an...
8934235 Heat transfer device with phase change material  
A heat transfer device is described. In one or more implementations, a heat transfer device includes a heat sink and a thermal storage enclosure disposed proximal to at least a portion of the heat...
8934245 Heat conveying structure for electronic device  
A heat conveying structure for an electronic device according to the present invention includes: an evaporating section that has a chamber structure with first fins erected therein, is thermally...
8933860 Active cooling of high speed seeker missile domes and radomes  
A thermal management system and method for active cooling of high speed seeker missile domes or radomes comprising bonding to an IR dome or RF radome a heat pipe system having effective thermal...
8929073 Boiling refrigerant type cooling system  
A boiling refrigerant type cooling system to suppress overshoot upon start of heat generation and realize stable start of boiling. In the boiling refrigerant type cooling system, a metal boiling...
8929074 Electronic device assemblies and vehicles employing dual phase change materials  
Electronic device assemblies employing dual phase change materials and vehicles incorporating the same are disclosed. In one embodiment, an electronic device assembly includes a semiconductor...
8929072 Heat dissipating module  
A heat dissipation module, comprising: a fan; and a heat dissipating fin; a heat conducting element, made of a conductive material, and composed of a first conductive component and two second...
8929069 Electric vehicle charging system with robustness features and universal port  
An electric vehicle supply equipment may include a first cover element including a well portion to accommodate a first circuitry, wherein the first circuitry includes a chimney stack that couples...
8921702 Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments  
In one possible implementation, a thermal plane structure includes a non-wicking structural microtruss between opposing surfaces of a multilayer structure and a thermal transport medium within the...
8917507 Cooling device, electronic substrate and electronic device  
A cooling device is provided. The cooling device is equipped with an electronic substrate on which a heating element has been mounted, and comprises a thermal diffusion unit of a plate-like shape....
8917510 Reversibly adhesive thermal interface material  
The present invention is directed to a reversibly adhesive thermal interface material for electronic components and methods of making and using the same. More particularly, embodiments of the...
8913391 Board-level heat transfer apparatus for communication platforms  
An apparatus, comprising a rack and a cooler. The apparatus also comprises a plurality of electronic circuit boards located in corresponding slots of the rack, each of the electronic circuit...
8913384 Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s)  
Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking...
8913386 Cooling module for cooling electronic components  
A cooling module including a condenser, a power module including the cooling module and a method for cooling electric and/or electronic components are provided. The condenser of the cooling module...
8908373 Cooling structure for an electronic component and electronic instrument  
A metal plate that forms a heat-absorbing surface has a center portion which protrudes so as to correspond to the size of a semiconductor element. A fixing support point of a plate spring is...
8908375 Cooler of power converting device for railroad vehicle  
A cooler of a power converting device for a railroad vehicle has heat exchanger tubes or heat radiator fins disposed to enhance the cooling performance of semiconductor devices arranged on an...
8902581 Electronic device  
A notebook computer is provided with: a casing in which electronic components including a CPU are accommodated; and a heat-dissipating unit including a heat-dissipating component 37 having plural...
8897012 Electronic device and heat dissipation module thereof  
The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat...
8889489 Metal injection molded heat dissipation device  
A heat dissipation device is provided. The heat dissipation device includes an integrated heat spreader and a base plate coupled to the integrated heat spreader, wherein the base plate comprises a...
8881793 Heat pipe assembly  
A heat pipe mounting method and a heat pipe assembly thereof are disclosed. The method includes the step of providing a heat-transfer block and a plurality of heat pipes. A plurality of heat pipe...