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7152667 |
Tower type finned heat pipe type heat sink
A heat sink comprises: a base portion having one face to be contacted by an exothermic member; a heat pipe erected on the other face of the base portion; and a plurality of fins mounted on the...
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7150312 |
Stacked low profile cooling system and method for making same
A stacked array of low profile heat pipes each with a plurality of micro tubes extended therethrough. The stacked low profile heat pipes are placed into thermal connection with heat producing...
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7151668 |
Memory heat sink
An apparatus is provided for dissipating heat from a semiconductor device that meets dimensional requirements for the semiconductor device and provides enhanced cooling for the semiconductor...
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7149086 |
Systems to cool multiple electrical components
According to some embodiments, a cooling device may comprise first and second contact surfaces to transfer heat to a cooling medium. The cooling device may further comprise, in some embodiments, a...
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7149083 |
Heat dissipation structure
A heat dissipation structure installed on a computer central processing unit or a heat generating device, has a thermal conductive base, at least one heat pipe and a heat sink. The thermal...
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7147043 |
Integratied liquid cooling system for electrical components
A liquid cooling system includes a cooling body ( 1 ) defining an hollow portion receiving a pump ( 3 ) and a number of cooling fins ( 18 ) therein, and a contact portion for contacting an...
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7143819 |
Heat sink with angled heat pipe
A heat sink comprises a base having a substantially flat region for interfacing with an electronic component, and at least one heat pipe having a first region substantially parallel to the flat...
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7145775 |
Chassis conducted cooling thermal dissipation apparatus for servers
A thermal dissipation apparatus for implementing chassis conducted cooling for a server. The apparatus includes a heat sink having a first surface and a second surface. The first surface is adapted...
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7142424 |
Heat exchanger including flow straightening fins
A heat exchanger includes a tube, and a plurality of fins coupled to the tube having a curved fan-stator shape that facilitates straightening of airflow from a fan.
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7142422 |
Heat dissipation device
A heat dissipation device includes a mounting plate ( 21 ) for mounting the heat dissipation device to a circuit board ( 3 ) on which a CPU ( 4 ) and a plurality of capacitors ( 31 ) are mounted, a...
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7140422 |
Heat sink with heat pipe in direct contact with component
A heat sink includes a heat pipe and a base adapted to allow the heat pipe to directly contact a component. By directly contacting the component, thermal efficiency is increased. Furthermore,...
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7140197 |
Means and apparatus for microrefrigeration
An integrated, self-contained microrefrigeration apparatus, in a dimension small enough to fit inside small appliances, such as electronic cases and portable equipment is described. The...
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7140423 |
Finned heat dissipation module having flow guide
A heat dissipation module includes an airflow generation device that generates airflow into an air channel in which a fin module is received and fixed. The fin module includes a plurality of fin...
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7139172 |
Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density...
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7134485 |
Wick structure of heat pipe
A composite wick structure of a heat pipe which is applied with a tube circumferential surface contacted to a heat source includes a plurality of grooves and a sintered-powder layer. The circular...
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7131487 |
Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers
An apparatus for cooling heat producing devices is disclosed. In one embodiment, the apparatus includes a heat absorber attached to a first end of a base. Both the base and the heat absorber may be...
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7131486 |
Electroosmotic microchannel cooling system
Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the...
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7130193 |
Cabinet having heat radiation function and heat radiation member
The invention relates to a heat radiation member and a cabinet to be installed outdoors in a hermetic state, having a heat radiation function for heat radiation of devices contained therein. The...
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7130192 |
Heat dissipating device
A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a heat sink ( 10 ) and a fan ( 30 ) generating airflow. The heat sink has a base...
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7129731 |
Heat pipe with chilled liquid condenser system for burn-in testing
A burn-in testing cooling system includes a heat pipe having a tubular body. A capillary wick is disposed on an evaporator portion of the tubular body, and a base seals off the evaporator portion....
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7128131 |
Heat sink for electronic devices and heat dissipating method
A heat sink according to the present invention is configured to comprise:
a plurality of heat dissipating fins having at least bottom portions which form a heat receiving surface thermally...
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7128135 |
Cooling device using multiple fans and heat sinks
The present invention is directed to a method of constructing a semiconductor chip cooling device consists of multiple fans and heat sinks to provide redundant cooling capability. Heat coming from...
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7124806 |
Heat sink for enhanced heat dissipation
A heat sink assembly includes a block formed of a thermally conductive material. For example, the thermally conductive material includes thermally conductive polymer. A heat conduit (e.g., a heat...
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7126822 |
Electronic packages, assemblies, and systems with fluid cooling
To accommodate high power densities associated with high-performance integrated circuits, an integrated circuit (IC) package includes a heat-dissipating structure in which heat is dissipated from a...
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7121333 |
Radiator sheet
The present invention relates to a radiator sheet improvement and more particularly to a structure with enhanced strength and increased heat exchange surface after assembling, which is achieved...
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7121327 |
Heat sink assembly
A heat sink assembly includes a plurality of fins ( 10 ), a pair of ducts ( 20 ), and a frame ( 30 ) receiving the fins and the ducts therein. Each fin defines a pair of through holes ( 11 )...
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7123479 |
Enhanced flow channel for component cooling in computer systems
An evaporator having an enhanced flow channel design for use in a computer system is described. Specifically, micro-channels of the evaporator comprise nucleation sites and different channel...
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7120022 |
Loop thermosyphon with wicking structure and semiconductor die as evaporator
A loop thermosyphon system has a semiconductor die with a plurality of microchannels. A condenser is in fluid communication with the microchannels. A wicking structure wicks fluid between the...
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7110260 |
Method and apparatus for cooling heat-generating structure
An apparatus includes a heat receiving portion which receives heat within a footprint from a heat generating structure, and a cooling arrangement which causes flow of a coolant that absorbs heat at...
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7108056 |
Slit-type restrictor for controlling flow delivery to electrohydrodynamic thin film evaporator
Cooling means for a heated surface comprising an enclosure for enclosing the heated surface and two oppositely charged interleaved radial arrays of microelectrodes positioned on the surface within...
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7110259 |
Heat dissipating device incorporating heat pipe
A heat dissipating device incorporating heat pipes includes a heat sink ( 10 ), a first heat pipe ( 50 ) and a second heat pipe ( 70 ). The heat sink has a first base ( 11 ), a second base ( 21 )...
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7106589 |
Heat sink, assembly, and method of making
A heat sink, method of making a heat sink, and a heat sink assembly. The heat sink includes a base and a plurality of heat pipes that extend from the base. The base is dimensioned and shaped to...
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7106588 |
Power electronic system with passive cooling
The present invention relates to an apparatus and method for dissipating heat from high-power electronic devices. The assembly includes a high-current substrate, such as a printed circuit board...
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7100680 |
Integrated circuit heat pipe heat spreader with through mounting holes
The apparatus is a heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which...
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7093648 |
Heat pipe cooling device and method for manufacturing the same
A heat pipe cooling device includes a heat conductor base, heat pipes and a cooling body. The heat conductor base further includes a base with multiple trenches and an upper cover. The heat pipes...
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7086458 |
Heat sink structure with flexible heat dissipation pad
A heat sink module includes a heat dissipation pad. The heat dissipation pad is flexible and has a cambered shape, and is pressed to become a flat plate when disposed between the heat sink module...
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7082031 |
Heatsink device and method
A method and device for thermal conduction is provided. Devices and methods are shown that include the ability to dissipate increased amounts of heat due to the use of an active heat transfer...
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7079394 |
Compact cooling device
A cooling device for a chip in a portable computer that uses a horizontal flat fan in the corner of a portable computer housing with air outlets through heatsinks that enhance exhaust air flow over...
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7072181 |
Heat dissipating device and electronic apparatus including the same
A heat dissipating device includes a heat receiving unit having a heat receiving surface thermally connected to a heat generating object and a heat dissipating surface in an opposite to the...
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7066240 |
Integrated circuit heat pipe heat spreader with through mounting holes
The apparatus is a heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which...
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7068509 |
Small form factor cooling system
An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the...
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7063129 |
Heat transport device and electronic apparatus
A heat transport device has an evaporator and a condenser connected through a vapor phase channel and a liquid phase channel and has wicks of the condenser arranged symmetrically around an axis...
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7061763 |
Cabinet cooling
A novel electronics cooling method and system is disclosed. A very flexible and efficient operation of an electronics cooling system ( 10 ) is achieved by controlling circulation of a cooling...
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7059391 |
Multiple evaporator heat pipe assisted heat sink
A heat sink includes a base plate which is fitted against a component to be cooled, and a heat pipe formed as a loop having a condenser portion upstanding from the base plate and a pair of ends...
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7057895 |
Thermal standoff for close proximity thermal management
A thermal management system is described for cooling an electronic component mounted on a printed circuit board. The thermal management system includes a heat sink coupled to an electronic...
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7055581 |
Impeller driven active heat sink
A heat transfer apparatus includes a heat source having a heat source maximum operating temperature; and a heat sink comprising a closed chamber having a chamber first end wall, a chamber second...
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7051794 |
Vapor-liquid separating type heat pipe device
A vapor-liquid separating type heat pipe device includes a heat sink member mountable on a heat source, tubular outer and inner bodies, a heat transfer fluid, a top vapor passage, and a bottom...
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7051793 |
Cooler for electrical components
The invention relates to a novel design of a cooler in the form of a heat pipe, with a housing in which an interior space closed to the outside is formed to hold a liquid, vaporizable coolant or...
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7048039 |
CTE-matched heat pipe
A heat pipe having a mounting surface with a coefficient of thermal expansion matching that of silicon is disclosed, the heat pipe including a base containing aluminum nitride, a metal body, and a...
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7048038 |
Increased thermal capability of portable electronic device in stationary or docked mode
A technique for increasing the thermal capability of a portable electronic device includes transferring dissipated heat from a heat source disposed within the portable electronic device to at least...
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