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7304846 |
Heatsink device of video graphics array and chipset
Disclosed is a heatsink device of video graphics array (VGA) and chipset. The main characteristic is making an integrated design for heatsink devices. Using a heatsink plate stacks on VGA and...
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7304847 |
Heat sink
A heat sink includes a plurality of fins parallel to each other, and one heat pipe extending through these fins. A flow channel is formed between each pair of neighboring fins for channeling an...
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7299859 |
Temperature control of thermooptic devices
A low power or passive optical apparatus provides temperature control of dynamic thermooptic devices and temperature-sensitive optical devices formed on the same substrate. The optical apparatus...
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7295441 |
Heat dissipating type printed circuit board and structure thereof for conducting heat with heap pipe
A heat dissipating type printed circuit board and its structure for conducting heat with a heat pipe include a substrate, a signal circuit disposed on a surface of the substrate and electrically...
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7295437 |
Heat dissipation device for multiple heat-generating components
A heat dissipation device includes a first heat sink ( 10 ), a second heat sink ( 20 ) and four heat pipes ( 30 ) thermally connecting the first heat sink and second heat sink. The first heat sink...
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7292439 |
Thermal management system and method for electronic assemblies
According to an embodiment of the present invention, a thermal management system for an electronic assembly includes an electronic component coupled to a substrate, the substrate coupled to a...
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7286346 |
Peripheral device and electronic device
A peripheral device is detachably connected to a host device and includes: an electronic component that generates heat; an electrical connector for electrically connecting the electronic component...
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7286357 |
Computer system with cooling device for CPU
A computer system includes a casing, a motherboard, a CPU mounted on the motherboard and a cooling device. The casing includes a pair of parallel panels. Air inlets and air outlets are respectively...
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7283360 |
Enhanced flow channel for component cooling in computer systems
An evaporator having an enhanced flow channel design for use in a computer system is described. Specifically, micro-channels of the evaporator comprise nucleation sites and different channel...
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7278469 |
Thin sheet type heat pipe
The present invention has proposed a thin sheet type heat pipe comprising: a hermetically sealed container which is formed of foil sheets opposed and jointed at peripheral portions; at least one...
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7277281 |
Heat dissipation device having wire fixture
A heat dissipation device is for use in a computer enclosure, the computer enclosure having a group of wires ( 20 ) therein. The heat dissipation device includes a heat sink assembly. A wire...
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7277285 |
Heat dissipation module
The invention discloses a heat dissipation module. The heat dissipation module includes two separate cases and a porous structure. The cases are U-shaped and correspondingly connect to each other...
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7277295 |
Industrial ethernet switch
According to one embodiment of the invention, an apparatus includes a housing having a front side and a bottom side adjacent the front side. The apparatus also includes a plurality of light...
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7277286 |
Computers
Provided is a computer. The computer includes: a plurality of parts including heat-generating components that generate heat during operation; a case in which the parts are installed; and one or...
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7277291 |
Thermal transfer device
A thermal conducting device removes heat from a power dissipating device installed within a case, and includes a base coupled to the power dissipating device and a translational portion that is...
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7277287 |
Heat dissipation device with heat pipes
A heat dissipation device comprises a seat for absorbing heat from a heat generating device. At least a heat pipe has a first section thereof thermally combined to the seat, and two second sections...
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7274571 |
Heatsink
A method according to one embodiment may include providing a heatsink having a base having a first region with a thickness greater than a second region. The heatsink may further include a plurality...
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7273091 |
Cooling apparatus for heat generating devices
A cooling apparatus for heat generating devices such as semiconductor chips comprises a parallel disk fan in the middle of a set of heat sink fins. The parallel disk fan has radial elements placed...
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7269013 |
Heat dissipation device having phase-changeable medium therein
A heat dissipation device includes a heat dissipation body and a heat conducting body thermally combined with the heat dissipation device. The heat dissipation body includes a central portion...
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7269012 |
Heat dissipation device for heat-generating electronic component
A heat dissipation device includes a first heat sink ( 10 ), a second heat sink ( 20 ), a pair of heat pipes ( 30 ) connecting the first heat sink and the second heat sink and a fan assembly ( 40 )...
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7269005 |
Pumped loop cooling with remote heat exchanger and display cooling
A notebook computer system that utilizes both natural convection and forced convection cooling methods is described. Specifically, at low power levels, the forced convection components are disabled...
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7265979 |
Cooling integrated circuits using a cold plate with two phase thin film evaporation
A microchannel cold plate for cooling semiconductor electronic devices which may include a semi-permeable wall in contact with liquid in the cooling passage. The cold plate, in turn, may be in...
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7265974 |
Multi-heatsink integrated cooling device
A multi-heatsink integrated cooling device comprises a crossflow cooler and a primary heatsink thermally connected by heat-spreading means. The crossflow cooler comprises a casing with an inlet and...
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RE39784 |
Structure for removable cooler
A removable cooler on the memory module wherein the PC board is able to attach on the memory module without any modification. The cooler contains a heat sink module and a cooler module. The heat...
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7258160 |
Heat transfer element, cooling device and electronic device having the element
A heat transfer element includes a container having a heat input section for receiving heat generated by a heating element and a heat output section for radiating the heat outside, and condensable...
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7257000 |
Thermally enhanced pressure regulation of electronics cooling system
A two-phase cooling system operated at atmospheric pressure. A reservoir containing cooling fluid has a stack that is vented to the atmosphere. The stack is shaped to allow condensation of...
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7256999 |
Heat collector plate for an electronic display
A heat collector includes a heat sink. A recess in the heat sink either forms or receives internal gas and liquid phase lines. A manifold may be integrally formed in the heat sink or may be added...
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7254025 |
Cooling mechanisms associated with card adapter
A structure may be coupled to an adapter coupling two or more modules together. In some embodiments, the structure may direct air and/or dissipate heat from the modules into the air. The structures...
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7254023 |
Heat dissipation assembly
A heat dissipation assembly includes a blower holder, a blower, a first heat sink and a second heat sink. The blower includes an inlet and an outlet and is attached to the blower holder. The blower...
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7254026 |
Heat dissipation device with heat pipe
A heat dissipation device ( 40 ) includes at least a heat pipe ( 45 ) and a plurality of metal fins ( 43 ) thermally connected to the heat pipe. Each of the metal fins defines therein an aperture (...
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7239514 |
Heat transfer structure for electronic devices
A heat transfer structure for electronic devices comprises at least two electronic devices coupled with corresponding heat adaptors, a high heat conductivity plate and at least two heat pipes...
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7227753 |
Method and apparatus for cooling heat-generating structure
An apparatus includes a heat receiving portion which receives heat within a footprint from a heat generating structure, and a cooling arrangement which causes flow of a coolant that absorbs heat at...
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7224586 |
Method of maintaining an IC-module near a set-point
A system for maintaining an IC-chip near a set-point temperature while electrical power dissipation in the IC-chip is varied includes a container having an open end with a seal ring. Located in the...
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7224585 |
Liquid-cooled heat sink assembly
A liquid-cooled heat sink assembly for cooling down an electronic component includes a main body ( 20 ) defining a central chamber ( 21 ) therein and having a number of fins ( 22 ) on an outside...
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7218519 |
Thermal management arrangement with a low heat flux channel flow coupled to high heat flux channels
Embodiments of the present invention include an apparatus, method, and system for a thermal management arrangement having a low heat flux channel flow coupled to high heat flux channels.
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7218518 |
Heat dissipation device with heat pipes
A heat dissipation device with heat pipes is described. The heat dissipation device has at least one L-shaped heat pipe, a plurality of heat fins, and a heat sink base. One end of the L-shaped heat...
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7213338 |
Cooler, electronic apparatus, and method for fabricating cooler
This invention provides a cooler having an excellent cooling performance, which is capable of being downsized and low-profiled, an electronic apparatus and a method for fabricating the cooler. The...
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7198096 |
Stacked low profile cooling system and method for making same
A stacked array of low profile heat pipes each with a plurality of micro tubes extended therethrough. The stacked low profile heat pipes are placed into thermal connection with heat producing...
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7193850 |
Integrated heat removal and vibration damping for avionic equipment
An electronic equipment rack system supports a printed wire board (PWB) assembly having a structural stiffener with a heat pipe mounted therein. The heat pipe is mounted within the structural...
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7190582 |
Cooling device, electronic equipment device, and method of manufacturing cooling device
A compact, thin type and high cooling performance cooling device, an electronic apparatus and a method of manufacturing the same are provided. The cooling device ( 1 ) has a pair of a first...
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7188484 |
Heat dissipating structure for mobile device
Embodiments of a heat dissipating structure and method for a mobile device can cool components of a mobile terminal. The heat-dissipating structure can include a case, a device mounted in the case...
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7187547 |
Techniques for cooling a set of circuit boards within a rack mount cabinet
A data storage subsystem is configured to mount within a rack mount cabinet. The data storage subsystem includes a housing configured to mount to a set of vertical rails of the rack mount cabinet,...
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7187553 |
Apparatus for cooling semiconductor devices attached to a printed circuit board
An electronic assembly includes a semiconductor device mounted on a printed circuit board, a leaf spring and a cooling plate. A plurality of fasteners pass through co-axial apertures of the leaf...
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7184269 |
Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly
A cooling apparatus for an electronics assembly having a substrate and one or more electronics devices includes an enclosure sealably engaging the substrate to form a cavity, with the electronics...
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7177152 |
Collective and restrictive inhalant and radiating device for appliances
A collective and restrictive inhalant and radiating device for appliances includes a heat inhaler in a CPU of a computer or other electric appliances, a first heat radiation block connected to the...
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7167364 |
Cooler with blower between two heatsinks
A cooler for cooling of electronic components comprises at least two heatsinks thermally connected with each other by heat spreading means, and a double inlet centrifugal blower comprises a casing...
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7161802 |
Thermal management system having porous fluid transfer element
A thermal management system is provided. The system has a thermal management apparatus which may be disposed adjacent to and connected with a heat source. The thermal management apparatus may...
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7161803 |
Cooling system for an electronic display
A cooling system for an electronic display may include a heat collector plate with internal gas and liquid phase lines. The cooling plate may be thermally isolated together with electronic...
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7156158 |
Heat pipe type cooler
To realize a integrally constructed cooler of the heat pipe type which ensures the achievement of sufficient cooling capacity and the realization of a simple, compact and inexpensive cooler, that...
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7154749 |
System for efficiently cooling a processor
One embodiment of a system for efficiently cooling a processor includes a mounting plate configured to be thermally coupled to the processor, a passive heat transport device thermally coupled to...
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