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7392836 |
Flat-plate heat pipe containing channels
Heat from a heat generating device such as a CPU is dissipated by a heat spreader containing a cycled two-phase vaporizable coolant. The coolant cycles inside a closed metal chamber, which has an...
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7391613 |
Memory module assembly including a clamp for mounting heat sinks thereon
A memory module assembly includes a printed circuit board ( 10 ) having a main heat-generating electronic component ( 52 ) thereon, first and second heat sinks ( 20 ), ( 30 ) attached on opposite...
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7388747 |
Heat plate fixing structure
A heat plate fixing structure is provided, suitable for being used in the heatsink structure of the heating element for an electronic device, which is provided with a support part and a fixing...
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7385821 |
Cooling method for ICS
The present invention is a cooling device for removing heat from an integrated circuit. In one embodiment, the cooling device includes a conduit and a flexible channel having a first open end and a...
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7385820 |
Heat dissipation module
A heat dissipation module for removing heat from a heat generating component, includes a block, a heat pipe and a fin unit. The block includes a first surface and a second surface. One end of the...
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7385818 |
Cooling apparatus
A cooling apparatus for cooling an electronic device on a substrate, comprising a first heat sink held in contact with the electronic device, but unconnected with the substrate or the electronic...
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7382616 |
Cooling system for computer hardware
The present invention represents a significant advancement in the field of cooling systems for computer hardware. In one embodiment, a system for cooling a heat-generating electronic device is...
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7372698 |
Electronics equipment heat exchanger system
An electronics equipment heat exchanger system for thermally managing the electronic devices of a computer server and the exhaust air emitted from the computer server. The electronics equipment...
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7370693 |
Radiating module and the manufacturing method thereof
A method for manufacturing a radiating module consisting of a plurality of radiating fins, at least one heat-transfer tube, and a seat includes the steps of forming through holes on the radiating...
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7369410 |
Apparatuses for dissipating heat from semiconductor devices
An apparatus for providing two-phase heat transfer for semiconductor devices includes a vapor chamber configured to carry a cooling liquid, the vapor chamber having base section, and a plurality of...
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7365982 |
Liquid cooling device
A liquid cooling device ( 10 ) includes a heat sink ( 12 ), a reservoir ( 14 ) containing liquid therein and distant from the heat sink, and a heat-transfer member. The heat-transfer member...
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7363701 |
Method of making a heat pipe
An encapsulated heat pipe is made by placing a removable elongated solid partially within a mold, filling the mold with a solid dielectric material, and removing the elongated solid from the...
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7357174 |
Supporting seat for supporting weight of heat dissipating fins to avoid deformation of heat dissipating tubes extending through the heat dissipating fins
A supporting seat includes a base adapted to be securely connected to the heat conductive plate, two arms extending obliquely from the base from two opposed sides of the base, two engagement plates...
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7353861 |
Transpiration cooled heat sink and a self contained coolant supply for same
A transpiration cooled heat sink, a self contained coolant supply and a method of using a transpiration cooled heat sink and a self contained coolant supply is provided and includes a heat sink...
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7353860 |
Heat dissipating device with enhanced boiling/condensation structure
A heat dissipating device. The heat dissipating device comprises a receptor plate to be placed over a device that generates heat, an evaporator coupling to the receptor plate, a condenser column...
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7352578 |
Fuel cell system with inverter and phase change material
The present invention is a back-up power supply of alternating current and direct current, with the alternating current being generated by an inverter from the direct current, which is produced by...
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7352579 |
***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Apparatus and system for cooling heat producing components
An apparatus and system are disclosed for cooling of heat producing components. The apparatus may include a mounting plate rigidly connected with a top surface of a circuit board, the mounting...
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7352580 |
CPU cooler
A CPU cooler includes a heat-conducting unit and a heat-dissipating unit. The heat-conducting unit consists of a heat-conducting block, a heat-conducting piping, an inflow pipe and an outflow pipe....
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7349213 |
Coolant control unit, and cooled electronics system and method employing the same
A coolant control unit for a liquid cooled electronics system is provided, which includes an external coolant inlet and outlet for receiving and returning external coolant; an internal coolant loop...
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7347251 |
Heat sink for distributing a thermal load
A heat sink for distributing a thermal load is disclosed that includes two or more base plates connected and oriented around a central axis of the heat sink, at least one base plate receiving the...
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7347250 |
Loop heat pipe
A loop heat pipe includes an evaporator, a liquid seal container and a closed loop. The evaporator includes an evaporator body made of a heat conductive material. The evaporator body includes at...
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7345877 |
Cooling apparatus, system, and associated method
A cooling apparatus, system, and method are provided. The cooling apparatus includes at least one printed circuit board having opposed major surfaces, and at least one electrical component or other...
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7345874 |
Heat dissipating device with dust-collecting mechanism
A heat dissipating device comprises a dust-collecting mechanism installed at the air vent passage of a fan, and thus the dust or particles mixed in the airflow of the fan shall be collected on the...
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7342788 |
RF power amplifier assembly with heat pipe enhanced pallet
An RF amplifier assembly employing a finned heat sink and a heat pipe enhanced aluminum pallet is disclosed. The hybrid heat pipe enhanced aluminum pallet reduces the spreading thermal conduction...
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7342785 |
Cooling device incorporating boiling chamber
A cooling device incorporating a boiling chamber includes a heat sink ( 10 ), a fan ( 30 ) and a fan duct ( 50 ) covering the heat sink and the fan therein. The heat sink includes a chamber ( 14 )...
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7342787 |
Integrated circuit cooling apparatus and method
In various embodiments, heat from a computer component may be absorbed into a medium, moved to a remote heat dispersal unit and dissipated into the surrounding air. In some embodiments, the heat...
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7339787 |
Heat sink module for dissipating heat from a heat source on a motherboard
A heat sink module includes a fan set and a heat sink plate. The fan set is integrated as a whole, reducing manufacture time, and the material of the fan set is plastic, thus reducing the weight as...
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7336492 |
Heat dissipating apparatus
A heat dissipating apparatus ( 10 ) for dissipating heat from a heat-generating electronic component includes a heat sink ( 14 ), a resilient clipping member ( 162 ), and an operating member ( 164...
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7336489 |
Waterproof thermal management module and portable
A waterproof thermal management module for a portable electronic device that including a housing and a heat source is disclosed. The waterproof thermal management module includes a separated...
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7336488 |
Radiator mechanism and electronic apparatus having same
It is an exemplified object of the present invention to provide a radiator mechanism and electronic apparatus having the radiator mechanism that can prevent destruction, deterioration, and...
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7334630 |
Closed-loop microchannel cooling system
Apparatus and methods according to the present invention utilize micropumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of...
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7333332 |
Heatsink thermal module with noise improvement
The invention provided a heatsink thermal module with noise improvement, which has a heatsink thermal module additionally consisting of a heat pipe, a heatsink fins set and a fan module; the fan...
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7333710 |
Display including a light source for illuminating input/output terminals
A display includes a casing, a terminal module, and a light source. The terminal module is mounted on an exterior of the casing, and includes a terminal unit. The light source is mounted on the...
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7331377 |
Diamond foam spray cooling system
A diamond foam spray cooling system for improving the thermal management of a heat producing device. The diamond foam spray cooling system includes a thermal management unit including a spray...
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7333333 |
Locking device for heat sink
A heat dissipation device includes a heat sink, a retention module and a clip. The retention module includes a plurality of locking portions. The clip includes a main piece, an operating piece...
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7331379 |
Heat dissipation device with heat pipe
A heat dissipation device includes a fin set, a sinuous heat pipe transferring heat to different parts of the fin set, and a base thermally contacting the heat pipe. The heat pipe has a middle...
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7333340 |
Mounting device for heat dissipating apparatus
A mounting device for mounting a first element onto a second element includes a plurality of fastening elements. Each of the fastening elements includes a connecting member defining a clasping...
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7333336 |
Heat radiating apparatus
A heat radiating apparatus is provided which includes a heat sink configured to be positioned in thermal contact with a heat source in order to take heat from the heat source, at least one heat...
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7327574 |
Heatsink module for electronic device
A heatsink module for electronic device includes a heatpipe, a board, a heatsink and at least a resilient plate. The board is mounted on one end of the heatpipe, and formed with at least a fixing...
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7327571 |
Thermal load balancing systems and methods
Systems and methods for implementing thermal load balancing are disclosed. In an exemplary embodiment, a thermal load balancing system for a multiprocessor computer having a plurality of processors...
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7327569 |
Processor module with thermal dissipation device
Embodiments include apparatus, methods, and systems of a processor module for a system board. An electronic module is removably connectable to a system board. The electronic module has first and...
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7324340 |
Conductive cooling pad for use with a laptop computer
A self contained laptop computer cooling pad that does not require any electrical power to operate and will effectively and efficiently reduce the operating temperature of the computer and reduce...
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7324341 |
Electronics assembly and heat pipe device
An electronics assembly is provided having a heat pipe device for cooling electronics. The assembly includes a substrate and an electronics package supported on the substrate. The assembly also...
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7321491 |
Heat sink for a portable computer
A heat sink ( 200 ) for a portable computer ( 100 ) includes a plurality of fins ( 210 ) located external to the portable computer, a conducting plate ( 230 ) extending into an inner space of the...
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7321494 |
Graphics card apparatus with improved heat dissipating mechanisms
A cooling mechanism to dissipate thermal energy generated by the active electronic components of a graphics card assembly. A mechanism includes a radiator and a metal block that is thermally...
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7317616 |
Mechanism for connecting loop heat pipe and method therefor
A mechanism for connecting a loop heat pipe and a method therefore. The mechanism can communicably connect two pipe openings of a loop heat pipe, which includes a connector body. The connector body...
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7312693 |
Method of increasing burst capacity for automatic meter reading
An automatic meter reader (AMR) used in an electrical distribution system has a communications module ( 26, 28 ) housed within an enclosure ( 12 ) for two-way message communications with a utility...
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7312994 |
Heat dissipation device with a heat pipe
A heat dissipation device includes a heat conducting base, a heat sink on the base and two heat pipes thermally contacting with the heat sink and the base. The heat sink is made of metal extrusion...
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7313001 |
Electrical switch having a mount for an electrical circuit
The invention relates to an electrical circuit arrangement ( 3 ) having electrical and/or electronic components ( 4 ). The components ( 4 ) are arranged on a mount substrate ( 5 ). The conductor...
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7310232 |
Multi-surface heat sink film
An electrical assembly comprising plurality of heat producing devices in direct thermal contact with perforated heat pipe film. Direct benefits of this invention for circuit board packages are...
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