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7474526 |
Electronic apparatus
According to one embodiment, an electronic apparatus is provided with a circuit board contained in a case and including a first surface and a second surface formed on the reverse side of the first...
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7474527 |
Desktop personal computer and thermal module thereof
A thermal module adapted for a desktop personal computer is provided. The desktop personal computer comprises a housing, a power supply, and a motherboard, the power supply being located inside the...
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7471516 |
Meter with reduced internal temperature rise and associated method
An utility meter is provided. The meter includes a base and a first barrier operably associated with the base. The base and the first barrier define a first compartment between the base and the...
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7471513 |
Information processing device and manufacturing method of the information processing device
An information processing device includes a housing part; a heating part arranged in the housing part; a cooling unit configured to cool the heating part; an airflow supplying member configured to...
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7468885 |
Cooling device for interface card
A cooling device for interface card for cooling a heating component on an interface card includes a heat sink and a water cooling head, wherein the heat sink has a heat conducting seat and a...
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7466548 |
Cooling device for cooling a heat-generating component, and electronic apparatus having the cooling device
A cooling device having a heat receiving portion, a heat radiating portion, a heat pipe, and a fan. The heat receiving portion is held on a wiring board and thermally connected to a heat-generating...
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7466550 |
Integrated heat dissipating assembly
An integrated heat dissipating assembly includes two heat sinks, a heat dissipating fan mounted between the two sinks and a body provided below the two heat sinks and the heat dissipating fan. The...
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7460367 |
Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology
Method and System for dissipating thermal energy from conduction-cooled circuit card assemblies in which thermal energy is directed into proximate heat sink assemblies and additionally is conveyed...
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7460370 |
Heat dissipation assembly
A heat dissipation assembly ( 100 ) is provided. The heat dissipation assembly ( 100 ) comprises a chassis ( 20 ) of an electronic product, a heat sink ( 10 ) having a bottom portion thereof being...
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7457118 |
Method and apparatus for dispersing heat from high-power electronic devices
A heat dissipation apparatus includes a heat absorption device coupled to a board, the heat absorption device configured to absorb heat generated by an electrical device mounted on the board, a...
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7457119 |
Heatsink module
A heatsink module used for dissipating heat generated by a heat generating component is provided. The heatsink module includes a heat pipe, a heatsink fin assembly, a fan blade motor set, a fan...
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7455102 |
Method for manufacturing heat pipe cooling device
A method for manufacturing a heat pipe cooling device. The heat pipe cooling device includes a U-shaped heat pipe, which is embedded within a heat conductor. The heat conductor includes a...
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7451806 |
Heat dissipation device with heat pipes
A heat dissipation device is for contacting with a heat generating electronic device to remove heat from the electronic device. The heat dissipation device includes a base for thermally engaging...
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7453695 |
Cooling structure of electric device
A cooling structure of electric devices in a vehicle is structured to hold an inverter ( 300 ) downward of a cooling passage ( 356 ), and to hold a condenser ( 200 ) upward of the cooling passage (...
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7450386 |
Phase-separated evaporator, blade-thru condenser and heat dissipation system thereof
A phase-separated evaporator includes a boiler plate and a phase separation chamber that includes a housing, connected to the boiler plate, having a gas port and a liquid port; and a phase...
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7450378 |
Power module having self-contained cooling system
A semiconductor module comprises a housing having a cavity therein, and at least one semiconductor device residing within the cavity. A cooling system is contained within the housing and comprises...
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7448438 |
Heat pipe type heat dissipation device
A heat pipe type heat dissipation device for an electronic component comprises a base plate, a cover plate spaced from the base plate, a plurality of parallel fins extending between the base plate...
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7447030 |
Thermal module having a housing integrally formed with a roll cage of an electronic product
A thermal module includes a roll cage mounted to an enclosure of an electronic product, a centrifugal blower, and a fin assembly. The centrifugal blower is disposed in the roll cage and includes a...
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7447029 |
Vapor chamber for dissipation heat generated by electronic component
A vapor chamber includes a base ( 100 ) for contacting a heat-generating component ( 500 ), a cover ( 200 ), a first porous capillary sheet ( 300 ) located in the base and a second porous capillary...
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7447027 |
Hybrid heat dissipation device
A heat dissipation device includes a plurality of first, second and third fins arranged side by side and a fan. The fins define a plurality of parallel channels therein respectively for air flowing...
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7447017 |
Computer having a heat discharging unit
A computer has a casing that accommodates a main board having a heat generating component that generates heat therein. The computer includes an internal heat discharging part disposed in the casing...
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7447031 |
Cockpit for a motor vehicle
A cockpit for installation in a motor vehicle between two A-pillars includes a printed board having electronic components connected to a crossmember via a pipe. The pipe is filled with a...
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7443675 |
Heat pipe with guided internal grooves and heat dissipation module incorporating the same
A heat pipe includes a heat receiving section, a heat transfer section, and a heat dissipation section. A groove structure is formed inside the heat pipe and extends from the heat receiving section...
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7443679 |
Heat dissipating device having a fin also functioning as a fan holder
A heat dissipating device for cooling a heat-generating electronic device, includes a heat sink assembly ( 10 ) and a fan ( 20 ) mounted to a side of the heat sink assembly. The heat sink assembly...
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7443680 |
Heat dissipation apparatus for heat producing device
A heat dissipating apparatus for dissipating heat generated by heat producing device, includes a base, a fin set and an axial fan. The base is secured on the heat producing device. The fin set...
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7438120 |
Cooling device
The invention relates to a cooling device, which comprises a cooling fan and a heatsink. The heatsink is directly attached to the heating element to absorb its heat and the cooling fan is disposed...
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7436663 |
Disk array system
In a disk array apparatus according to an aspect of the invention, temperatures of disk drives arranged in a casing are equalized to reduce a noise. A disk array apparatus 50 comprises plural...
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7436673 |
Heat sink fixing assembly
A fixing structure of heat conduction pad is used to uniformly press two heat conduction pads on the two heat generating electronic components on a circuit board respectively. The fixing structure...
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7436667 |
Electronic device
An electronic device has a first circuit board, a first fan, a second circuit board, a first heat sink, and a first air ventilation duct. The first fan and the first circuit board are electrically...
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7433190 |
Liquid cooled electronic chassis having a plurality of phase change material reservoirs
A system and method of thermal management of electrical and electronic systems and components that adequately maintains the temperatures of the system electronics and electrical devices within...
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7433187 |
Heat spreader module
A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second...
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7431071 |
Fluid circuit heat transfer device for plural heat sources
A heat sink or heat transfer device particularly for integrated circuits, uses a phase change working fluid in a cyclic flow path having at least one evaporator that serves multiple heat sources....
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7428153 |
Heat dissipation assembly
A heat dissipation assembly used for dissipating heat from heat generating electronic components includes a mounting frame, a heat sink and a fan duct. The heat sink is positioned on the mounting...
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7426956 |
Heat dissipating apparatus
A heat dissipating apparatus ( 10 ) includes a base ( 20 ), a plurality of stacked fins ( 30 ), and at least a heat pipe ( 40 ). The base absorbs heat from a heat-generating component. Each of the...
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7428152 |
Localized thermal management system
A localized thermal management system for efficiently thermally managing a plurality of heat producing devices. The localized thermal management system includes a thermal management unit and a...
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7424906 |
High performance thermosiphon with internally enhanced condensation
A thermosiphon cooling assembly includes a refrigerant disposed in a lower portion of a housing for undergoing a liquid-to-vapor-to-condensate cycle. A mixing device is disposed within the lower...
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7426112 |
Heat dissipating module
A heat dissipating module includes a releasing member, a heat pipe, which has a first end connected to the releasing member and a second end attached to the top surface of a thermal chip on a...
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7423877 |
Heat dissipation device
A heat dissipation device includes a heat-absorbing member having two arched concave walls formed at opposite sides thereof, and a plurality of fins extending outwardly and slantwise from each of...
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7422053 |
Vapor augmented heatsink with multi-wick structure
A heat transfer device includes a base chamber, a fin chamber, and at least one fin. The chambers can be thermally coupled. The heat transfer device also includes a wick structure. The wick...
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7423876 |
System and method for heat dissipation in an information handling system
A system and method is disclosed for dissipating heat within the interior of an information handling system. Heat from a heat source is directed to a heat sink and is also directed in parallel to a...
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7422052 |
Low profile thermosiphon
A thermosiphon cooling assembly for dissipating heat generated by an electronic device includes a housing having a housing top, housing bottom and opposing sides. The opposing sides extend between...
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7420807 |
Cooling device for electronic apparatus
The present invention provides a cooling apparatus which is easy to build and to fix it to electronic devices, superior in thermal conduction and heat dissipation, and possible to make thin the...
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7420810 |
Base heat spreader with fins
A thermal management device for the removal of thermal energy useful for, inter alia, electronic devices or other components.
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7414841 |
Electronic cooling system having a ventilating duct
A heat dissipation device in a computer enclosure includes a heat spreader ( 20 ) mounted on a CPU ( 12 ), a first heat sink ( 30 ), a cooling fan ( 40 ) coupled to the first heat sink, a second...
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7414850 |
Heat dissipation module for electronic device
A heat dissipation module for removing heat from a heat-generating electronic component includes a base ( 106 ) and a clip ( 40, 40 a ). The clip includes a connecting arm ( 42, 42 a ) and a...
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7411791 |
Extendable heat dissipation apparatus
An extendable heat dissipation apparatus includes a base, an extendable heat dissipation member and a connecting element. A normal fin is formed on the base, and the connecting element integrates...
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7411790 |
Heat sink with built-in heat pipes for semiconductor packages
A heat sink with a built-in heat pipe for semiconductor package is disclosed. At least a built-in heat pipe is disposed in a cavity of a metal vessel and sealed by a metal cover. The built-in heat...
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7405935 |
Service tray for a thermal management system
A service tray for a thermal management system for providing convenient access to components within a liquid thermal management system. The service tray for a thermal management system includes a...
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7405937 |
Heat sink module for dual heat sources
A heatsink module for dual heat sources for dissipating heat generated by a first and a second heat-generating element disposed on a circuit board is provided. The heatsink module includes a first...
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7403393 |
Apparatus and system for cooling heat producing components
An apparatus and system are disclosed for cooling of heat producing components. The apparatus may include a mounting plate rigidly connected with a top surface of a circuit board, the mounting...
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