|
Match
|
Document |
Document Title |
|
|
7548424 |
Distributed transmit/receive integrated microwave module chip level cooling system
A radar transmit and receive integrated microwave module with conductively cooled condenser side rails and one or more vacuum brazed fluid distribution manifold cold plates in fluid communication...
|
|
|
7548428 |
Computer device heat dissipation system
A computer device heat dissipation system comprising a heat exchanger having a plurality of fins connected to a heat pipe, at least one of the plurality of fins comprises at least one aperture to...
|
|
|
7548426 |
Heat dissipation device with heat pipes
A heat dissipation device includes a base ( 14 ) for absorbing heat from an electronic device and a plurality of fins ( 20 ) arranged on the base. A heat pipe ( 32 ) thermally contacts the fins and...
|
|
|
7548427 |
Apparatus and docking station for cooling of computing devices
An apparatus with some embodiments is described having cooling capabilities for a computing device. In some embodiments, the apparatus may include a thermoelectric component (TEC) to transfer...
|
|
|
7545646 |
Cooling assembly
A cooling assembly and method of cooling a heat-generating electronic component on a circuit board. A heat collector collects heat from the electronic component. A heat pipe transfers the heat to a...
|
|
|
7545644 |
Nano-patch thermal management devices, methods, & systems
Nano-scale thermal management devices, methods, and systems are provided. According to some embodiments, a thermal management device configured to remove heat from a heated area can comprise an...
|
|
|
7545645 |
Heat dissipation device
A heat dissipation device includes a heat spreader ( 20 ), a heat pipe ( 30 ), a heat sink ( 40 ) and a cooling fan ( 50 ) for generating forced airflow to the heat sink. The heat pipe has an...
|
|
|
7545630 |
Method and apparatus for thermal dissipation
A thermal dissipation apparatus includes a thermal transfer device including a heat pipe member. A temperature sensitive material is coupled to the heat pipe member and is operable to provide a...
|
|
|
7542789 |
Battery cover assembly for a portable electronic device
A battery cover assembly ( 10 ) includes a housing ( 1 ), a connecting member ( 2 ), a cover ( 3 ), a latching section ( 6 ), an engaging board ( 8 ), and a button ( 9 ). The housing defines a...
|
|
|
7540318 |
Heat sink
A heat sink includes a first heat pipe having a flat plate-shape and a second heat pipe connected perpendicularly to the first heat pipe. The first heat pipe has a first wick provided along an...
|
|
|
7542293 |
Thermal module
A thermal module includes a heat spreader ( 50 ) for contacting with a heat-generating electronic device mounted on a printed circuit board, a heat sink ( 60 ), a heat pipe ( 70 ) thermally...
|
|
|
7537049 |
Heat dissipation apparatus
A heat dissipation apparatus ( 10 ) includes a computer enclosure ( 110 ) made of thermally conductive material, a fin assembly ( 140 ) secured to the computer enclosure, and a heat pipe ( 130 )...
|
|
|
7535712 |
Electronic apparatus
According to one embodiment, an electronic apparatus comprising: a housing; a circuit board that is housed in the housing; a heat generation portion that is mounted on the circuit board; a heat...
|
|
|
7531949 |
Advanced cooling for an interactive display
A thermally stabilized lamp assembly that can be de-energized without continuing to provide moving air for cooling purposes. The assembly includes an arc lamp bulb having a base and a reflector. A...
|
|
|
7532476 |
Flow solutions for microelectronic cooling
Flow solutions for cooling one or more microelectronic device(s) are generally described. In this regard, according to one example embodiment, a cooling apparatus comprising a heat sink base...
|
|
|
7532467 |
Thermal management devices, systems, and methods
Briefly described, embodiments of this disclosure include thermal management devices, systems, and methods, convection cooling devices, convection cooling systems, convection cooling methods,...
|
|
|
7529089 |
Heat-dissipating device connected in series to water-cooling circulation system
A heat-dissipating device includes a MOSFET heat dissipator, a south bridge heat dissipator, a north bridge heat dissipator and a water block connector. A heat pipe is provided between each heat...
|
|
|
7529091 |
Power semiconductor module and method for cooling a power semiconductor module
The invention relates to a power semiconductor module comprising a plurality of power semiconductors that are fixed to a first side of a printed circuit board ( 26 ), and a cooling device that acts...
|
|
|
7525801 |
Computer module
A computer module includes a housing having a cover defining a condenser chamber, and a heat-absorbing unit having at least one cavity body adapted to contact a heat source, and a working fluid...
|
|
|
7525802 |
Computer with heat dissipation system
A computer includes a motherboard ( 2 ), an enclosure ( 1 ), and a fan ( 153 ). The motherboard has a first heat generating device ( 21 ) mounted thereon. The enclosure has a substantially sealed...
|
|
|
7520317 |
Orientation insensitive compact thermosiphon with a remote auxiliary condenser
A heat exchanger assembly is provided including a primary housing having a plurality of primary condensing fingers extending upwardly from and perpendicular to a horizontal axis and disposed...
|
|
|
7518869 |
Information processing apparatus with a chassis for thermal efficiency and method for making the same
An information processing unit and a method for making the same with a cooling structure for a heat generating element, for example a CPU, which can efficiently cool the CPU without losing...
|
|
|
7518868 |
Apparatus, system, and method for efficient heat dissipation
An apparatus, system, and method are disclosed for efficient heat dissipation. The apparatus for efficient heat dissipation is provided with a compliant heat pipe configured to conform to adjacent...
|
|
|
7518861 |
Device cooling system
A device cooling system comprises a heat pipe disposed in a device, the heat pipe having a condenser portion and at least two divergent evaporator portions, the at least two evaporator portions...
|
|
|
7515417 |
Apparatus for cooling computer parts and method of manufacturing the same
Provided is an apparatus for cooling heat generating computer parts that installed in a computer. The apparatus includes a heat transferring block capable of being thermally coupled to the heat...
|
|
|
7511956 |
Electronic apparatus
According to one embodiment, a housing of an electronic apparatus includes a first sidewall portion provided with an air vent, a ceiling wall portion extending from an upper end of the first...
|
|
|
7511958 |
Heat dissipating assembly of heat dissipating device
A heat dissipating assembly of a heat dissipating device includes an integral formed plastic retaining seat; and a heat conductive tube. A part of one end of a heat conductive tube is embedded into...
|
|
|
7511957 |
Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled
A cooled electronic module and method of fabrication are provided employing a cooling apparatus for removing heat from one or more electronic devices disposed on a substrate. The cooling apparatus...
|
|
|
7511947 |
Circuit board with a perforated structure for disposing a heat pipe
A circuit board includes a substrate forming an opening, a first thermal module disposed on a first side of the substrate, a second thermal module disposed on a second side opposite to the first...
|
|
|
7508671 |
Computer system having controlled cooling
A computer system and its method of cooling are provided. A vapor chamber serves as a heat spreader for heat from the microelectronic die. A thermoelectric module serves to cool the vapor chamber...
|
|
|
7508667 |
Heat sink backplate module, circuit board, and electronic apparatus having the same
An electronic apparatus includes a case, a circuit board disposed in the case, a heat sink backplate module, and a heat sink disposed on a heat source of the circuit board. The heat sink backplate...
|
|
|
7508662 |
Handle arrangement with integrated heat pipe
Handle arrangements having an integrated heat pipe for use with a portable electronic device are presented including: a heat pipe, the heat pipe configured with a heat receiving portion, a heat...
|
|
|
7505267 |
Cooling system for an electronic box
The invention relates to a cooling system for an electronic box capable of releasing heat. It comprises a passive cooling device able to be connected to the electronic box and an element consisting...
|
|
|
7505269 |
Thermal energy storage transfer system
A thermal energy storage transfer system that is adapted to transfer heat from an electronics enclosure. The thermal energy storage system includes a thermal energy storage unit that is positioned...
|
|
|
7505268 |
Electronic device package with an integrated evaporator
The present invention provides an electronic device package that can be fabricated using standard package fabrication technologies while providing a desired level of thermal transfer capability to...
|
|
|
7502228 |
***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Heat transfer mechanism, heat dissipation system, and communication apparatus
A heat transfer mechanism for dissipating heat from a heat generating body to a heat dissipating part, realizing both a high elasticity and a high thermal conductivity, comprised of a film-shaped...
|
|
|
7499278 |
Method and apparatus for dissipating heat from an electronic device
The method and apparatus of the present invention dissipate heat from an electronic device to provide an efficient and universally applied thermal solution for high heat generating electronic...
|
|
|
7494594 |
Method of manufacturing an electrostatic actuator
An electrostatic actuator for increasing a swing (deflection angle) of a movable structure includes a laminate substrate in which a thin film silicon layer is formed on a silicon substrate through...
|
|
|
7495916 |
Low cost cold plate with film adhesive
An electronic assembly is constructed with an enclosed fluid-cooled cold plate. Pressurized cooling fluid is propelled through the cold plate to carry away heat from the electronic assembly. The...
|
|
|
7495915 |
Heat dissipation system
A heat dissipation system is used for dissipating heat generated by an electronic device mounted on a printed circuit board. The heat dissipation system includes an enclosure adapted to receive the...
|
|
|
7493693 |
Method for fabricating multi-layer wick structure of heat pipe
A method for fabricating a multi-layer wick structure of a heat pipe includes providing a first and a second weaving meshes, overlaying and winding the first and the second weaving meshes to form...
|
|
|
7495923 |
Heat dissipation device having fixing bracket
A heat dissipation device for an add-on card in a computer enclosure includes a heat sink mounted on the add-on card and a fixing bracket. The fixing bracket includes a connecting portion fixed to...
|
|
|
7489509 |
Thermally insulated cabinet and method for inhibiting heat transfer
One embodiment of an cabinet according to the present invention comprises an inner cabinet having a plurality of inner walls that form an enclosure. A phase change material covers at least some of...
|
|
|
7489510 |
Fastening device for mounting thermal module to electronic component
A thermal module includes a heat sink ( 400 ), a heat pipe ( 200 ) and a fastening device ( 300 ). The heat pipe ( 200 ) includes an evaporator ( 240 ) and a condenser ( 220 ) connected with the...
|
|
|
7477513 |
Dual sided board thermal management system
A dual sided board thermal management system for efficiently thermally managing a printed circuit board having electronic components on opposing sides thereof. The dual sided board thermal...
|
|
|
7477515 |
Electronic apparatus and thermal dissipating module thereof
A thermal dissipating module comprises a heat pipe with a first end and a second end, a first joint component connected to the first end, a second joint component connected to the second end, a...
|
|
|
7474526 |
Electronic apparatus
According to one embodiment, an electronic apparatus is provided with a circuit board contained in a case and including a first surface and a second surface formed on the reverse side of the first...
|
|
|
7474527 |
Desktop personal computer and thermal module thereof
A thermal module adapted for a desktop personal computer is provided. The desktop personal computer comprises a housing, a power supply, and a motherboard, the power supply being located inside the...
|
|
|
7471516 |
Meter with reduced internal temperature rise and associated method
An utility meter is provided. The meter includes a base and a first barrier operably associated with the base. The base and the first barrier define a first compartment between the base and the...
|
|
|
7471513 |
Information processing device and manufacturing method of the information processing device
An information processing device includes a housing part; a heating part arranged in the housing part; a cooling unit configured to cool the heating part; an airflow supplying member configured to...
|