|
Match
|
Document |
Document Title |
|
|
6477045 |
Heat dissipater for a central processing unit
A heat dissipater for a CPU (Central Processing Unit) includes an upper block and a lower block abutting each other. The upper block has a series of fins extending upward from a first side of the...
|
|
|
6473305 |
Fastening system and method of retaining temperature control devices used on semiconductor dies
A fastening system and a method for retaining temperature control devices used on semiconductor dies transfers the load of the temperature control devices around the semiconductor dies using a...
|
|
|
6469894 |
Apparatus for cooling an electronic component and electronic device comprising the apparatus
An apparatus for cooling an electric component is provided on an electronic component mounted on a printed circuit board. The apparatus comprises a heat radiation member having a base contacting...
|
|
|
6466441 |
Cooling device of electronic part having high and low heat generating elements
The cooling device of an electronic part including a substrate and first and second electronic elements. The first element (processor) is higher than the second element, and the first element...
|
|
|
6460608 |
Heat sink and information processor using heat sink
The present invention relates to a heat sink. More particularly, the present invention relates to a heat sink used for radiating heat from an integrated circuit package such as a micro-processor...
|
|
|
6460612 |
Heat transfer device with a self adjusting wick and method of manufacturing same
A heat pipe and method that utilizes a multi-layered shape memory alloy (SMA) as the wick structure. Each layer has a different transformation temperature. The inner layer of the SMA begins...
|
|
|
6459581 |
Electronic device using evaporative micro-cooling and associated methods
An electronic device includes a package surrounding at least one integrated circuit, a micro-fluidic cooler in the package, and a controller for controlling the micro-fluidic cooler so that the...
|
|
|
6459576 |
Fan based heat exchanger
A heat generating component such as a microprocessor, in a small form factor, low profile electronic device such as a laptop computer is cooled by using an elongated hollow heat exchanger with a...
|
|
|
6453537 |
Cooling method for electronic components
A method for cooling electrical components on a substrate during a rework process. A block of a porous, thermally conductive material, saturated with a liquid, is positioned on an electrical...
|
|
|
6452799 |
Integrated circuit cooling system
A integrated circuit cooling system includes a thermally conductive element sandwiched between two integrated circuits. The thermally conductive element of this thermal sandwich conducts heat away...
|
|
|
6452798 |
Electronic module including a cooling substrate having a fluid cooling circuit therein and related methods
A method for making an electronic module includes forming a cooling substrate having a fluid cooling circuit therein having a vertical passageway. The cooling substrate may be formed by forming a...
|
|
|
6452804 |
Method and apparatus for thermal and mechanical management of a power regulator module and microprocessor in contact with a thermally conducting plate
A stack up assembly for supplying power and removing heat from a microprocessor while controlling electromagnetic emissions is disclosed. The stack up assembly comprises a VRM circuit board or...
|
|
|
6450250 |
Stackable heat sink for electronic components
A stackable heat sink having a core shaft in heat-engaging relation with a semiconductor device and a plurality of individual thin fins having an opening for receiving the core shaft in press fit...
|
|
|
6443222 |
Cooling device using capillary pumped loop
A cooling device using a capillary pumped loop (CPL), including a lower board having a looped groove formed on the upper surface, an upper board combined with the upper surface of the lower board...
|
|
|
6438984 |
Refrigerant-cooled system and method for cooling electronic components
A system and method of using refrigerant for cooling electronic components is presented. The system includes a surface. At least one electronic component is coupled to the surface, the at least one...
|
|
|
6439298 |
Cylindrical heat radiator
A cylindrical heat radiator comprises a cylindrical main body having a tightly sealing cavity, the cavity being filled with air; an inner surface of the cylindrical main body being formed with two...
|
|
|
6437983 |
Vapor chamber system for cooling mobile computing systems
A system including a vapor chamber including a liquid. The vapor chamber is coupled with a die. The vapor chamber is attached to a plurality of micro pipes (MPs). When heat is generated by the die,...
|
|
|
6437982 |
External attached heat sink fold out
A heat sink insertable into a computer and attached to the computer. The heat sink is coupled to a heat pipe. When the heat sink is inserted into the computer, the heat pipe is disengaged from a...
|
|
|
6437981 |
Thermally enhanced microcircuit package and method of forming same
A thermally enhanced microcircuit package includes a microcircuit package having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is...
|
|
|
6430043 |
Heat sink grounding unit
A electromagnetic interference (EMI) grounding unit provides an electrical connection between a heat sink and a ground formed on a substrate. A tab mechanically and electrically continuous with an...
|
|
|
6430047 |
Standardized test board for testing custom chips
A printed wiring board provides connection between a chip and a standard footprint layout of a test machine. An insulating substrate defines a chip receiving region having a plurality of chip...
|
|
|
6426874 |
Semiconductor device mounting structure and feeding-side charger with heat radiating unit
In a feeding-side charger, a heat transfer unit ( 23 ), which comes into contact with a heat radiating duct ( 16 ) fixed with a power circuit board ( 18 ), is fixed to the power circuit board ( 18...
|
|
|
6422303 |
Silent heat exchanger and fan assembly
A heat dissipation device comprising a thermally conductive, hollow housing having a fan and an active anti-noise module disposed within the hollow housing. The hollow housing may include a...
|
|
|
6424528 |
Heatsink with embedded heat pipe for thermal management of CPU
A heatsink for dissipating thermal energy generated by a microprocessor and neighboring peripheral components. The heatsink is affixed to a printed circuit board within a computer housing. The...
|
|
|
6418018 |
Heat removal system
A heat removal system of the present invention includes a fan ( 30 ) of a power supply ( 20 ), a heat sink ( 50 ) mounted to the fan, and a heat pipe ( 60 ) connecting the heat sink to a CPU ( 24...
|
|
|
6418017 |
Heat dissipating chassis member
The invention provides a chassis member, which may be made of a cast material such as magnesium, aluminum, or plastic, for mechanically supporting a heat producing electronic device in which the...
|
|
|
6411512 |
High performance cold plate
A cold plate assembly for cooling a heat source is disclosed. The cold plate assembly includes a rectangular base having an inner surface for thermally interfacing with the heat source. Machining...
|
|
|
6408934 |
Cooling module
A cooling module is disclosed which comprises a plate, a flat heat pipe, a directional motor, and a fin structure, wherein at least a part of the heat pipe is embedded into the plate while being...
|
|
|
6408937 |
Active cold plate/heat sink
A heat sink apparatus for gathering and dissipating heat from a heat source having a heat source housing includes an impeller chamber having a chamber interior containing a heat transfer fluid and...
|
|
|
6408935 |
Heat sink assembly with over-molded cooling fins
A heat sink assembly having a base formed through an injection molding process utilizing high conductivity plastic in which both the heat pipe and the cooling fins are over-molded into the base to...
|
|
|
6407916 |
Computer assembly for cooling high powered microprocessors
An improved computer assembly is disclosed, which includes a chassis that has at least one drive bay, the drive bay having an opening. A heat sink is positioned within the drive bay and a thermally...
|
|
|
6397936 |
Freeze-tolerant condenser for a closed-loop heat-transfer system
A freeze tolerant condenser ( 106 ) for a two-phase heat transfer system is disclosed. The condenser includes an enclosure ( 110 ) and a porous artery ( 112 ) located within and extending along the...
|
|
|
6400565 |
Thermally conductive interface member
An electronic package including a printed circuit substrate having a semiconductor device mounted thereon. A heat dissipating device is attached to the semiconductor device. A thermal interface...
|
|
|
6397934 |
Cooling device boiling and condensing refrigerant
A cooling device includes a boiling unit and a condensing unit. A diffusion plate having a plurality of holes is formed into a thin-long shape, and is disposed in an upper tank of the condensing...
|
|
|
6399877 |
Heat sink
A heat sink is provided that can efficiently dissipate heat-producing components, e.g. semiconductor devices, thus realizing small, slim, high-performance electronic equipment. The heat sink...
|
|
|
6397941 |
Net-shape molded heat exchanger
A net-shape molded heat exchanger is provided which includes a thermally conductive main body and a number of thermally conductive arms connected to and extending from the main body. A number of...
|
|
|
6394175 |
Top mounted cooling device using heat pipes
The present invention provides an integrated cooling device employing heat pipes for cooling an electronic component and a method of manufacturing the same. In one embodiment, the integrated...
|
|
|
6392883 |
Heat exchanger having phase change material for a portable computing device
An heat exchanger having a first heat transfer element having thermally coupled to an electronic component, and a heat dissipation mechanism coupled to the heat transfer element. The heat...
|
|
|
6388882 |
Integrated thermal architecture for thermal management of high power electronics
The present invention provides a thermal energy management architecture for a functioning system of electronic components and subsystems comprising a hierarchical scheme in which thermal management...
|
|
|
6382309 |
Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction
A capillary wick for use in capillary evaporators has properties that prevent nucleation inside the body of the wick, resulting in suppression of back-conduction of heat from vapor channels to the...
|
|
|
6382308 |
Boiling cooling system that exchanges heat between higher-temperature fluid and lower-temperature fluid
There is provided a boiling cooling system that exchanges heat between a higher-temperature fluid and a lower-temperature fluid through boiling heat transfer of a refrigerant sealingly contained...
|
|
|
6382307 |
Device for forming heat dissipating fin set
A device for forming a heat dissipating fin set comprises a heat tube made of copper, and at least one heat dissipating fin set made of metal. Each fin in the heat dissipating fin set having a...
|
|
|
6382306 |
Geometrical streamline flow guiding and heat-dissipating structure
A geometrical streamline flow guiding and heat-dissipating structure is formed by a heat-transferring seat, a heat-dissipating device and a fan. The heat-transferring seat has at least one heat...
|
|
|
6385044 |
Heat pipe heat sink assembly for cooling semiconductor chips
An apparatus and method are disclosed to provide heat pipe cooling for semiconductor chips mounted on a module. Each chip is provided its own heat pipe for cooling. A piston on the end of each heat...
|
|
|
6381135 |
Loop heat pipe for mobile computers
A heat transfer device for a mobile computer system using a loop heat pipe, the evaporator of the loop heat pipe coupled to the processor die. The vapor space and liquid space are separated. The...
|
|
|
6377459 |
Chip cooling management
A cooling assembly for cooling chips is disclosed. The assembly includes a heat sink, a plate member, and a heat pipe. The heat sink is attachable to a first chip. The plate member is attachable to...
|
|
|
6373700 |
Heat sink modular structure inside an electronic product
The present invention of a heat sink modular structure inside an electronic product comprises of a heat sink fan mounted on one end of an air channel pipe body blowing the heat thereon outward from...
|
|
|
6373697 |
Computer system housing and configuration
A computer system housing with a curved bezel that forms one or more sideways gap between a side of the computer housing chassis and the bezel attached to that side. Typically, the curved bezel is...
|
|
|
6369333 |
Flexible connection system
A method and apparatus for a connection system to a substrate is provided. The system includes a substrate having a mounting hole to permit an object to be coupled to the substrate. The substrate...
|
|
|
6367544 |
Thermal jacket for reducing condensation and method for making same
A thermal jacket is provided for reducing the rate of condensation of moisture during subambient operation of a cooled heat sink. The thermal jacket includes a bonding layer positioned in...
|