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8184435 |
Hot aisle containment cooling system and method
An air containment cooling system for containing and cooling air between two rows of equipment racks includes a canopy assembly configured to enclose a hot aisle defined by the two rows of...
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8182661 |
Controllable target cooling
A sputter target assembly particularly useful for a large panel plasma sputter reactor having a target assembly sealed both to the main processing chamber and a vacuum pumped chamber housing a...
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8179676 |
Optical interconnects in cooling substrates
Fluid-cooling technology developed for printed circuit boards (PCBs) and electronics assemblies is combined with optical-based interconnect technology, thereby enabling efficient fabrication of...
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8179677 |
Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
Cooling apparatus and method are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatus includes a housing at least partially surrounding and...
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8175753 |
Systems and methods for computer equipment management
Methods of managing computer equipment: the methods may comprise receiving data indicating a power dissipated by computer equipment in a portion of the server room and receiving data indicating an...
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8174826 |
Liquid cooling system for stackable modules in energy-efficient computing systems
A computing system is provided. In the computing system, a plurality of modules physically arranged in a three dimensional hexadron configuration. In the computing system, the at least one module...
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8174828 |
Narrow gap spray cooling in a globally cooled enclosure
Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and...
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8174829 |
Cooling electronic devices provided in rows of racks
To cool racks of electronic devices, the racks are arranged in a plurality of rows to define at least a first aisle and a second aisle, where the second aisle has air cooler than air in the first...
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8174831 |
Heating circuit and electronics assembly
A heating circuit and an electronics assembly for use in a vehicle includes an external housing having outer walls and an internal wall dividing the external housing into an electronics cavity and...
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8174830 |
System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling
A circuit board includes a pump and a channel. The channel includes a liquid metal and a coating. The liquid metal is pumped through the channel by the pump and the coating reduces diffusion and...
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8169780 |
Power conversion device
In a power conversion device including: a converter which steps up or down a voltage of a direct current power supply; and an inverter which converts the direct current voltage obtained by the...
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8170724 |
Systems and associated methods for controllably cooling computer components
Computer systems and associated methods for cooling computer components are disclosed herein. One embodiment of a computer system includes a computer cabinet having an air inlet spaced apart from...
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8169779 |
Power electronics substrate for direct substrate cooling
Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical...
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8164901 |
High efficiency heat removal system for rack mounted computer equipment
An efficient method of heat removal from rack mounted computer equipment, network gear and other electronic equipment, consisting of solid heat conducting components in direct contact with the heat...
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8164902 |
Electronic apparatus
An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades...
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8149579 |
Cooling member
A cooling member for a variable speed drive. The variable speed drive has a component that generates heat during operation of the drive and a base. The base has a surface that receives the...
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8144467 |
Dehumidifying and re-humidifying apparatus and method for an electronics rack
Dehumidifying and re-humidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes a dehumidifying air-to-liquid heat exchanger disposed at an air inlet side...
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8139359 |
Cooling system for a variable vacuum capacitor
In a cooling system for a variable vacuum capacitor, a liquid is arranged inside a cooling reservoir, a first part of the reservoir is designed to absorb heat energy from first bellows of the...
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8134833 |
Evaporator for a cooling circuit
An evaporator is disclosed for a cooling circuit. The evaporator includes a housing having at least one wall for contacting a heat emitting device. A channel, the cross section of which is small...
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8134832 |
Electric drive
An electric drive is disclosed which includes at least a choke unit, a power step unit, and a capacitor unit for implementing power supply to an electricity-consuming device. A cooling arrangement...
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8132616 |
Temperature conditioning system with thermo-responsive valves
Disclosed is a temperature conditioning system including several thermal transfer blocks, where each is associated with one of several components requiring thermal management. Each of the...
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8130497 |
Blade server
A server system with a cooling ability that can cope with an increase in the amount of heat generated by a CPU of a server module detachably mounted on a blade server. The server module includes an...
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8125781 |
Semiconductor device
A semiconductor device comprises at least a semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip and a seal member for covering and sealing...
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8125777 |
Methods and apparatus for electrical components
Methods and apparatus for electrical components according to various aspects of the present invention may be implemented in conjunction with an electrical system comprising a heat generating...
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8125780 |
In-line memory module cooling system
A system to aid in cooling an in-line memory module may include a thermal interface material adjacent the in-line memory module. The system may also include a heat spreader adjacent the thermal...
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8123460 |
UAV pod cooling using integrated duct wall heat transfer
Electronic equipment frequently requires cooling to maintain the integrity and reliability of the equipment, and to elongate the life expectancy of the equipment. When in operation, the fan of a...
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8120916 |
Facilitating cooling of an electronics rack employing water vapor compression system
A cooling apparatus and method are provided for facilitating cooling of an electronic apparatus that includes a semiconductor element. The cooling apparatus includes an evaporator containing a...
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8120914 |
Semiconductor cooling apparatus
A semiconductor cooling apparatus having a tank forming body and semiconductor power device mounting substrates is disclosed. The tank forming body includes a first outer plate, a second outer...
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8120915 |
Integral heat sink with spiral manifolds
A heat sink is provided for directly cooling at least one electronic device package having an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at...
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8119908 |
Electricity transmission device at high current and high frequency
The electricity transmission device comprises prolonged rigid conductors made of copper, and also a connector comprising a network of flexible elements, such as brazed tubes with cooling channels...
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8116080 |
Container-based data center having greater rack density
A container includes first and second long sides parallel to the container's length. Racks are organized in rows parallel to the container's width. Each rack is receptive to installation of...
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8109324 |
Microchannel heat exchanger with micro-encapsulated phase change material for high flux cooling
A microchannel cooler containing a slurry having a particulate liquid/solid phase change material is provided balancing the interdependent factors of microencapsulated particle size with...
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8107241 |
Electric power conversion apparatus including cooling units
In a conventional cooling device, a heat pipe or a circulation-type liquid cooler provided with a pump is used and therefore, a large space is needed for the cooling device. There is provided a...
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8107234 |
Variable flow computer cooling system for a data center and method of operation
Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of...
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8102653 |
Electric unit having capacitor
A PCU has an inside sealed by a case made of aluminum and a bottom plate. Interior space of the PCU accommodates an IPM, a control substrate, and a capacitor. The IPM is provided to abut an upper...
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8102652 |
Base for power module
A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring...
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8102643 |
Cooling system for high voltage systems
A cooling system for a high voltage system can include a high voltage supply and an electrical component coupled to the high voltage supply. The electrical component can generate heat that needs to...
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8098490 |
Electronic apparatus
According to one embodiment, an electronic apparatus includes a housing, a first heating element in the housing, a heat sink in the housing, a first pressing member, a first heat pipe, and a second...
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8094452 |
Cooling and power grids for data center
A facility is described that includes one or more enclosures defining an interior space, a plurality of power taps, a plurality of coolant supply taps, and a plurality of coolant return taps. A...
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8094454 |
Immersion cooling apparatus for a power semiconductor device
An immersion cooling apparatus includes a multi-terminal thermally conductive module that supports and encloses a power semiconductor device and a housing defining a flow-through chamber in which...
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8094453 |
Compliant conduction rail assembly and method facilitating cooling of an electronics structure
Compliant conduction rail assembly and method are provided for facilitating cooling of an electronics structure. The rail assembly includes a first thermally conductive rail mounted to a surface of...
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8089765 |
Extruded server case
A liquid submersion cooled computer that includes a seamless, extruded main body used to form a liquid-tight case holding a cooling liquid that submerges components of the computer. By forming the...
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8089766 |
Server case with optical input/output and/or wireless power supply
A liquid submersion-cooled computer that is configured to reduce physical structures passing through walls of the computer liquid-tight computer case, which eliminates the amount of sealing needed...
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8087452 |
Contact cooling device
A high performance cold plate cooling device including multiple, relatively thin plates, each having patterns formed thereon that, as arranged within the device, cause turbulence in a fluid passing...
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8089764 |
Case and rack system for liquid submersion cooling of electronic devices connected in an array
A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating...
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8085538 |
Fluid-cooled electronic housing assembly and system
A fluid-cooled electronic housing assembly (“FCEHA”) configured for mounting within a vehicle is described. The FCEHA may be part of a fluid-cooled electronic system (“FCES”) that includes the FCE...
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8085540 |
Tandem fan assembly with airflow-straightening heat exchanger
A tandem fan system with an airflow-straightening heat exchanger removes heat from an airflow while providing optimal airflow pressure. The tandem fan system includes a first fan assembly and a...
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8085539 |
Electronic system and heat dissipation device thereof
A heat dissipation device for an electronic component mounted on a circuit board includes a heat pipe and a fastening assembly. The heat pipe includes an evaporation section and a condensation...
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8081460 |
Liquid-cooled heat radiator
A liquid-cooled heat radiator 1 includes a heat radiation base 2 having a cooling-liquid channel 5, and an expansion tank 7 provided on the heat radiation base 2. The expansion tank 7 has a tank...
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8081478 |
Fluid cooled electronics module cover
An electronics component assembly for cooling high power density components including a fluid cooled module cover. In one embodiment, the electronics component assembly includes a module cover that...
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