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9043035 Dynamically limiting energy consumed by cooling apparatus  
Cooling apparatuses and methods are provided which include one or more coolant-cooled structures associated with an electronics rack, a coolant loop coupled in fluid communication with one or more...
9036349 Cooling device  
A cooling device for an electric energy supply (2) has at least one first heat-dissipating part (3). The power components (4) of the first heat-dissipating part are connected to the cooling device...
9030822 Power module cooling system  
A cooling system is operable to facilitate cooling a power module or other electronic assembly. The cooling system may be configured to facilitate cooling a DC/AC inverter or other electronic...
9030824 Dielectrophoretic cooling solution for electronics  
At least one cooling channel is positioned adjacent to an electronic component. The cooling channel communicates with plenums at each of two opposed axial ends. A dielectric fluid is received in...
9030823 Heat dissipation system for power module  
Disclosed herein is a heat dissipation system for a power module, including: first cooling medium flow parts and second cooling medium flow parts allowing cooling media to flow in first and second...
9019704 Heat storage by phase-change material  
Methods and means related to rejecting heat through thermal storage are provided. A heat sink includes internal cavities containing a phase-change material. Heat from a thermal load is rejected by...
9019705 Server system and server thereof  
A server system and a server thereof are provided. The server system includes a rack, a server, and a fan module, wherein the server and the fan module are located in the rack. The server includes...
9009968 Coolant manifold with separately rotatable manifold section(s)  
A cooling method is provided which includes providing a cooling apparatus that includes one or more coolant-cooled structures attached to one or more electronic components, one or more coolant...
9013873 Container data center  
A container data center includes a container and a server cabinet received in the container. The server cabinet includes a rack and a number of heat dissipation devices mounted to a rear side of...
9013872 Dry-cooling unit with gravity-assisted coolant flow  
A method of fabricating a cooling unit is provided to facilitate cooling coolant passing through a coolant loop. The cooling unit includes one or more heat rejection units and an elevated coolant...
9007221 Liquid cooling of rack-mounted electronic equipment  
A server rack holds a number of modular servers configured for liquid cooling by passing a liquid coolant through interiors of the servers. Failure management of the cooling system is by...
9007767 Power inverter  
A power inverter includes a metallic chassis having a containing space at an inner portion thereof, having a lid on one side in a vertical direction, the other side thereof being enclosed by a...
9003649 Method of making a two-sided fluid cooled assembly  
A fluid cooled electrical assembly that includes a metal box, having a bottom wall, side walls and a top wall. A set of straight-edged pins, each smaller than 3 mm across in widest dimension,...
8995129 Heat radiator and manufacturing method thereof  
A back metal layer (16, 31) has a plurality of stress relaxation spaces (17). Each stress relaxation space (17) is formed to open at least at one of the front surface and the back surface of the...
8982558 Cooling device for a power module, and a related method thereof  
A cooling device for a power module having an electronic module disposed on a base plate via a substrate is disclosed. The cooling device includes a heat sink plate having at least one cooling...
8978747 Deicing louvers for datacenter applications  
A datacenter may use heat collected from a heat exchanger at the exhaust portion of a cooling system to heat inlet louvers for an atmospheric intake. The louvers may have fluid passages through...
8981556 Jet impingement cooling apparatuses having non-uniform jet orifice sizes  
Jet impingement cooling apparatuses having non-uniformly sized jet orifices for producing an array of impingement jets that impinge a target surface are disclosed. In one embodiment, a cooling...
8982552 System for providing physically separated compute and I/O resources in the datacenter to enable space and power savings  
An embodiment of a system and method disaggregate I/O resources from a server's compute resources, such as CPU and memory, by moving the server's local I/O devices to a remote location apart from...
8971041 Coldplate for use with an inverter in an electric vehicle (EV) or a hybrid-electric vehicle (HEV)  
A coldplate for use with an inverter in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The inverter includes a direct current (DC) link capacitor comprising multiple film capacitors...
8964389 Electronic component cooling unit and power converting device  
An electronic component cooling unit includes a housing having a flow path in an interior of the cooling unit. The flow path circulates a cooling medium. Two surfaces, that is, a top surface and a...
RE45376 Cooling systems employing fluidic jets, methods for their use and methods for cooling  
In one embodiment, a cooling system is disclosed. The cooling system comprises: a cooling channel for receiving a cooling media, a substrate disposed near the cooling channel, and a fluidic jet...
8958208 Semiconductor device  
A semiconductor device is disclosed that includes an insulation substrate, a metal wiring layer, a semiconductor element, a heat sink, and a stress relaxation member located between the insulation...
8953321 Cooling arrangement for small form factor desktop computer  
A small form factor desktop computing device having a suitable internal cooling arrangement is disclosed. The device can be formed of a single piece seamless housing machined from a single billet...
8953317 Wicking vapor-condenser facilitating immersion-cooling of electronic component(s)  
Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a...
8953316 Container-based data center having greater rack density  
A container includes first and second long sides parallel to the container's length. Racks are organized in rows parallel to the container's width. Each rack is receptive to installation of...
8953319 Heat-dissipating module  
A heat-dissipating module applied to a circuit board having an electronic element is disclosed. The heat-dissipating module includes a plurality of connecting portions, a contacting portion and a...
8953353 Power converter  
A power converter including a cooler having a cooling flow path in which a refrigerant flows, a base plate to which switching elements are attached, a control circuit board on which...
8944147 Heat exchanger and method for manufacturing same  
In a heat exchanger, fins are simply and accurately positioned in place and heat is efficiently exchanged without increasing manufacture cost, and the plurality of corrugated plate-like fins are...
8944150 Dissipation utilizing flow of refrigerant  
A heat dissipating device includes a chamber with an evaporation portion and a condensation portion, the chamber including a refrigerant. The chamber further includes an evaporation portion...
8947879 Portable computer server enclosure  
A container that holds rack mountable electronics equipment includes a plurality of rack enclosures and a corresponding plurality of enclosure cooling units. Each rack enclosure is movably mounted...
8937810 Electronic assembly with detachable coolant manifold and coolant-cooled electronic module  
Cooled electronic assemblies, and a method of decoupling a cooled electronic assembly, are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more...
8934250 Immersion-cooling of selected electronic component(s) mounted to printed circuit board  
Cooling apparatuses and methods are provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The cooling...
8933557 Semiconductor module and cooling unit  
A semiconductor module including a cooling unit by which a fine cooling effect is obtained is provided. A plurality of cooling flow paths (21c) which communicate with both of a refrigerant...
8934244 System and method for cooling information handling resources  
A system may include a chassis having a pair of stationary rails mechanically coupled thereto. Each stationary rail may receive a corresponding telescoping sliding rail. Each stationary...
8933860 Active cooling of high speed seeker missile domes and radomes  
A thermal management system and method for active cooling of high speed seeker missile domes or radomes comprising bonding to an IR dome or RF radome a heat pipe system having effective thermal...
8934242 Hot aisle containment cooling system and method  
An air containment cooling system for containing and cooling air between two rows of equipment racks includes a canopy assembly configured to enclose a hot aisle defined by the two rows of...
8934246 Modular motor control unit for marine use  
A variable frequency drive system for use with a motor on an offshore platform having a variable frequency drive unit connected with a cooling unit. The variable frequency drive unit includes a...
8929080 Immersion-cooling of selected electronic component(s) mounted to printed circuit board  
A method is provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The method includes providing a housing...
8929071 Low cost manufacturing of micro-channel heatsink  
A cooling device includes a ceramic substrate with a metal layer bonded to an outer planar surface. The cooling device also includes a channel layer bonded to an opposite side of the ceramic...
8929074 Electronic device assemblies and vehicles employing dual phase change materials  
Electronic device assemblies employing dual phase change materials and vehicles incorporating the same are disclosed. In one embodiment, an electronic device assembly includes a semiconductor...
8922998 Coolant manifold with separately rotatable manifold section(s)  
A cooling apparatus is provided which includes one or more coolant-cooled structures attached to one or more electronic components, one or more coolant conduits, and one or more coolant manifolds....
8922034 Power converter for engine generator  
A power converter for an engine generator includes an insulative support that receives and supports circuit components for converting incoming AC power to desired power, such as power suitable for...
8919424 Semiconductor element cooling structure  
A semiconductor element cooling structure includes a semiconductor element, a heat sink on which the semiconductor element is mounted, and a heat storage member attached to the semiconductor...
8917507 Cooling device, electronic substrate and electronic device  
A cooling device is provided. The cooling device is equipped with an electronic substrate on which a heating element has been mounted, and comprises a thermal diffusion unit of a plate-like shape....
8917508 Arrangement of a power semiconductor circuit  
The invention relates to a power electronic assembly (1, 2, 3) with a heat sink (2), a power semiconductor module (1) and a circuit arrangement (3) for controlling the power semiconductor module,...
8917509 Electric power conversion apparatus  
An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series...
8913383 Heat capture system for electrical components providing electromagnetic pulse protection  
An apparatus includes an electrically-powered component, a hermetically-sealed, liquid-impermeable, high thermal-conductivity, container encapsulating the electrically-powered component, and a...
8913386 Cooling module for cooling electronic components  
A cooling module including a condenser, a power module including the cooling module and a method for cooling electric and/or electronic components are provided. The condenser of the cooling module...
8908373 Cooling structure for an electronic component and electronic instrument  
A metal plate that forms a heat-absorbing surface has a center portion which protrudes so as to correspond to the size of a semiconductor element. A fixing support point of a plate spring is...
8902589 Semiconductor module and cooler  
A semiconductor module and a cooler capable of cooling a semiconductor element efficiently. The semiconductor module supplies a refrigerant to a water jacket configuring the cooler, to cool a...