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Match Document Document Title
7453695 Cooling structure of electric device  
A cooling structure of electric devices in a vehicle is structured to hold an inverter ( 300 ) downward of a cooling passage ( 356 ), and to hold a condenser ( 200 ) upward of the cooling passage (...
7450386 Phase-separated evaporator, blade-thru condenser and heat dissipation system thereof  
A phase-separated evaporator includes a boiler plate and a phase separation chamber that includes a housing, connected to the boiler plate, having a gas port and a liquid port; and a phase...
7450385 Liquid-based cooling apparatus for an electronics rack  
A cooling apparatus is provided for facilitating cooling of electronics drawers of an electronics rack. The apparatus includes a bi-fold door assembly configured for mounting to the electronics...
7450384 Card cage with parallel flow paths having substantially similar lengths  
A card cage configured to hold a set of electronics cards comprises a set of walls having an input and an output and a set of flow paths formed in the set of walls to enable a fluid to flow...
7450378 Power module having self-contained cooling system  
A semiconductor module comprises a housing having a cavity therein, and at least one semiconductor device residing within the cavity. A cooling system is contained within the housing and comprises...
7447026 System for hot swapping heat exchangers  
An enclosure for housing electronic equipment comprises a cabinet for receiving the electronic equipment and a cooling system, wherein the cooling system comprises a coolant circulation system...
7443678 Flexible circuit board with heat sink  
A novel flexible circuit board with heat dissipation ability is provided. The flexible circuit board includes a heat sink and a heat spreader having at least one circuit substrate mounted thereon....
7443677 Heat dissipation device  
A heat dissipation device comprises a first heat sink ( 10 ) for thermally contacting with an electronic device, a second heat sink ( 20 ) mounted on the first heat sink, heat pipes ( 40 )...
7443354 Compliant, internally cooled antenna apparatus and method  
A phased array antenna system including a mandrel having compliant portions and an internally formed cooling passageway. The compliant portions are formed by removing portions of material along one...
7440278 Water-cooling heat dissipator  
A water-cooling heat dissipator mounted on an electronic heat-generating element includes a water-cooling head member and at least one heat pipe. The water-cooling head member includes a first...
7438120 Cooling device  
The invention relates to a cooling device, which comprises a cooling fan and a heatsink. The heatsink is directly attached to the heating element to absorb its heat and the cooling fan is disposed...
7436666 Thermal caching for liquid cooled computer systems  
The failure of a data center liquid cooling system can result in a rapid temperature rise in electronic components that may either damage a component, result in the loss of data housed within the...
7433188 Electronic package with direct cooling of active electronic components  
A cooling assembly includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components. A coolant port allows a coolant...
7431071 Fluid circuit heat transfer device for plural heat sources  
A heat sink or heat transfer device particularly for integrated circuits, uses a phase change working fluid in a cyclic flow path having at least one evaporator that serves multiple heat sources....
7430119 Impeller and aligned cold plate  
According to some embodiments, an apparatus may comprise a cold plate comprising a plurality of fins and an impeller comprising a plurality of blades. An output fluid velocity angle defined by the...
7428152 Localized thermal management system  
A localized thermal management system for efficiently thermally managing a plurality of heat producing devices. The localized thermal management system includes a thermal management unit and a...
7428151 Cooling arrangement  
A cooling arrangement with a housing for receiving electronic printed circuit boards or plug-in modules, and with an air-conditioning device which is connected via a coolant-conducting feed line...
7428150 Computing platform component cooling with quick disconnect  
Embodiments for providing cooling for computing platform components are disclosed. In one example embodiment, a coolant may be provided from connector extending through a bracket to heat...
7427566 Method of making an electronic device cooling system  
A method is provided. The method includes forming a conductive layer on an inner surface of a substrate and providing a sacrificial layer over the conductive layer. The method includes forming a...
7426112 Heat dissipating module  
A heat dissipating module includes a releasing member, a heat pipe, which has a first end connected to the releasing member and a second end attached to the top surface of a thermal chip on a...
7424907 Methods and apparatus for an integrated fan pump cooling module  
An integrated fan pump includes a fan, a pump, and an electrical drive mechanism such as an electric motor configured to simultaneously drive both the fan and pump with respect to the housing. A...
7423875 Liquid-cooling heat dissipating device for dissipating heat by a casing  
A liquid-cooling heat dissipating device for dissipating heat by a casing includes a casing having a liquid flow channel and a heat dissipating fin, both integrally formed on a wall of the casing....
7423874 Magneto-hydrodynamic heat sink  
A heat sink uses a pump assembly to generate a magnetic field. A direction of electrically and thermally conductive liquid flowing through the pump assembly is dependent on an orientation of the...
7420810 Base heat spreader with fins  
A thermal management device for the removal of thermal energy useful for, inter alia, electronic devices or other components.
7420808 Liquid-based cooling system for cooling a multi-component electronics system  
A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when...
7420807 Cooling device for electronic apparatus  
The present invention provides a cooling apparatus which is easy to build and to fix it to electronic devices, superior in thermal conduction and heat dissipation, and possible to make thin the...
7420804 Liquid cooling system including hot-swappable components  
The specification discloses an apparatus comprising a cold plate having an inlet and an outlet, the cold plate being attachable to a heat source, a heat exchanger having an inlet and an outlet,...
7418825 IT equipment cooling  
A system for cooling gas heated by passing the gas over heat-producing equipment to cool the equipment comprises a heat exchanger including a first heat transfer mechanism configured to transfer...
7417858 Cooling technique using multiple magnet array for magneto-hydrodynamic cooling of multiple integrated circuits  
A cooling apparatus uses a plurality of pipes to cool one or more integrated circuits disposed on a circuit board. The cooling apparatus uses an array of magnets to create magnetic fields across...
7417857 Power-electronic-cooling device  
A device which is used to cool the power electronics of a vehicle, by circulating a liquid through a cooling circuit which is mounted under a plate bearing the power electronics. According to the...
7414846 Cooling structure for interface card  
A cooling structure for interface card for cooling the heating component on an interface card includes a heat sink, a metallic hood, and a water block, wherein the heat sink has a heat conducting...
7414845 Circuit board assembly for a liquid submersion cooled electronic device  
A circuit board assembly, for example, a computer motherboard, for use in a liquid submersion cooled electronic device, for example, a computer, is configured to facilitate movement of the cooling...
7414844 Liquid cooled heat sink with cold plate retention mechanism  
A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in...
7414843 Method and apparatus for a layered thermal management arrangement  
Embodiments of the present invention include an apparatus, method, and system for providing a layered thermal management arrangement. Embodiments of the present invention provide a layered thermal...
7408780 Compliant thermal interface structure utilizing spring elements with fins  
A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements...
7408778 Heat sinks for dissipating a thermal load  
Heat sinks for dissipating a thermal load are disclosed that include: a heat sink base capable of receiving a thermal load from a thermal source; heat-dissipating fins mounted on the heat sink...
7408776 Conductive heat transport cooling system and method for a multi-component electronics system  
A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based...
7408775 Electrical module and support therefor with integrated cooling  
A rack system is disclosed that includes a plurality of electrical modules ( 48 ), a frame ( 10 ) supporting the plurality of electrical modules ( 48 ) that includes a plurality of frame members (...
7405936 Hybrid cooling system for a multi-component electronics system  
A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least...
7405935 Service tray for a thermal management system  
A service tray for a thermal management system for providing convenient access to components within a liquid thermal management system. The service tray for a thermal management system includes a...
7404433 Liquid cooled heat sink  
A liquid cooled heat sink includes: a casing defining an inner space and provided with a partitioning wall dividing the inner space into upper and lower chambers and formed with a fluid passage in...
7403392 Liquid submersion cooling system  
A portable, self-contained liquid submersion cooling system that is suitable for cooling a number of electronic devices, including cooling heat-generating components in computer systems and other...
7403384 Thermal docking station for electronics  
For transferring heat generated by an electronic device, a component heat exchanger is thermally coupled to the electronic device. A component-side thermal interface is thermally coupled to the...
7400505 Hybrid cooling system and method for a multi-component electronics system  
A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least...
7400504 Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled  
Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple...
7400503 Systems for low cost coaxial liquid cooling  
According to some embodiments, systems for low cost coaxial liquid cooling may be provided. In some embodiments, a system may comprise an axis. The system may further comprise a heat exchanger...
7400502 Connector heat transfer unit  
A connector heat transfer unit is presented. A number of embodiments are presented. Each embodiment includes a housing capable electrically connecting one or more heat generating components to an...
7398818 Fluidic pump for heat management  
A heat producing device is placed in contact with a heat exchanger that is fluidically coupled to a fluid pump. The fluid pump operates to pumps fluid through a closed fluidic system between the...
7397665 Integral heat-dissipation system for electronic boards  
A system of at least one integrated electronic board device with integral cooling system. The device comprises an integrated electronic board, with a plurality of heat-dissipating electronic...
7397664 Heatspreader for single-device and multi-device modules  
A heatsink includes a heatsink base, an elastomeric base, multiple slider pins and an alignment frame coupled to the heatsink base. The elastomeric base includes multiple holes, the elastomeric...
Matches 1 - 50 out of 1014 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >