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7619889 |
Controllable heat transfer medium system and method for use with a circuit board
A system and method are provided for controlling a transfer of heat between circuit board components. Included is a circuit board with components mounted thereon. Also provided is a controllable...
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7619887 |
Arrangement for cooling electronic modular units in equipment and network cabinets
The invention relates to an arrangement for cooling equipment and network cabinets, particularly server cabinets, in which the fans are integrated into a door. The resulting fan door, in the closed...
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7616444 |
Gimballed attachment for multiple heat exchangers
One or more heat exchangers are coupled to one or more heat sources using a single gimballed joining mechanism. The joining mechanism includes a gimbal plate and a gimbal joint. The gimbal joint...
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7616443 |
Cooling device for electrical power units of electrically operated vehicles
A cooling device for an electrical power unit of electrically operated vehicles, comprising at least one power section and at least one control section. A first cooling circuit containing a heat...
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7614247 |
Cooling arrangement
A cooling arrangement with a housing for receiving electronic printed circuit boards or plug-in modules, and with an air-conditioning device which is connected via a coolant-conducting feed line...
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7613001 |
Heat dissipation device with heat pipe
A heat dissipation device is used for removing heat from at least two adjacent first and second electronic devices in a computer enclosure. The heat dissipation device includes a first heat sink...
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7609519 |
Coolant control unit and cooled electronics system employing the same
A coolant control unit for a liquid cooled electronics system is provided, which includes an external coolant inlet and outlet for receiving and returning external coolant; an internal coolant loop...
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7609518 |
Cooling computer components
A tank and a lid are configured to mate to provide a substantially airtight container for containing a processing board for a computer and a liquid. A cooling system is configured to cool the...
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7605456 |
Inverter unit
To provide an inverter unit with excellent manufacturing performance and with current carrying capacity increased and size reduced by further increasing the cooling efficiency of a power efficiency...
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7604040 |
Integrated liquid cooled heat sink for electronic components
A fluid heat exchanger unit cools an electronic device with a cooling fluid supplied to an upper portion of a cooling housing. A refrigerant is disposed in a lower portion of the cooling housing...
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7602609 |
Cooling system and method of use
A system of cooling and method of use that includes a connector having a data reader capable of reading a wireless identifier and/or a breaker box capable of routing liquid cooling to at least one...
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7602608 |
Narrow gap spray cooling in a globally cooled enclosure
Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and...
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7599184 |
Liquid cooling loops for server applications
Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or...
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7595988 |
Thermal management system and method for electronic assemblies
According to an embodiment of the present invention, a thermal management system for an electronic assembly includes an electronic component coupled to a substrate, the substrate coupled to a...
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7595987 |
Heat dissipation assembly for computing devices
Computing devices, including laptop computers, desk top computers, servers and video game terminals employ microprocessors which generate considerable heat. In fact, the heat generated from...
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7593227 |
Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing
An isolation valve assembly, a coolant connect/disconnect assembly, a cooled multi-blade electronics center, and methods of fabrication thereof are provided employing an isolation valve and...
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7586747 |
Scalable subsystem architecture having integrated cooling channels
A method for building scalable electronic subsystems is described. Stackable modules employ copper substrates with solder connections between modules, and a ball grid array interface is provided at...
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7583501 |
Electronic apparatus
An electronic apparatus includes a case, a fan, a plurality of electronic parts, and a heat sink mounted for each electronic part. The heat sink includes a fluid unit, and a shutter plate...
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7580261 |
Semiconductor cooling system for use in electric or hybrid vehicle
A cooling system is provided for use in conjunction with a semiconductor assembly including a first semiconductor device and a second semiconductor device electrically coupled to the first...
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7573715 |
High density storage system
The present invention provides methods and systems for storage of data. In one aspect, the invention provides a data storage system that includes a plurality of storage devices, such as, disks, for...
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7564685 |
Motherboards with integrated cooling
A computer apparatus includes a first motherboard having a top surface and a bottom surface and a second motherboard having a top surface and a bottom surface. The motherboards each have mounted...
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7561429 |
Power converter unit
A power converter unit comprises: a metal casing; a power module mounted in the metal casing and equipped with two or more power semiconductor devices; a metal plate disposed on the power module...
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7561424 |
Method for cooling electronic components in an unmanned flying vehicle and a device for carrying out the method
A device for cooling electronic components of a control unit in an unmanned flying vehicle. A container contains a liquid cooling medium. A temperature sensor is adapted to sense the temperature of...
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7559209 |
Liquid cooling system
A liquid cooling system having cooling units individually assigned to electronic component groups housed in a rack or a switchgear cabinet, which are to be cooled, and having a monitoring and...
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7558064 |
Cooling apparatus
The cooling apparatus comprises an air supply system, a water supply system, and a sprayer, and has a structure such that water and compressed air are mixed and the air is sprayed together with the...
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7558063 |
Server with a flexible cooling scheme
A server with a flexible cooling scheme is disclosed. The server comprises a case and a fan. When the server is in a first cooling configuration the fan is configured to force the gas past a first...
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7551443 |
Heat-dissipating module connecting to a plurality of heat-generating components and related device thereof
A heat-dissipating module includes a heat pipe and a heat-dissipating device. The heat pipe has a first end, a second end and a partition pipe section. The first end is connected to a first...
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7551442 |
Embedded heat pipe in a hybrid cooling system
One embodiment of a system for cooling a heat-generating device includes a base adapted to be coupled to the heat-generating device, a housing coupled to the base, a liquid channel formed between...
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7551441 |
Heat dissipation assembly for computing devices
An improvement for an assembly for use in a computing device which includes a microprocessor and a motherboard and a socket for receiving and making electric contact with the microprocessor. A heat...
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7551440 |
System and method for cooling an electronic component
A cooling system has at least one heat conducting element in thermal contact with an electronic component. A heat exchanger is in fluid communication with the heat conducting element. The heat...
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7551439 |
Fluid cooled electronic assembly
An electronic assembly is provided having a thermal cooling fluid, such as a liquid, for cooling an electronic device within a sealed compartment. The assembly includes a housing generally defining...
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7551438 |
Information processing blade and information processing apparatus using the same
An information processing blade computer includes a board having a blade structure such that the board is stored in a main body of an information processing apparatus; a part contained in a circuit...
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7551435 |
Heat-absorbing member, cooling device, and electronic apparatus
Electronic components differing in height (a CPU 2 a, a capacitor 2 b, and coil elements 2 c ) are mounted on a printed circuit board 1. A heat-absorbing member 3 is provided above the...
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7548428 |
Computer device heat dissipation system
A computer device heat dissipation system comprising a heat exchanger having a plurality of fins connected to a heat pipe, at least one of the plurality of fins comprises at least one aperture to...
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7548427 |
Apparatus and docking station for cooling of computing devices
An apparatus with some embodiments is described having cooling capabilities for a computing device. In some embodiments, the apparatus may include a thermoelectric component (TEC) to transfer...
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7548425 |
Heat-Receiving apparatus and electronic equipment
A heat-receiving plate of a pump has a heat-receiving surface and a guide. The heat-receiving surface is thermally connected to a heat-generating body. The guide is provided on the heat-receiving...
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7548424 |
Distributed transmit/receive integrated microwave module chip level cooling system
A radar transmit and receive integrated microwave module with conductively cooled condenser side rails and one or more vacuum brazed fluid distribution manifold cold plates in fluid communication...
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7545648 |
Cooling structure using rigid movable elements
An information processing system includes: a processor; a memory; an input/output subsystem; and a bus coupled to the processor, the memory and the input/output subsystem. The system further...
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7545644 |
Nano-patch thermal management devices, methods, & systems
Nano-scale thermal management devices, methods, and systems are provided. According to some embodiments, a thermal management device configured to remove heat from a heated area can comprise an...
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7544049 |
Cooling device and centrifugal pump to be used in the same device
A cooling device has a closed circulating channel for circulating coolant, and in the channel, a radiator and a contact-heat-exchanger type centrifugal pump are provided. A heat-producing...
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7543457 |
Systems for integrated pump and reservoir
According to some embodiments, systems for an integrated pump and reservoir may be provided. In some embodiments, a pump may comprise a housing defining an inlet to accept a fluid and an outlet to...
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7542292 |
System for efficiently cooling a processor
One embodiment of a system for efficiently cooling a processor includes an active hybrid heat transport module adapted to be integrated with a fansink. The hybrid heat transport module comprises...
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7542291 |
Electronic circuit configuration having a printed circuit board thermally coupled to a heat sink
In order to improve the heat dissipation capacity in an electronic circuit configuration with one or more printed circuit boards thermally coupled by one flat side to a heat sink having at least...
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7542290 |
Computer device cooling system
A computer device cooling system comprising a heat exchanger comprising an airflow face and a plurality of cooling fans disposed to form an airflow face, the cooling fan airflow face sized to...
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7539016 |
Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewalls
The present invention discloses a method of confining a liquid metal alloy within a closed-loop system; distributing a first portion of the liquid metal alloy in a cavity within the closed-loop...
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7537048 |
Integrated liquid cooling system for electronic components
An integrated liquid cooling system ( 100 ) includes a heat absorbing member ( 10 ), a heat dissipating member ( 20 ) and a pump ( 15 ). The heat absorbing member defines therein a fluid flow...
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7537047 |
Liquid-cooling heat sink
A liquid-cooling heat sink includes a base ( 10 ), a heat exchanger ( 30 ), a housing ( 20 ), an inlet ( 26 ) and an outlet ( 27 ). The heat exchanger ( 30 ) has a hollow ( 33 ) formed therein, and...
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7532467 |
Thermal management devices, systems, and methods
Briefly described, embodiments of this disclosure include thermal management devices, systems, and methods, convection cooling devices, convection cooling systems, convection cooling methods,...
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7529091 |
Power semiconductor module and method for cooling a power semiconductor module
The invention relates to a power semiconductor module comprising a plurality of power semiconductors that are fixed to a first side of a printed circuit board ( 26 ), and a cooling device that acts...
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7529089 |
Heat-dissipating device connected in series to water-cooling circulation system
A heat-dissipating device includes a MOSFET heat dissipator, a south bridge heat dissipator, a north bridge heat dissipator and a water block connector. A heat pipe is provided between each heat...
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