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Match Document Document Title
7619887 Arrangement for cooling electronic modular units in equipment and network cabinets  
The invention relates to an arrangement for cooling equipment and network cabinets, particularly server cabinets, in which the fans are integrated into a door. The resulting fan door, in the closed...
7614247 Cooling arrangement  
A cooling arrangement with a housing for receiving electronic printed circuit boards or plug-in modules, and with an air-conditioning device which is connected via a coolant-conducting feed line...
7599761 Cooling assist module  
Systems associated with moving heat out of a computer are described. One exemplary system embodiment includes a large heat exchanger, large, quiet, automatically redundant fans, automatically...
7564685 Motherboards with integrated cooling  
A computer apparatus includes a first motherboard having a top surface and a bottom surface and a second motherboard having a top surface and a bottom surface. The motherboards each have mounted...
7558064 Cooling apparatus  
The cooling apparatus comprises an air supply system, a water supply system, and a sprayer, and has a structure such that water and compressed air are mixed and the air is sprayed together with the...
7558063 Server with a flexible cooling scheme  
A server with a flexible cooling scheme is disclosed. The server comprises a case and a fan. When the server is in a first cooling configuration the fan is configured to force the gas past a first...
7543457 Systems for integrated pump and reservoir  
According to some embodiments, systems for an integrated pump and reservoir may be provided. In some embodiments, a pump may comprise a housing defining an inlet to accept a fluid and an outlet to...
7532476 Flow solutions for microelectronic cooling  
Flow solutions for cooling one or more microelectronic device(s) are generally described. In this regard, according to one example embodiment, a cooling apparatus comprising a heat sink base...
7508670 Thermally conductive shelf  
Embodiments of the present disclosure include devices, systems, and methods. For example, one device embodiment of a thermally conductive shelf for operation with a conduction-cooled electronic...
7508669 Cooling device for an electronic component, especially for a microprocessor  
A cooling device ( 1 ) for an electronic component ( 3 ), especially for a microprocessor, includes a heat sink ( 7, 9 ), which can be connected to the electronic component ( 3 ) to be cooled, such...
7480142 Boost spring holder for securing a power device to a heatsink  
A system and method of dissipating heat form electronic components in an electronic device is disclosed. The apparatus includes a retaining device having a cavity extending upwardly a predetermined...
7475494 Hybrid thermal management system  
A hybrid thermal management system for providing simultaneous spray cooling and dry cooling for a plurality of cards. The hybrid thermal management system includes a chassis having a global spray...
7466548 Cooling device for cooling a heat-generating component, and electronic apparatus having the cooling device  
A cooling device having a heat receiving portion, a heat radiating portion, a heat pipe, and a fan. The heat receiving portion is held on a wiring board and thermally connected to a heat-generating...
7466023 Semiconductor light emitting device and plant cultivating system  
Guard electrodes 2 which are electrically connected with a conductive portion of a cooling water passage 23 through connection lines 3 are respectively provided in the middle of a water inlet...
7460370 Heat dissipation assembly  
A heat dissipation assembly ( 100 ) is provided. The heat dissipation assembly ( 100 ) comprises a chassis ( 20 ) of an electronic product, a heat sink ( 10 ) having a bottom portion thereof being...
7457117 System for controlling the temperature of electronic devices  
The system for controlling the temperature of electronic devices under test includes a housing, a seal, a heat-exchanger within the housing, and a Peltier module within the housing. The housing is...
7457112 Disk array apparatus  
A disk array apparatus including a rack-shaped basic frame, and a plurality of disk boxes that can be inserted into and pulled out of the basic frame depth-wise. Each disk box has: disk drive...
7455103 Electronic equipment provided with cooling system  
An electronic equipment is provided, which comprises a liquid-cooling system and a cooling fan as a cooling system, efficiently cools the liquid-cooling system, and reduces fan noise. The...
7450388 Power converter connection configuration  
EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power...
7433188 Electronic package with direct cooling of active electronic components  
A cooling assembly includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components. A coolant port allows a coolant...
7430119 Impeller and aligned cold plate  
According to some embodiments, an apparatus may comprise a cold plate comprising a plurality of fins and an impeller comprising a plurality of blades. An output fluid velocity angle defined by the...
7428152 Localized thermal management system  
A localized thermal management system for efficiently thermally managing a plurality of heat producing devices. The localized thermal management system includes a thermal management unit and a...
7428151 Cooling arrangement  
A cooling arrangement with a housing for receiving electronic printed circuit boards or plug-in modules, and with an air-conditioning device which is connected via a coolant-conducting feed line...
7428150 Computing platform component cooling with quick disconnect  
Embodiments for providing cooling for computing platform components are disclosed. In one example embodiment, a coolant may be provided from connector extending through a bracket to heat...
7417858 Cooling technique using multiple magnet array for magneto-hydrodynamic cooling of multiple integrated circuits  
A cooling apparatus uses a plurality of pipes to cool one or more integrated circuits disposed on a circuit board. The cooling apparatus uses an array of magnets to create magnetic fields across...
7414846 Cooling structure for interface card  
A cooling structure for interface card for cooling the heating component on an interface card includes a heat sink, a metallic hood, and a water block, wherein the heat sink has a heat conducting...
7404261 Dry-wet thermal management system  
A dry-wet thermal management system for providing simultaneous spray cooling and dry cooling for a plurality of cards. The dry-wet thermal management system includes a chassis having a dry chamber...
7403392 Liquid submersion cooling system  
A portable, self-contained liquid submersion cooling system that is suitable for cooling a number of electronic devices, including cooling heat-generating components in computer systems and other...
7382616 Cooling system for computer hardware  
The present invention represents a significant advancement in the field of cooling systems for computer hardware. In one embodiment, a system for cooling a heat-generating electronic device is...
7372698 Electronics equipment heat exchanger system  
An electronics equipment heat exchanger system for thermally managing the electronic devices of a computer server and the exhaust air emitted from the computer server. The electronics equipment...
7371056 Fluid pump, cooling system and electrical appliance  
A fluid pump includes a case including a pump chamber, a reserve tank for storing spare liquid and located in the case but outside the pump chamber and formed so that a space independent of the...
7369409 Apparatus, method, and control program for cooling electronic devices  
A thermal distribution detecting unit detects a thermal distribution state on a surface of an electronic device. An emission control unit identifies a position to be cooled in accordance with the...
7365980 Micropin heat exchanger  
An apparatus including a micropin thermal solution is described. The apparatus comprises a substrate and a number of micropins thermally coupled to the substrate. The micropins are arranged in a...
7362575 Cooling method use diamond pins and heat pipes  
An apparatus for cooling a microprocessor includes a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal...
7359198 System and method for inducing turbulence in fluid for dissipating thermal energy of electronic circuitry  
A method for cooling a circuit comprises generating movement of fluid along a path through a closed-loop system. The method further comprises inducing turbulence in the fluid by movement of at...
7352577 Liquid-cooled heat dissipation module  
A liquid-cooled heat dissipation module for circularly dissipating heat from a heat source. The liquid-cooled heat dissipation module includes a fan having a base; a pump disposed on the base; a...
7342785 Cooling device incorporating boiling chamber  
A cooling device incorporating a boiling chamber includes a heat sink ( 10 ), a fan ( 30 ) and a fan duct ( 50 ) covering the heat sink and the fan therein. The heat sink includes a chamber ( 14 )...
7333331 Power unit device and power converter device  
A power unit device which can be made small, with which special measures of plant and labor at the time of assembly are unnecessary, and of which assembly is easy and universality in its...
7298619 Cable management arm with integrated heat exchanger  
In electronic and/or electrical equipment, a cable management assembly is configured for usage in an electronic and/or electrical equipment rack assembly. The cable management assembly comprises at...
7295437 Heat dissipation device for multiple heat-generating components  
A heat dissipation device includes a first heat sink ( 10 ), a second heat sink ( 20 ) and four heat pipes ( 30 ) thermally connecting the first heat sink and second heat sink. The first heat sink...
7295436 Cooling system for computer components  
A power supply housing ( 12 ) is mounted inside of a computer housing ( 10 ). Housing ( 12 ). It includes components ( 34 ) that generate heat when the computer is being used. The power supply...
7292438 Liquid-cooling heat dissipation module  
A liquid-cooling heat dissipation module. The liquid-cooling heat dissipation module circularly dissipates heat from a heat source. The liquid-cooling heat dissipation module includes a fan, a...
7278467 Liquid-cooled heat radiator kit  
A liquid-cooled heat radiator kit is disclosed to include a heat radiator, which has radiation elements at the top wall and parallel grooves at the bottom wall, two liquid-cooled heat pipes...
7273088 One or more heat exchanger components in major part operably locatable outside computer chassis  
One or more heat exchanger components of an apparatus are in major part operably locatable outside a computer chassis and serve to reduce one or more temperatures of one or more heat producing...
7265975 CPU heat dissipating device structure  
A heat dissipating device includes a heat dissipating block, a liquid contained in the heat dissipating block, a first conduit joined to one end of the heat dissipating block, a second conduit...
7262965 Thermal structure for electric devices  
A thermal structure includes a fin module, a heat sink base, a heat pipe, a fan housing, and a fan. One end of the heat pipe is connected with the fin module and the other end of the heat pipe is...
7256998 Heat-dissipating structure with air-guiding device  
A heat-dissipating structure is assembled on a Central Processing Unit, and has a water-cooling device, a fan and a support device. The support device is assembled between the water-cooling device...
7254023 Heat dissipation assembly  
A heat dissipation assembly includes a blower holder, a blower, a first heat sink and a second heat sink. The blower includes an inlet and an outlet and is attached to the blower holder. The blower...
7230832 Cooled electronic assembly and method for cooling a printed circuit board  
A cooled electronic assembly includes an integrated-circuit device carrier (such as a printed circuit board), a device (such as a flip chip), a liquid pump, a molding material, a heat exchanger,...
7215546 Pump, electronic apparatus, and cooling system  
The present invention provides a cooling pump, an electronic apparatus, and a cooling system in which positioning between a heat generating unit and a cooling pump can be achieved easily. The...
Matches 1 - 50 out of 206 1 2 3 4 5 >