Match Document Document Title
7286352 Thermally expanding base of heatsink to receive fins  
Embodiments include apparatus, methods, and systems providing a heatsink for electronic heat generating components. In one embodiment, the heatsink includes a metal base having a plurality of...
7286357 Computer system with cooling device for CPU  
A computer system includes a casing, a motherboard, a CPU mounted on the motherboard and a cooling device. The casing includes a pair of parallel panels. Air inlets and air outlets are respectively...
7281893 Supporting frame with locating function  
A supporting frame with locating function mainly includes a supporting portion and a plurality of connecting portions. The supporting portion is provided at a central area with a plurality of...
7278209 Method for manufacturing heat sink for use in heat sink fan  
A method for manufacturing a heat sink for use in a heat sink fan is provided. A heat-sink base portion defining a central axis and a circumferential surface is formed. A plurality of...
7278467 Liquid-cooled heat radiator kit  
A liquid-cooled heat radiator kit is disclosed to include a heat radiator, which has radiation elements at the top wall and parallel grooves at the bottom wall, two liquid-cooled heat pipes...
7277282 Integrated circuit cooling system including heat pipes and external heat sink  
An apparatus includes an integrated circuit (IC) package and a heat sink having a base and a plurality of fins extending from the base. The apparatus further includes a plurality of heat pipes....
7277281 Heat dissipation device having wire fixture  
A heat dissipation device is for use in a computer enclosure, the computer enclosure having a group of wires ( 20 ) therein. The heat dissipation device includes a heat sink assembly. A wire...
7277280 Heat dissipation device having a dual-fan arrangement  
A heat dissipation device includes a heat sink ( 22 ), a first fan ( 24 ) disposed on one part of the heat sink, a second fan ( 26 ) disposed on another part of the heat sink and a cover ( 30 )...
7277244 Lens barrel for image taking lens  
A heat sink is attached to a subject-side end portion of a barrel body of a lens barrel. The heat sink is provided with a large number of radiation fins formed in whorl. A heat pipe is disposed...
7273091 Cooling apparatus for heat generating devices  
A cooling apparatus for heat generating devices such as semiconductor chips comprises a parallel disk fan in the middle of a set of heat sink fins. The parallel disk fan has radial elements placed...
7272004 Frequency converter  
A frequency converter includes a circuit substrate, a housing that covers at least the circuit substrate, a radiating section in which gases at an intake face are exhausted from an exhaust face so...
7269010 Heat dissipation device  
A heat dissipation device for dissipating heat from an electronic package comprises a heat sink, a fan, a fan mounting structure, and fixing devices. The heat sink comprises a main body which...
7269008 Cooling apparatus and method  
A cooling apparatus is provided with an electrostatic flow modifier to be complementarily positioned relative to a cooling fluid flow to modify at least one characteristic of the cooling fluid flow...
7265975 CPU heat dissipating device structure  
A heat dissipating device includes a heat dissipating block, a liquid contained in the heat dissipating block, a first conduit joined to one end of the heat dissipating block, a second conduit...
7265974 Multi-heatsink integrated cooling device  
A multi-heatsink integrated cooling device comprises a crossflow cooler and a primary heatsink thermally connected by heat-spreading means. The crossflow cooler comprises a casing with an inlet and...
7262965 Thermal structure for electric devices  
A thermal structure includes a fin module, a heat sink base, a heat pipe, a fan housing, and a fan. One end of the heat pipe is connected with the fin module and the other end of the heat pipe is...
RE39784 Structure for removable cooler  
A removable cooler on the memory module wherein the PC board is able to attach on the memory module without any modification. The cooler contains a heat sink module and a cooler module. The heat...
7259964 Display device  
A display device includes a main display unit including a casing, a display panel, a light source for emitting light as backlight, and a reflector for reflecting the light toward the display panel;...
7259961 Reconfigurable airflow director for modular blade chassis  
A reconfigurable airflow director for modular blade chassis. The airflow director includes multiple duct channels having adjustable inlets and/or outlets. The airflow director may be reconfigured...
7256993 Adjustable heat sink shroud  
An adjustable heat sink shroud includes an insert that may be included within the interior of the heat sink shroud depending on the size of the heat sink enclosed within the shroud. The presence of...
7256997 Heat dissipating device having a fan duct  
A heat dissipating device ( 8 ) for cooling a number of electronic devices. The heat dissipating device includes a heat sink ( 7 ), a fan ( 6 ) mounted to a side of the heat sink and a fan duct ( 5...
7254023 Heat dissipation assembly  
A heat dissipation assembly includes a blower holder, a blower, a first heat sink and a second heat sink. The blower includes an inlet and an outlet and is attached to the blower holder. The blower...
7251135 Easy release server cooling fan with integrated spring and method for using same  
A fan assembly formed of a fan, at least one fan grill comprising a face panel and at least one side panel comprising a spring slot the fan grill coupled to the fan, and a spring coupled to the fan...
7247820 Heat sink and information processing device  
A heat sink that is disposed on a heating element and absorbs the heat generated by the heating element includes: a contact surface to which recessed grooves are formed and the region of which...
7248475 Wireless device enclosure using piezoelectric cooling structures  
An enclosure for a wireless device includes a first compartment and a second compartment. The first compartment is to house some or all of the electronic circuitry of the wireless device and is...
7248477 Fan-shaped heat-dissipating device  
A fan-shaped dissipating device, which is assembled on a chip of an erect PCB, has a conductive board, and a plurality of fins. The fins are respectively connected on an outside surface of the...
7245056 Axial fan motor and cooling unit  
Disclosed is an axial fan motor for air-cooling a heat sink of a heating element and thermally connected to the heat sink. The casing of the axial fan motor is formed of a plurality of laminated...
7245492 Heat-dissipating module and structure thereof  
A heat-dissipating structure. The heat-dissipating structure comprises a plurality of first and second conductive plates. Each first conductive plate has a first base surface, a first reference...
7239513 Power control device  
The power control device has three units, each having two cooling fins set in opposed positions. Every cooling fin has an SCR mounted to adjust the voltage change. One of the two opposed cooling...
7237599 Cooler with blower comprising heat-exchanging elements  
A cooler for electronic components comprises a heatsink, a blower, and an electric drive with a rotor and a stator. The heatsink comprises heat-exchanging means, inflow and outflow openings, and a...
7233501 Interleaved memory heat sink  
A heat sink comprises a heat sink base and a row of heat sink extensions that are attached to one side of the heat sink base. An interleaved heat sink structure includes a first row and a second...
7230826 Method and apparatus for mounting a fan  
A fan mounting apparatus includes a base, a fan mount which is operable to couple to the base, and a latch member pivotally coupled to the fan mount, the latch member operable to reduce vibration...
7222660 Cabinet with an environmentally-sealed air-to-air heat exchanger  
A cabinet which utilizes an air-to-air heat exchanger to remove heat generated from within the cabinet prevents water and dust from entering the air-to-air heat exchanger by forcing cooler external...
7221568 Heat dissipating module with engaging assembly  
A heat dissipating module. A frame accommodates a fan. An engaging assembly is coupled to the frame and includes an engaging body, a tongue, a resilient element, a wrench bar, and a connecting...
7221566 System for cooling a processor while reducing air flow noise  
A system is described for cooling a processor. In one embodiment, a heat sink assembly has a fan and air channels. In addition, a heat sink lid that is configured to cover only a region above the...
7218518 Heat dissipation device with heat pipes  
A heat dissipation device with heat pipes is described. The heat dissipation device has at least one L-shaped heat pipe, a plurality of heat fins, and a heat sink base. One end of the L-shaped heat...
7215548 Heat dissipating device having a fin also functioning as a fan duct  
A heat dissipating device for cooling a number of electronic devices, includes a heat sink assembly ( 10 ) and a fan ( 20 ) mounted to a side of the heat sink assembly. The heat sink assembly...
7215544 Apparatus for enhancing heat transfer efficiency of endothermic/exothermic article  
An apparatus for enhancing heat transfer efficiency of an endothermic/exothermic article includes a heat sink disposed on the endothermic/exothermic article to enhance heat transmission, a...
7212404 Integrated heat sink device  
An integrated heat sink device, which is utilized to dissipate the heat generated by heat-generating elements with different angles of radiation surface (for instance, CPU and display chip are with...
7209352 Heat dissipation device incorporating fan duct  
A heat dissipation device includes two heat sinks ( 30 ) mounted on two electronic components ( 16 ) which is mounted within a server ( 10 ), two fans ( 40 ) mounted on a mounting plate ( 14 ) of...
7209354 Ball grid array package with heat sink device  
The present invention provides a heat sink device for the package device to improve the heat dissipating efficiency. The heat sink device includes a first heat sink assembly and a second heat sink...
7204750 Airflow guide structure and manufacture thereof  
An airflow guide structure and manufacture thereof is used to allow components of an airflow guide are cut by molds in a factory to form thin plates in each of which has a plurality of bendable...
7203063 Small form factor liquid loop cooling system  
An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the...
7198094 Finned device for removing heat from an electronic component  
A device for removing heat from an electronic component, comprising a heat sink that can be coupled to the electronic component and conduct heat therefrom. A finned appurtenance coupled to the heat...
7180740 Method and apparatus for side-type heat dissipation  
The present invention is a method and an apparatus for side-type heat dissipation. According to the present invention, a heat dissipation unit is deposed on a CPU to absorb the heat it generates; a...
7178583 Fan module for a heat dissipating device  
A heat dissipating device includes a fin unit disposed on a supporting seat, and an anchoring frame disposed on the fin unit and engaging detachably the supporting seat for anchoring the fin unit...
7178587 Heat-dissipating module  
A heat-dissipating module comprises a conductive part, a fan and a flow-guiding shield. The conductive part has a receiving plane being connected to the fan and fits with the flow-guiding shield....
7177152 Collective and restrictive inhalant and radiating device for appliances  
A collective and restrictive inhalant and radiating device for appliances includes a heat inhaler in a CPU of a computer or other electric appliances, a first heat radiation block connected to the...
7174952 Heat dissipation device  
The present invention relates to a heat dissipation device comprising a heat dissipation base and an upper lid. The heat dissipation base is integrally formed by a metal material with superior heat...
7167364 Cooler with blower between two heatsinks  
A cooler for cooling of electronic components comprises at least two heatsinks thermally connected with each other by heat spreading means, and a double inlet centrifugal blower comprises a casing...