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8179676 |
Optical interconnects in cooling substrates
Fluid-cooling technology developed for printed circuit boards (PCBs) and electronics assemblies is combined with optical-based interconnect technology, thereby enabling efficient fabrication of...
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8174826 |
Liquid cooling system for stackable modules in energy-efficient computing systems
A computing system is provided. In the computing system, a plurality of modules physically arranged in a three dimensional hexadron configuration. In the computing system, the at least one module...
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8174828 |
Narrow gap spray cooling in a globally cooled enclosure
Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and...
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8169780 |
Power conversion device
In a power conversion device including: a converter which steps up or down a voltage of a direct current power supply; and an inverter which converts the direct current voltage obtained by the...
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8169779 |
Power electronics substrate for direct substrate cooling
Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical...
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8164901 |
High efficiency heat removal system for rack mounted computer equipment
An efficient method of heat removal from rack mounted computer equipment, network gear and other electronic equipment, consisting of solid heat conducting components in direct contact with the heat...
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8159823 |
Electric vehicle and method of cooling vehicular DC/DC converter
The present invention relates to an electric vehicle and a method of cooling a vehicular DC/DC converter. A fuel cell vehicle, as one example of an electric vehicle, includes a DC/DC converter...
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8125781 |
Semiconductor device
A semiconductor device comprises at least a semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip and a seal member for covering and sealing...
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8125777 |
Methods and apparatus for electrical components
Methods and apparatus for electrical components according to various aspects of the present invention may be implemented in conjunction with an electrical system comprising a heat generating...
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8120914 |
Semiconductor cooling apparatus
A semiconductor cooling apparatus having a tank forming body and semiconductor power device mounting substrates is disclosed. The tank forming body includes a first outer plate, a second outer...
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8098490 |
Electronic apparatus
According to one embodiment, an electronic apparatus includes a housing, a first heating element in the housing, a heat sink in the housing, a first pressing member, a first heat pipe, and a second...
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8089765 |
Extruded server case
A liquid submersion cooled computer that includes a seamless, extruded main body used to form a liquid-tight case holding a cooling liquid that submerges components of the computer. By forming the...
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8081472 |
Electric circuit device, electric circuit module, and power converter
The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line...
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8081465 |
Cooling apparatus for semiconductor chips
A cooling apparatus for semiconductor chips includes radiation fins formed on the opposite surface of metal base opposite to the surface of metal base, to which an insulator base board mounting...
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8072758 |
Automotive inverter assembly
In an embodiment, an automotive inverter assembly has at least one component for cooling. The inverter assembly has a supporting body for supporting the at least one component. The supporting body...
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8064197 |
Heat management using power management information
A multi-core microprocessor provides an indication of the power management state of each of the cores on output terminals. Cooling of the cores is adjusted responsive to the indication of the power...
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8064198 |
Cooling device for semiconductor element module and magnetic part
A cooling device for a semiconductor element module and a magnetic part, includes: a water-cooled type heat sink having a cooling water passage; a semiconductor element module including a plurality...
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8063533 |
Electronic device having piezoelectric pump which may prevent or reduce deterioration of s/n ratio which may be caused by air noise of the pump during a recording operation
An electronic device having a piezoelectric pump. The electronic device includes: an audio input section; an audio recording section recording input sound from the audio input section; a...
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8059404 |
Power inverters
Power inverters include a frame and a power module. The frame has a sidewall including an opening and defining a fluid passageway. The power module is coupled to the frame over the opening and...
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8045329 |
Thermal dissipation mechanism for an antenna
According to one embodiment, a heat dissipation system includes an elongated radar absorbing member configured with a thermal dissipation mechanism. The radar absorbing member extends proximate a...
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8027161 |
Electronic power converter and mounting structure of semiconductor device
An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the...
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8024585 |
Method for managing storage, program and system for the same
A system including plural storage devices provides a technique for controlling storage devices in which files are located by a file system, and turning on or off the storage devices based on...
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8023287 |
Electronic device
An electronic device includes: a board having a first connector; a housing in which the board is disposed and which has a work opening for allowing external work for the board; and a cable which...
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7978468 |
Power converter
The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat...
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7974095 |
Power source apparatus
A power source apparatus includes a power source module which is formed of a plurality of power source elements, a case which houses the power source module and a cooling liquid, a fan which is...
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7969735 |
Power converter
The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat...
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7965510 |
Power conversion apparatus and power module
A power conversion apparatus includes a power module, four corners of which are fastened to a cooling jacket from its front surface by a front surface side fastening apparatus that includes nuts...
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7961466 |
High voltage bushing, a method of cooling a conductor thereof, and an electric power distribution system comprising such a bushing
A high voltage bushing including an elongated electric conductor, a tubular insulator surrounding the conductor, and cooling mechanism for cooling the conductor. The cooling mechanism includes at...
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7961477 |
Housing comprising a liquid-tight electric bushing
A housing comprising a liquid-tight electric bushing is provided. The housing comprises an opening and a printed circuit board comprising at least first and second layers. The first layer is a top...
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7960655 |
Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory module
A PCB can include an insulating member, a cooling member, and a circuit pattern. The cooling member can be built into the insulating member. The cooling member can have a cooling passageway through...
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7957169 |
Power inverter
A power inverter comprises at least a box-shaped housing; and a power module, a smoothing capacitor, a base plate made of a flat plate, and a rotating electric machine control circuit board...
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7954332 |
Temperature control systems and methods
Systems and methods for controlling the temperature of an electrical device is described. The system includes a heat sink system in conjunction with a thermoelectric assembly. The systems and...
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7952191 |
Semiconductor device
A semiconductor device of the present invention includes a wiring substrate, a plurality of semiconductor chips mounted on the wiring substrate, and a radiation plate arranged over a plurality of...
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7948758 |
Circuit board unit and method for production thereof
The invention relates to a circuit board unit and a method for production thereof. The circuit board unit comprises a circuit board topmost laminate with conductive tracks on the upper side for...
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7948767 |
Integrated circuit packaging structure and method of making the same
The invention provides an integrated circuit packaging and method of making the same. The integrated circuit packaging includes a substrate, a semiconductor die, a heat-dissipating module, and a...
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7940524 |
Remote cooling of a phased array antenna
A self-contained cooling system for a phased array antenna includes a cooling structure, a heat exchanger, and a pump for circulating a fluid coolant around a coolant loop. The cooling system...
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7936563 |
On-chip interconnect-stack cooling using sacrificial interconnect segments
The present invention relates to an integrated-circuit device and to a method for fabricating an integrated-circuit device with an integrated fluidic-cooling channel. The method comprises forming...
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7936560 |
Cooling device and electronic equipment including cooling device
A blade server including a cooling structure to be loaded with a CPU of high performance is provided. In order to enhance draining performance of a condensed working fluid which stays between fins,...
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7929294 |
Hybrid cooling system for outdoor electronics enclosure
A cooling system for an outdoor electronic enclosure, with separate compartments for electronics and batteries, includes separate cooling devices for each compartment so that optimal temperatures...
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7924564 |
Integrated antenna structure with an embedded cooling channel
According to one embodiment of the disclosure, an integrated antenna structure comprises a plurality of radiating elements, cooling channels embedded directly within each of the plurality of...
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7916481 |
Electronic board and cold plate for said board
The invention relates to an electronic board that comprises: a planar projection plate (42) provided between an intake opening (70) and a discharge opening (72); and a plurality of rectilinear...
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7911787 |
Electronic assembly
An electronic assembly includes a casing structure defining an interior space for receiving at least one electronic component, an exterior space isolated from the interior space and a heat...
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7903416 |
Flat panel display
A flat panel display including a base frame, a display panel module, and a heat-conductive structure is provided. The base frame includes a control unit. The display panel module is disposed in the...
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7903405 |
Electronic device enclosures having improved ventilation to dissipate heat
Electronic device enclosures providing improved heat dissipation are described herein. An example enclosure for holding an electronic circuit board includes a housing having a first portion coupled...
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7889499 |
Integrated replaceable energy storage and coolant module
There is disclosed a self-contained electronic apparatus containing at least some power-dissipating components which may require cooling. The self-contained electronic apparatus may also include a...
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7886816 |
Intelligent cooling method combining passive and active cooling components
A method for cooling a semiconductor including passive cooling including transferring heat via passive cooling components; active cooling including transferring heat via active cooling components;...
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7882624 |
Method of forming electronic package having fluid-conducting channel
To accommodate high power densities associated with high-performance integrated circuits, an integrated circuit (IC) package includes a heat-dissipating structure in which heat is dissipated from a...
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7869209 |
Electronic rack combining natural convection and forced air circulation for its cooling
This rack (1) houses rackable electronic gear modules (2, 3) and has cooling by natural convection thanks to ventilation orifices (20, 21) provided in its bottom (10) and top (11) walls and forced...
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7864535 |
Electronic device
According to one embodiment, a heat sink includes an extended end screwed to a printed circuit board. The extended end includes a screw hole and an engagement projection. A notch is formed by...
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7855887 |
Inverter unit
An inverter unit includes a reactor and switching elements that form a voltage boost circuit that boosts a power supply voltage; a switching element for an inverter that forms an inverter circuit...
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