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7321495 |
Capacitor and method for manufacturing the same
A multilayer ceramic capacitor ( 10 ) having reduced inductance which is separated into a first layer body ( 11 ) and a second layer body ( 12 ). The first layer body ( 11 ) and the second layer...
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7317622 |
Method and apparatus for supplying power to a semiconductor device using a capacitor DC shunt
A power shunt for use within a semiconductor device of a type having a motherboard and an integrated circuit package electrically coupled to the motherboard and of a type having a spaced portion...
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7312975 |
Laminated capacitor and manufacturing method thereof
A laminated capacitor includes: a dielectric body; first terminal electrodes arranged at intervals on one surface of the dielectric body; second terminal electrodes arranged at intervals on the...
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7310217 |
Monolithic capacitor and mounting structure thereof
A monolithic capacitor includes a main capacitor unit having first capacitor portions and a second capacitor portion arranged in a direction of lamination, with the first capacitor portion located...
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7304830 |
Laminated ceramic capacitor
A laminated ceramic capacitor including a capacitor body where internal electrodes and a dielectric layer are alternately laminated, and external electrodes are provided on the end faces thereof....
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7304831 |
Ceramic electronic component and multilayer capacitor
A multilayer capacitor comprises a ceramic sintered body, an internal electrode disposed in the ceramic sintered body, and an external electrode disposed on an external surface of the ceramic...
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7295421 |
Multilayer ceramic electronic components and method for manufacturing the same
A multilayer ceramic electronic component includes a skittered laminated body including internal electrodes that have a strength that is greater than that of ceramic layers provided therein. End...
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7295420 |
Multilayer electronic component and manufacturing method thereof
Internal electrode layers are superimposed in a dielectric substrate 1 at intervals. Step absorption layers are respectively provided on lateral sides of the internal electrode layers. A side...
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7292430 |
Multi-layer chip capacitor
A multi-layer chip capacitor includes a capacitor body; first and second internal electrodes alternately arranged therein and separated by dielectric layers, each of the internal electrodes having...
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7292429 |
Low inductance capacitor
A low inductance multi-layer capacitor. The capacitor includes interleaved parallel internal electrode plates with dielectric there between. Each internal electrode plate includes two lead-out tabs...
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7280342 |
Low inductance high ESR capacitor
A low inductance multi-layer capacitor. The capacitor comprises interleaved parallel internal electrode plates with dielectric there between. Each internal electrode plate comprises two lead-out...
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7277268 |
Laminated ceramic capacitor
A metal alloy powder containing at least two alloying elements selected from the group of Ni, Cu, Cr, Sn, Mn, Co and W containing 1 to 99% by weight Ni, 1 to 99% by weight Cu, 6 to 60% by weight...
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7277270 |
Multilayer filter
An objective is to provide a multilayer filter capable of preventing an electric current rapidly flowing by virtue of varistor effect, from passing as noise, upon application of noise of a high...
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7273502 |
Method for manufacturing capacitor
A capacitor and a method for manufacturing the same provide a branched capacitor with a large capacitance and a super-slim structure. The method includes sintering a ceramic substrate; forming a...
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7265995 |
Array capacitors with voids to enable a full-grid socket
An array capacitor is described for use with an integrated circuit (IC) mounted on an IC package. The array capacitor includes a number of first conductive layers interleaved with a number of...
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7263764 |
Method for adjusting performance characteristics of a multilayer component
A method for adjusting the equivalent series resistance (ESR) of a multi-layer component includes providing at least first and second layers separated by an insulating layer, providing a resistive...
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7262951 |
De-coupling capacitors produced by utilizing dummy conductive structures integrated circuits
A de-coupling capacitor module using dummy conductive elements in an integrated circuit is disclosed. The de-coupling module comprises at least one circuit module having one or more active nodes,...
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7262952 |
Multilayer chip capacitor
The invention provides a multilayer chip capacitor reduced in ESL. A capacitor body has a plurality of dielectric layers stacked in a thickness direction. A plurality of first and second internal...
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7248459 |
Integrated multi-capacitor network
A novel multi-capacitor divider network in which two capacitors are fabricated in a single package, using a common dielectric material, is disclosed. In a preferred embodiment of the present...
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7236347 |
Ceramic structure, method for manufacturing ceramic structure, and nonreciprocal circuit device
A method of forming a ceramic structure includes disposing substrate-forming ceramic green sheets having conductors, internal conductors, and via conductors so as to sandwich connecting...
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7236346 |
Semiconductor apparatus and method of charging desired number of capacitors
A capacitor charging semiconductor apparatus including a plurality of serially connected capacitors to be charged. A direct current source is applied to the plurality of capacitors. A plurality of...
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7230816 |
Ultra low inductance multi layer ceramic capacitor
A multilayer capacitor having a low parasitic inductance includes a first electrode, a second electrode, a dielectric, a first contact, and a second contact. The first electrode is substantially...
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7230815 |
Multilayered chip capacitor and printed circuit board having embedded multilayered chip capacitor
A multilayered chip capacitor (MLCC) includes internal electrodes and external electrodes formed to be perpendicular to the internal electrodes, whereby parasitic capacitance is reduced, resulting...
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7224571 |
Forming a substrate core with embedded capacitor and structures formed thereby
Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a substrate core by attaching a first dielectric layer to a second conductive layer of a...
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7218504 |
Capacitor device and method
A capacitor with reduced equivalent series resistance and reduces equivalent series inductance is provided. Capacitors are provided with multiple plate assemblies that couple to a common single...
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7214618 |
Technique for high efficiency metalorganic chemical vapor deposition
A technique for more efficiently forming conductive elements, such as conductive layers and electrodes, using chemical vapor deposition. A conductive precursor gas, such as a platinum precursor...
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7215531 |
Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board
An apparatus is provided for packaging a laminated capacitor made to have a low ESL value and is used for a decoupling capacitor to be connected to a power supply circuit for a MPU chip providing a...
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7212395 |
Capacitor design for controlling equivalent series resistance
According to some embodiments, a capacitor includes a first external capacitor plane including a first at least one terminal of a first polarity, and a first internal capacitor plane including a...
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7209340 |
Semiconductor device and MIM capacitor
An MIM capacitor comprises first and second conductor patterns embedded in a first interlayer insulation film so as to extend continuously in a mutually opposing relationship and forming a part of...
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7203055 |
Method of manufacturing multilayered ceramic capacitor by spin coating and multilayered ceramic capacitor
Disclosed herein is a method of manufacturing a multilayered ceramic capacitor by a spin coating process, and a multilayered ceramic capacitor obtained by the above method. The method of the...
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7196909 |
AC coupling circuit having a large capacitance and a good frequency response
This invention is directed to reduce degradation, loss, and reflection of high frequency signals of a coupling circuit for an alternating current. The coupling circuit, for connecting a first...
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7196898 |
Thin film capacitor, high-density packaging substrate incorporating thin film capacitor, and method for manufacturing thin-film capacitor
A capacitor capable of being incorporated into a packaging substrate, which capacitor includes a high-dielectric-constant layer, and an upper electrode layer and a lower electrode layer sandwiching...
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7193839 |
Methods of storing and retrieving electric energy
A method and apparatus for storing large quantities of electric energy in a small mass and volume at a high dc electric potential. Dispersed conductive particles 16 in a dispersing medium 15 ...
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7193838 |
Printed circuit dielectric foil and embedded capacitors
A dielectric circuit board foil ( 400, 600 ) includes a conductive metal foil layer ( 210, 660 ), a crystallized dielectric oxide layer ( 405, 655 ) disposed adjacent a first surface of the...
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7190567 |
Capacitor and its manufacturing method, and semiconductor device
A capacitor is provided having a structure in which an insulation film is interposed between a first electrode and a second electrode. The insulation film includes SrTiO 3 as a main component, and...
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7177138 |
Chip-type electronic component
A chip-type electronic component comprises a chip element body including an inner circuit element, and a pair of terminal electrodes electrically connected to the inner circuit element. The pair of...
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7173803 |
Low impedance inter-digital capacitor and method of using
An inter-digital capacitor may be used in a power socket for a microelectronic device. In one embodiment an integrated, low-resistance power and ground terminal configuration is disclosed. The...
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7170737 |
Window via capacitor
A window via capacitor comprises a stacked multilayer configuration of at least one bottom layer, a plurality of first and second layers, a transition layer and a cover layer. An alternative window...
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7167352 |
Multilayer chip varistor
A multilayer chip varistor comprises a multilayer body and a pair of external electrodes formed on the multilayer body. The multilayer body has a varistor section and a pair of outer layer sections...
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7164573 |
High ESR or fused ceramic chip capacitor
A fused or high ESR ceramic capacitor for power applications has a fuse or resistor inserted between an end termination and a terminal for one set of alternating conductive plates in the capacitor....
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7152291 |
Method for forming plated terminations
Improved method steps for terminating multilayer electronic components are disclosed. Monolithic components are formed with plated terminations whereby the need for typical thick-film termination...
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7154735 |
Decoupling module for decoupling high-frequency signals from a power supply line
A decoupling module for decoupling high-frequency signals from A power supply line, the module including a layer ( 30 ) of dielectric material which is arranged between a first and a second...
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7151659 |
Gapped-plate capacitor
In a semiconductor device, a capacitor is provided which has a gap in at least one of its plates. The gap is small enough so that fringe capacitance between the sides of this gap and the opposing...
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7151661 |
Capacitor module and semiconductor device using the same
A capacitor module incorporating a ceramic capacitor having terminal members for reducing stress caused by thermal stress or electrostriction in the ceramic capacitor itself, and a semiconductor...
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7149073 |
Electroceramic component
An electroceramic component includes a base body, contact layers on the base body, a dielectric layer in the base body that includes a single-phase perovskite ceramic having a composition of Ag(Nb...
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7149071 |
Controlled resistance capacitors
Some embodiments of the present invention include capacitors with controlled resistance.
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7145429 |
Multilayer capacitor
A multilayer capacitor comprises a multilayer body in which a plurality of dielectric layers are laminated, and first to fourth outer conductors formed on the multilayer body. The multilayer body...
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7136272 |
Low parasitic inductance capacitor with central terminals
A capacitor has at least one plate of a first polarity and at least two plates of a second polarity, with a terminal electrically connected to the at least two plates of the second polarity such...
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7136274 |
Embedded multilayer printed circuit
An embedded multilayer printed circuit includes a first ground plane ( 105, 1205, 1405 ) of a multilayer printed circuit board and an embedded layer. The embedded layer includes a co-planar...
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7130181 |
Semiconductor device
A semiconductor device is disclosed which has a plurality of unit capacitive elements. At least one lead-out electrode of bottom electrodes of the unit capacitive elements of the capacitive element...
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