|
Match
|
Document |
Document Title |
|
|
7391110 |
Apparatus for providing capacitive decoupling between on-die power and ground conductors
One embodiment of the present invention provides capacitive decoupling on the surface of a semiconductor die, instead of providing the decoupling on a package or printed circuit board to which the...
|
|
|
7379288 |
Monolithic ceramic electronic component and method for manufacturing the same
The monolithic ceramic electronic component includes a first external electrode 5 , a second external electrode 6 , and a ceramic sintered compact 4 including internal electrodes 2 and 3 ,...
|
|
|
7375948 |
Variable charge packet integrated circuit capacitor
A variable IC capacitor includes a semiconductor layer doped to contain mobile charge carriers. Capacitor electrodes C 1 and C 2 are disposed adjacent to each other on the layer's surface, gate...
|
|
|
7364598 |
Method of making an orientation-insensitive ultra-wideband coupling capacitor
A method of making an orientation-insensitive ultra-wideband coupling capacitor, including the steps of securing an unterminated multi-layer capacitor of a low frequency portion of the...
|
|
|
7355838 |
Green sheet coating material, green sheet, production method of green sheet and production method of electronic device
A green sheet coating material including ceramic powder, a binder resin including a butyral based resin as the main component, and a solvent. The solvent includes a first solvent medium having a...
|
|
|
7355836 |
Array capacitor for decoupling multiple voltage rails
An array capacitor is provided. The array capacitor includes a plurality of ground planes inside a dielectric substrate, and a plurality of ground vias. The ground vias electrically connect the...
|
|
|
7355835 |
Stacked capacitor and method of fabricating the same
A capacitor has stacking capacitor elements, each of which contains a conductor plate, a first band being an insulator and disposed around the plate, a second band being an insulator and disposed...
|
|
|
7352557 |
Vertical capacitor apparatus, systems, and methods
An apparatus and system, as well as fabrication methods therefor, may include a plurality of vertically-oriented plates separated by dielectric layers, wherein the vertically-oriented plates...
|
|
|
7352060 |
Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate
A multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring structure is disclosed. The multilayer wiring substrate includes a dielectric layer including a resin...
|
|
|
7350281 |
Method of protecting a capacitor
An electric device includes an electric element, such as a wound film capacitor, with power input and output leads. The electric element includes a coating layer of parylene that provides moisture...
|
|
|
7349195 |
Thin film capacitor and method for manufacturing the same
The present invention provides the steps of (a) forming a first electrode on a substrate via an adhesion enhancing layer, (b) forming a capacitor insulating film containing a laminated film, in...
|
|
|
7344981 |
Plated terminations
A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrode elements and a plurality of internal anchor tabs. Portions of the...
|
|
|
7342805 |
Capacitor plate for substrate components
A method and apparatus to mount a capacitor plate to a substrate, under a component. One embodiment of the invention involves a method to assemble a capacitor plate on a substrate. A second...
|
|
|
7342766 |
On-chip capacitor
An on-chip capacitor having a plurality of capacitor layers. Each capacitor layer includes a pair of frames. A first frame of the pair is electrically connected to first frames on each other...
|
|
|
7339780 |
Copper termination inks containing lead free and cadmium free glasses for capacitors
A reduction resistant lead-free and cadmium-free glass composition that is particularly suitable for use in conductive ink applications is disclosed. The invention includes a capacitor, which...
|
|
|
7333318 |
Multilayer capacitor and mold capacitor
A multilayer capacitor 1 has a laminated body 20 configured by laminating a plurality of dielectric substrates 2 each having a plurality of internal electrodes 3 and 5 formed on its main...
|
|
|
7327555 |
Capacitor structure
A capacitor structure includes a first electrode structure, a second electrode structure, and a capacitor dielectric. The first electrode structure includes a plurality of first conductive plates...
|
|
|
7327554 |
Assembly of semiconductor device, interposer and substrate
An assembly includes a semiconductor device having surface-connecting terminals, a substrate having surface-connecting pads, and a capacitor having an approximately plate-shaped capacitor main body...
|
|
|
7327553 |
Feedthrough capacitor filter assemblies with laminar flow delaminations for helium leak detection
A feedthrough filter capacitor assembly includes a capacitor having first and second sets of conductive electrode plates embedded within a dielectric body and mounted to the hermetic terminal of an...
|
|
|
7324327 |
Laminated ceramic capacitor
A laminated ceramic capacitor includes a body having an inner layer portion and an outer layer portion and a plurality of terminal electrodes spaced apart from each other in a length direction of...
|
|
|
7324324 |
Multilayer electronic component and manufacturing method thereof
A multilayer electronic component is composed of a ceramic body obtained by laminating a plurality of ceramic layers via a conductor layer. The conductor layer is a plated film and extracted to one...
|
|
|
7321495 |
Capacitor and method for manufacturing the same
A multilayer ceramic capacitor ( 10 ) having reduced inductance which is separated into a first layer body ( 11 ) and a second layer body ( 12 ). The first layer body ( 11 ) and the second layer...
|
|
|
7312975 |
Laminated capacitor and manufacturing method thereof
A laminated capacitor includes: a dielectric body; first terminal electrodes arranged at intervals on one surface of the dielectric body; second terminal electrodes arranged at intervals on the...
|
|
|
7310238 |
Thin-film embedded capacitance, method for manufacturing thereof, and a printed wiring board
The present invention provides a thin-film embedded capacitance having a substantial electrostatic capacity per unit area, and a method for manufacturing thereof. A thin film embedded capacitance...
|
|
|
7310217 |
Monolithic capacitor and mounting structure thereof
A monolithic capacitor includes a main capacitor unit having first capacitor portions and a second capacitor portion arranged in a direction of lamination, with the first capacitor portion located...
|
|
|
7310216 |
EMI filter terminal assembly with wire bond pads for human implant applications
An electro-magnetic interference filter terminal assembly for active implantable medical devices includes a structural pad in the form of a substrate or attached wire bond pad, for convenient...
|
|
|
7307829 |
Integrated broadband ceramic capacitor array
A monolithic capacitor structure includes opposed and overlapping plates within a dielectric body, which are arranged to form a lower frequency, higher value capacitor. Other conductive structure...
|
|
|
7304831 |
Ceramic electronic component and multilayer capacitor
A multilayer capacitor comprises a ceramic sintered body, an internal electrode disposed in the ceramic sintered body, and an external electrode disposed on an external surface of the ceramic...
|
|
|
7304830 |
Laminated ceramic capacitor
A laminated ceramic capacitor including a capacitor body where internal electrodes and a dielectric layer are alternately laminated, and external electrodes are provided on the end faces thereof....
|
|
|
7301751 |
Embedded capacitor
An embedded capacitor comprises a first substrate on which a plurality of electrically insulated electrode patterns and a ground pattern are formed, a second substrate separated from the first...
|
|
|
7301218 |
Parallel capacitor of semiconductor device
Disclosed herein is a parallel capacitor of a semiconductor device. According to the present invention, a first capacitor and a second capacitor are formed in different layers of the same region,...
|
|
|
7295421 |
Multilayer ceramic electronic components and method for manufacturing the same
A multilayer ceramic electronic component includes a skittered laminated body including internal electrodes that have a strength that is greater than that of ceramic layers provided therein. End...
|
|
|
7295420 |
Multilayer electronic component and manufacturing method thereof
Internal electrode layers are superimposed in a dielectric substrate 1 at intervals. Step absorption layers are respectively provided on lateral sides of the internal electrode layers. A side...
|
|
|
7292430 |
Multi-layer chip capacitor
A multi-layer chip capacitor includes a capacitor body; first and second internal electrodes alternately arranged therein and separated by dielectric layers, each of the internal electrodes having...
|
|
|
7277270 |
Multilayer filter
An objective is to provide a multilayer filter capable of preventing an electric current rapidly flowing by virtue of varistor effect, from passing as noise, upon application of noise of a high...
|
|
|
7277269 |
Refractory metal nickel electrodes for capacitors
A capacitor with conductive layers arranged in parallel relationship. The conductive layers have nickel alloyed or add mixed with a refractory metal in an amount sufficient to raise the melting...
|
|
|
7262952 |
Multilayer chip capacitor
The invention provides a multilayer chip capacitor reduced in ESL. A capacitor body has a plurality of dielectric layers stacked in a thickness direction. A plurality of first and second internal...
|
|
|
7259956 |
Scalable integrated circuit high density capacitors
The present invention provides several scalable integrated circuit high density capacitors and their layout techniques. The capacitors are scaled, for example, by varying the number of metal layers...
|
|
|
7256980 |
Thin film capacitors on ceramic
Thin-film capacitors are formed on ceramic substrates having high capacitance densities and other desirable electrical and physical properties. The capacitor dielectrics are annealed at high...
|
|
|
7248458 |
Orientation-insensitive ultra-wideband coupling capacitor and method of making
An orientation-insensitive ultra-wideband coupling capacitor. The orientation-insensitive ultra-wideband coupling capacitor includes a plurality of external surfaces, a low frequency portion, and a...
|
|
|
7242571 |
Dielectric ceramic, manufacturing method therefor, and multilayer ceramic capacitor
A dielectric ceramic is obtained by the steps of obtaining a reaction product composed of a barium titanate base composite oxide represented by the general formula (Ba 1−h−i−m Ca h Sr i Gd m...
|
|
|
7236346 |
Semiconductor apparatus and method of charging desired number of capacitors
A capacitor charging semiconductor apparatus including a plurality of serially connected capacitors to be charged. A direct current source is applied to the plurality of capacitors. A plurality of...
|
|
|
7227736 |
Capacitor device and method of manufacturing the same
A capacitor device includes a capacitor Q constituted by a lower electrode ( 12 ) formed an a substrate ( 10 ), a dielectric film ( 14 ), and an upper electrode ( 16 ); an insulating film ( 18 )...
|
|
|
7224571 |
Forming a substrate core with embedded capacitor and structures formed thereby
Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a substrate core by attaching a first dielectric layer to a second conductive layer of a...
|
|
|
7218504 |
Capacitor device and method
A capacitor with reduced equivalent series resistance and reduces equivalent series inductance is provided. Capacitors are provided with multiple plate assemblies that couple to a common single...
|
|
|
7217136 |
Printed circuit board with right-angled trace and method for making the same
A printed circuit board having right-angled trace and a method for making the right-angled trace is to apply semi-conductor material and form an interface with a P-type semi-conductive layer and a...
|
|
|
7216406 |
Method forming split thin film capacitors with multiple voltages
A method for forming a split thin film capacitor for providing multiple power and reference supply voltage levels to electrical devices such as integrated circuits, may be useful in space...
|
|
|
7215531 |
Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board
An apparatus is provided for packaging a laminated capacitor made to have a low ESL value and is used for a decoupling capacitor to be connected to a power supply circuit for a MPU chip providing a...
|
|
|
7212396 |
Method for fabricating a thin film resistor
A method of fabricating high resistivity thin film resistors. An isolation region is formed on a substrate to isolate the active regions. A polysilicon layer is formed above the substrate. A...
|
|
|
7212395 |
Capacitor design for controlling equivalent series resistance
According to some embodiments, a capacitor includes a first external capacitor plane including a first at least one terminal of a first polarity, and a first internal capacitor plane including a...
|