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7620511 |
Method for determining plasma characteristics
Methods for determining characteristics of a plasma are provided. In one embodiment, a method for determining characteristics of a plasma includes obtaining metrics of current and voltage...
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7619870 |
Electrostatic chuck
An electrostatic chuck device includes an electrostatic chuck section including a substrate and a power supply terminal for applying a DC voltage to an electrostatic-adsorption inner electrode; and...
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7615133 |
Electrostatic chuck module and cooling system
An electrostatic chuck module for a semiconductor manufacturing apparatus which can be cooled with water and in which there is no penetration leak includes an electrostatic chuck plate of alumina...
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7608162 |
Plasma processing apparatus and method
A plasma processing apparatus includes a high-frequency power source for applying bias power to an electrode on which a substrate is disposed, an insulating layer formed on a surface of the...
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7606020 |
Light exposure apparatus
A light exposure apparatus includes a chuck adapted to receive a substrate on a surface thereof, a plurality of first lift pins in the chuck that are able to move up and down to load/unload the...
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7595972 |
Clamp for use in processing semiconductor workpieces
An apparatus is provided to improve clamping of a work piece to a support surface. The apparatus includes a support base, an insulator layer disposed on the support base, an electrode layer...
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7592261 |
Method for suppressing charging of component in vacuum processing chamber of plasma processing system and plasma processing system
When the state of the vacuum processing chamber is switched to an idle state in which an insulating fluid is circulated while a semiconductor wafer W is not placed in the vacuum processing chamber...
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7589950 |
Detachable electrostatic chuck having sealing assembly
A detachable electrostatic chuck is capable of being attached to a pedestal in a process chamber. The chuck comprises an electrostatic puck having a ceramic body with an embedded electrode. The...
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7586734 |
Electrostatic chuck
An electrostatic chuck having a good soaking feature and allowing a wafer to reach a saturation temperature quickly is provided. The chuck, which has a platy body with a pair of main surfaces, one...
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7583492 |
Method of determining the correct average bias compensation voltage during a plasma process
A method for removing a substrate that is attached to a bipolar electrostatic chuck (ESC) by application of a bipolar ESC voltage is provided which includes discontinuing the bipolar ESC voltage...
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7583491 |
Electrostatic chuck to limit particle deposits thereon
An ion implanter includes an electrostatic chuck. The electrostatic chuck is configured to repel charged particles from a surface of the electrostatic chuck to limit deposits of the charged...
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7582367 |
Ceramic member and manufacturing method for the same
A ceramic member is provided including a base including an alumina sintered body, an yttria sintered body formed on the alumina sintered body, an intermediate layer including yttrium and aluminum...
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7580238 |
Electrostatic chuck structure for semiconductor manufacturing apparatus
An electrostatic chuck structure according to example embodiments of the present invention may include at least one specific region of a conductor having a thickness relatively smaller than those...
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7576967 |
Electrostatic chuck
An electrostatic chuck includes a ceramic base having an electrode embedded in vicinity to a holding face for holding a substrate. On a back side of this ceramic base, provided are a terminal...
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7567423 |
Pressure assisted wafer holding apparatus and control method
An electrostatic wafer holding apparatus includes an electrostatic chucking pedestal and a bi-directional backside conduit in fluid communication with a backside of the chucking pedestal. The...
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7567422 |
Plasma processing apparatus and plasma processing method
In the plasma processing apparatus including a processing chamber for plasma-processing a processed substrate, plasma generating unit that generates plasma in the processing chamber, and a wafer...
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7567421 |
Bipolar electrostatic chuck
A bipolar electrostatic including a chuck main body having a mounting surface; an annular electrode member formed in an annular configuration wit a center opening and fixed onto the mounting...
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7564672 |
Transfer-ESC based on a wafer
A mobile transportable electrostatic chuck for clamping thin wafers ( 12 ) without permanent connection to an external power supply unit is described. The mobile chuck allows a safe handling of...
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7558045 |
Electrostatic chuck assembly with capacitive sense feature, and related operating method
A semiconductor workpiece processing system for treating a workpiece, such as a semiconductor wafer, is provided. A related operating control method is also provided. The system includes an...
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7554787 |
Wall crawling devices
Described herein is electroadhesion technology that permits controllable adherence between two objects. Electroadhesion uses electrostatic forces of attraction produced by an electrostatic adhesion...
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7551419 |
Electroadhesion
Described herein is electroadhesion technology that permits controllable adherence between two objects. Electroadhesion uses electrostatic forces of attraction produced by an electrostatic adhesion...
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7544393 |
Substrate table, production method therefor and plasma treating device
The susceptor of a plasma treating device, or the electrostatic chuck of a substrate table, is formed by ceramic thermal spray method. A thermally sprayed ceramic layer is pore-sealed by...
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7544251 |
Method and apparatus for controlling temperature of a substrate
A pedestal assembly and method for controlling temperature of a substrate during processing is provided. In one embodiment, the pedestal assembly includes a support member that is coupled to a base...
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7542263 |
Overlay correction by reducing wafer slipping after alignment
A method and apparatus for correcting overlay errors in a lithography system. During lithographic exposure, features being exposed on the wafer need to overlay existing features on the wafer....
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7528935 |
Lithographic apparatus, device manufacturing method, and device manufactured thereby
A lithographic projection apparatus is disclosed. The apparatus includes an illuminator for conditioning a beam of radiation, and an article holder. The article holder includes a plurality of...
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7525787 |
Electrostatic chuck assembly with dielectric material and/or cavity having varying thickness, profile and/or shape, method of use and apparatus incorporating same
An electrostatic chuck assembly having a dielectric material and/or having a cavity with varying thickness, profile and/or shape is disclosed. The electrostatic chuck assembly includes a conductive...
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7511936 |
Method and apparatus for dynamic plasma treatment of bipolar ESC system
The disclosure generally relates to a method for method for plasma etching a substrate in a plasma reactor comprising positioning the substrate on an electrostatic chuck inside the plasma reactor;...
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7511935 |
Electrostatic chuck and method of its manufacture
An electrostatic chuck structure for holding an article is presented. The chuck structure comprises an electrically insulating chuck body layer having a first flat surface for holding the article...
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7508646 |
Substrate holding technique
A stage system includes a fine-motion stage on which a substrate holding member for holding a substrate is mounted, a rough-motion stage on which the fine-motion stage is mounted, a stage for...
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7505118 |
Wafer carrier
A wafer carrier for carrying a wafer includes a transparent base and a conducting layer. The transparent base has dimensions similar to that of the wafer, and bonds the wafer with a bonding layer....
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7495881 |
Chucking method and processing method using the same
The invention provides an electrostatically chucking technology capable of chucking a workpiece formed of an insulator or a workpiece attached with an object to be processed such as a semiconductor...
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7489494 |
Guard wafer for semiconductor structure fabrication
An apparatus which allows tightly coupling of the device wafer to the electrostatic chuck of the process chamber after the process chamber is conditioned. The apparatus includes (a) a process...
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7488543 |
Aluminum nitride conjugate body and method of producing the same
An aluminum nitride joined body comprising two pieces of aluminum nitride sintered body plates joined together without using adhesive, and a metal layer formed on a portion of the junction...
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7483256 |
Electrostatic chuck
An electrostatic chuck includes a base plate, an electrode layer having flexibility, covering the surface of the base plate, and a power supply unit for electrically connecting the electrode layer...
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7480129 |
Detachable electrostatic chuck for supporting a substrate in a process chamber
A detachable electrostatic chuck can be attached to a pedestal in a process chamber. The electrostatic chuck has an electrostatic puck comprising a dielectric covering at least one electrode and a...
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7469165 |
Machined part and method of manufacture
A machined part is provided. The machined part is formed from a porous substrate material that is machined to shape. After machining to shape, a resin is infused into the machined part precursor to...
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7468880 |
Electrostatic chuck
The object of the present invention is to provide an electrostatic chuck which has high plasma resistance and high capability of cooling a material to be clamped. As for the basic structure of the...
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7466531 |
Substrate holding system and exposure apparatus using the same
A substrate holding system for holding a substrate based on vacuum attraction and electrostatic attraction including a rim configured to support the substrate, a protrusion for the electrostatic...
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7457098 |
Electrostatic chuck
An electrostatic chuck is provided which includes a circular ceramic plate having an electrostatic attractive electrode, a mounting surface for supporting a waferhich which is formed on one of the...
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7455735 |
Width adjustable substrate support for plasma processing
An electrode assembly for use in a plasma processing system that includes removable rails that are adjustable for reconfiguring the electrode to accommodate substrates of different widths. The...
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7450365 |
Electrostatic chuck
The object of the present invention is to provide an electrostatic chuck in which the surface can be kept smooth after being exposed to plasma, so as to protect a material to be clamped such as a...
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7446993 |
Alumina sintered body
An alumina sintered body comprises an alumina substrate having a first main surface and a second main surface opposing each other, an embedded film electrode made of a metal and embedded in the...
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7446284 |
Etch resistant wafer processing apparatus and method for producing the same
A wafer processing apparatus is fabricated by depositing a film electrode onto the surface of a base substrate, the structure is then overcoated with a protective coating film layer comprising at...
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7430104 |
Electrostatic chuck for wafer metrology and inspection equipment
An electrostatic chuck is configured for electrostatically securing a wafer while limiting charge on the wafer and physical contact between the electrostatic chuck and the wafer. The electrostatic...
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7430037 |
Reticle cassette and exposure apparatus using reticle cassette
A reticle cassette includes a bearing portion and a cover, a reticle being disposed on the bearing portion and accommodated in a space between the bearing portion and the cover. The bearing portion...
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7422656 |
Dry etching method and apparatus for use in the LCD device
A dry etching step during the manufacturing of a substrate for a liquid crystal display (LCD) device is improved by placing the substrate at a predetermined distance away from the lower electrode...
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7417236 |
Sheet beam-type testing apparatus
An electron beam apparatus such as a sheet beam based testing apparatus has an electron-optical system for irradiating an object under testing with a primary electron beam from an electron beam...
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7416793 |
Electrostatic chuck and manufacturing method for the same, and alumina sintered member and manufacturing method for the same
An electrostatic chuck comprises a dielectric ceramic layer made of an alumina sintered body having a volume resistivity equal to or greater than about 1×10 17 Ω·cm at room temperature and a...
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7414823 |
Holder for use in semiconductor or liquid-crystal manufacturing device and semiconductor or liquid-crystal manufacturing device in which the holder is installed
Affords a holder for use in semiconductor or liquid-crystal manufacturing devices—as well as semiconductor or liquid-crystal manufacturing devices in which the holder is installed—in which...
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7411773 |
Electrostatic chucking device and manufacturing method thereof
An electrostatic chucking device having a laminated structure formed by sequentially laminating a first insulation layer, an electrode layer, and a second insulation layer on a metal substrate. The...
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