|
Match
|
Document |
Document Title |
|
|
7612630 |
Electromagnetically coupled interconnect system architecture
An electromagnetic interconnect method and apparatus effects contactless, proximity connections between elements in an electronics system. Data to be communicated between elements in an electronic...
|
|
|
7609130 |
High-frequency module including connection terminals arranged at a small pitch
In a high-frequency module, mounting lands arranged to mount at least one filter device having at least one set of an unbalanced terminal and two balanced terminals are provided at one side of a...
|
|
|
7609128 |
Switch circuit
A branch path having a transmission line and a distributed constant line includes a resonant circuit. The resonant circuit resonates at a predetermined operating frequency when the branch path is...
|
|
|
7576629 |
Semiconductor device having signal line and reference potential planes separated by a vertical gap
A semiconductor device according to the one embodiment of the present invention comprises a signal line; and a reference potential plane which is separated from the signal line and opposed to the...
|
|
|
7573359 |
Reducing crosstalk in electronic devices having microstrip lines covered by a flexible insulating material and a metallic backing plate
An electronic device may be formed of a printed circuit board having integrated circuits mounted thereon. A backing plate may compress an insulating layer against a microstrip line formed on one...
|
|
|
7565116 |
High frequency module
A high frequency module comprises a layered substrate. Inside the layered substrate, a reception diplexer for processing reception signals and a transmission diplexer for processing transmission...
|
|
|
7542006 |
Wiring board and semiconductor apparatus
An inverse F type antenna is provided and includes first wiring portions provided on an upper face of a board, second wiring portions provided on a lower face of the board, connecting portions...
|
|
|
7528792 |
Reduced inductance interconnect for enhanced microwave and millimeter-wave systems
According to one embodiment of the present invention, a microwave or millimeter wave module includes a dielectric layer having a pocket formed substantially through the dielectric layer. The...
|
|
|
7498907 |
Transmission line substrate and semiconductor package
A transmission line substrate includes a spurious-wave suppression circuit in which a divider divides a signal line of a driving control signal connected to a semiconductor device into two signal...
|
|
|
7477197 |
Package level integration of antenna and RF front-end module
Electronic devices and methods for their formation are described. One device relates to an electronic assembly including a substrate having a first surface and a second surface opposite the first...
|
|
|
7471175 |
Planar mixed-signal circuit board
A mixed-signal circuit board can provide a flexible arrangement of multiple RF transmission mediums in a single lightweight and compact structure as well as support embedding electronic devices...
|
|
|
7436270 |
Structure and method for improving the reliability of surface mounted ceramic duplexers
A duplexer assembly is provided and includes a circuit board and a duplexer connected to the circuit board by a joint material, wherein the joint material provides a joint thickness of at least...
|
|
|
7432778 |
Arrangement and method impedance matching
An arrangement and method for impedance matching (e.g., for a power amplifier) comprising a first node ( 204 a ) for receiving an output current to be impedance matched; a second node ( 212, 214 )...
|
|
|
7411279 |
Component interconnect with substrate shielding
An example of a circuit structure may include a first dielectric layer having first and second surfaces, and a channel extending at least partially between the first and second surfaces and along a...
|
|
|
7400222 |
Grooved coaxial-type transmission line, manufacturing method and packaging method thereof
Disclosed herein are a transmission line of coaxial type and a manufacturing method thereof, capable of preventing a radiative signal loss of signal lines during transmission of an RF signal and...
|
|
|
7388451 |
Thickness tapered substrate launch
A technique for interconnecting monolithic microwave integrated circuits (MMICS) on a substrate, and a method for fabricating substrate sections that facilitate such interconnection. A MMIC is...
|
|
|
7312671 |
Multiplier crystal oscillator
The present invention has a configuration such that in a multiplier crystal oscillator wherein a multilayer board having earthing metal films on both principal planes of an intermediate board, and...
|
|
|
7301243 |
High-reliable semiconductor device using hermetic sealing of electrodes
The present invention relates to a high-reliable semiconductor device in which electrodes formed on substrates are prevented from deteriorating by sealing the electrodes with a frame member rather...
|
|
|
7298235 |
Circuit board assembly and method of attaching a chip to a circuit board with a fillet bond not covering RF traces
An antenna array is assembled by direct attaching a flip chip transmit/receive (T/R) module to an antenna circuit board. A fillet bond is applied to the circuit board and the flip chip T/R module...
|
|
|
7259644 |
Substrate having microstrip line structure, semiconductor device having microstrip line structure, and manufacturing method of substrate having microstrip line structure
A substrate having a microstrip line structure is provided comprising a trench provided at least in one main surface of a base body constituting the substrate having an inner surface geometry of an...
|
|
|
7248222 |
High-frequency module
A high-frequency module includes a stiffener (a support substrate), a resin base member of which one surface is fixed to the stiffener, a first conductive pattern formed on said one surface of the...
|
|
|
7245884 |
RF module
An RF module includes a multi-layered substrate. A base-band IC, a memory IC, a quartz oscillator and surface-mount components are mounted on the upper surface of the multi-layered substrate. A...
|
|
|
7239222 |
High frequency circuit module
A high frequency circuit module for use in an automotive radar or the like, in which RF circuit parts are mounted on both sides of a hard multilayer dielectric substrate, and a transmission line...
|
|
|
7236070 |
Electronic component module and manufacturing method thereof
An electronic component module has a device-side module A and an antenna-side module B. The device-side module A is equipped with a first dielectric substrate 11 that is formed with a first...
|
|
|
7221244 |
Localized enhancement of multilayer substrate thickness for high Q RF components
An exemplary system and method for providing differential adjustment of the height of a multilayer substrate in localized areas for improved Q-factor performance of RF devices is disclosed as...
|
|
|
7187559 |
Circuit board device and its manufacturing method
This invention is a circuit board device having a filter element. It has a base board ( 4 ), a circuit part ( 2 ) mounted on the base board ( 4 ), a filter element ( 5 ) arranged between the...
|
|
|
7187256 |
RF package
A novel package includes a substrate including an upper surface ground plane connected to a lower surface ground plane by vias through the substrate, a die located on the upper ground plane and...
|
|
|
7180394 |
Millimeter wave (MMW) radio frequency transceiver module and method of forming same
A low cost and high performance millimeter wave (MMW) radio frequency transceiver module includes a substrate board and plurality of microwave monolithic integrated circuit (MMIC) chips supported...
|
|
|
7180393 |
Device with hybrid microwave circuits shielded by elastic contact members
A hybrid microwave circuit device comprises a base provided with an external peripheral wall and at least one internal wall together delimiting at least two cavities to accommodate hybrid microwave...
|
|
|
7170361 |
Method and apparatus of interposing voltage reference traces between signal traces in semiconductor devices
A method and apparatus for substantially reducing or eliminating electromagnetic and electrostatic coupling between signal traces on a substrate is disclosed. A substrate, such as a printed circuit...
|
|
|
7170314 |
Multiple channel modules and bus systems using same
Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.
|
|
|
7164905 |
High frequency module
Heretofore, a plurality of packages were used in a high frequency module in which a plurality of waveguide terminals were positioned resulting in problems, such as degradation of characteristics in...
|
|
|
7145411 |
Flexible differential interconnect cable with isolated high frequency electrical transmission line
A high speed flexible interconnect cable includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the...
|
|
|
7123118 |
Systems and methods for blocking microwave propagation in parallel plate structures utilizing cluster vias
Systems and methods are taught for blocking the propagation of electromagnetic waves in parallel-plate waveguide (PPW) structures. Periodic arrays of resonant vias are used to create broadband high...
|
|
|
7113054 |
Arrangement and method impedance matching
An arrangement and method for impedance matching (e.g., for a power amplifier) comprising a first node ( 204 a ) for receiving an output current to be impedance matched; a second node ( 212, 214 )...
|
|
|
7084722 |
Switched filterbank and method of making the same
An integrated switched filterbank and method of forming an integrated switched filterbank is disclosed. One embodiment includes a switched filterbank that includes an active subassembly, a...
|
|
|
7034641 |
Substrate structure for photonic assemblies and the like having a low-thermal-conductivity dielectric layer on a high-thermal-conductivity substrate body
A substrate structure useful for photonics modules comprises a high-thermal-conductivity (e.g., greater than 20 W/m°K) substrate body with a low-thermal-conductivity (e.g., less than 5 W/m°K)...
|
|
|
7030721 |
High frequency apparatus for transmitting or processing high frequency signal
In a high frequency apparatus for transmitting or processing a high frequency signal, a substrate has a recessed portion in a surface of the substrate, a first interconnecting conductor is on the...
|
|
|
7026869 |
Broadband amplifier having offset microstrip section in a housing module
A broadband driver amplifier module is made using an arrangement of MMICS and microstrip to provide inline rf connectors for the input and output and a small package size. The input and output...
|
|
|
7019600 |
Waveguide/planar line converter and high frequency circuit arrangement
A waveguide/planar line converter is provided which enables a simplified assembling operation and accurate positioning of a signal line. The waveguide/planar line converter includes a housing...
|
|
|
7015869 |
High frequency antenna disposed on the surface of a three dimensional substrate
The present invention consists of an electrical communications device including a three-dimensional substrate and a plurality of electrical devices attached thereto. The substrate is preferably a...
|
|
|
7012490 |
High frequency signal transmission structure
A connection pad, an insulating film, a ground layer a protective film, first to third wirings and posts S 0 , S 1 , G, D on the wirings are disposed on a semiconductor substrate. In this case, the...
|
|
|
6998944 |
Method and apparatus for microwave interconnection
Microwave signals are coupled from a microwave module to a microstrip transmission line, each installed on a chassis plate. The microwave signals are fed through the bottom or side of the microwave...
|
|
|
6989790 |
Integrated antenna device with resistive connection
A planar metal antenna mounted on a semiconductor body and incorporating an active circuit element, for example a diode, integrated in the path of the antenna. Connection between the antenna metal...
|
|
|
6972646 |
Filter circuit device and method of manufacturing the same
This invention is a filter circuit having a filter element. A filter element ( 4 ) is a parallel resonator circuit including a pair of first resonator lines ( 19 a ) ( 19 b ) formed by a thick film...
|
|
|
6961229 |
Electronic circuit device
An electronic circuit device having a power-supply structure capable of supporting fast signals in and above a GHz band is offered. A driver transistor is formed in a surface of a semiconductor...
|
|
|
6958662 |
Waveguide to stripline transition with via forming an impedance matching fence
The invention relates to a device for guiding electromagnetic waves from a wave guide ( 10 ), in particular a multi-band wave guide, to a transmission line ( 20 ), in particular a micro strip line,...
|
|
|
6940361 |
Self-aligned transition between a transmission line and a module
The invention relates to a method for forming a self-aligned transition between a transmission line ( 1 ) and a module ( 2 ) to be connected to said transmission line ( 1 ). The invention equally...
|
|
|
6933813 |
Interconnection structure with etch stop
An interconnection structure includes: a dielectric layer; a first metallization pattern on the dielectric layer, the first metallization pattern including at least one etch stop having a perimeter...
|
|
|
6917262 |
Integrated microwave filter module with a cover bonded by strips of conductive paste
An integrated microwave module comprising a conductive ground plane, a non-conductive substrate on the ground plane, at least two microwave circuits mounted on the substrate, a microstrip line...
|