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7411279 |
Component interconnect with substrate shielding
An example of a circuit structure may include a first dielectric layer having first and second surfaces, and a channel extending at least partially between the first and second surfaces and along a...
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7400222 |
Grooved coaxial-type transmission line, manufacturing method and packaging method thereof
Disclosed herein are a transmission line of coaxial type and a manufacturing method thereof, capable of preventing a radiative signal loss of signal lines during transmission of an RF signal and...
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7388451 |
Thickness tapered substrate launch
A technique for interconnecting monolithic microwave integrated circuits (MMICS) on a substrate, and a method for fabricating substrate sections that facilitate such interconnection. A MMIC is...
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7342471 |
Systems and methods for blocking microwave propagation in parallel plate structures
Systems and methods are taught for blocking the propagation of electromagnetic waves in parallel-plate waveguide (PPW) structures. Periodic arrays of resonant vias are used to create broadband high...
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7312671 |
Multiplier crystal oscillator
The present invention has a configuration such that in a multiplier crystal oscillator wherein a multilayer board having earthing metal films on both principal planes of an intermediate board, and...
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7301243 |
High-reliable semiconductor device using hermetic sealing of electrodes
The present invention relates to a high-reliable semiconductor device in which electrodes formed on substrates are prevented from deteriorating by sealing the electrodes with a frame member rather...
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7298235 |
Circuit board assembly and method of attaching a chip to a circuit board with a fillet bond not covering RF traces
An antenna array is assembled by direct attaching a flip chip transmit/receive (T/R) module to an antenna circuit board. A fillet bond is applied to the circuit board and the flip chip T/R module...
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7259644 |
Substrate having microstrip line structure, semiconductor device having microstrip line structure, and manufacturing method of substrate having microstrip line structure
A substrate having a microstrip line structure is provided comprising a trench provided at least in one main surface of a base body constituting the substrate having an inner surface geometry of an...
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7248222 |
High-frequency module
A high-frequency module includes a stiffener (a support substrate), a resin base member of which one surface is fixed to the stiffener, a first conductive pattern formed on said one surface of the...
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7245884 |
RF module
An RF module includes a multi-layered substrate. A base-band IC, a memory IC, a quartz oscillator and surface-mount components are mounted on the upper surface of the multi-layered substrate. A...
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7239222 |
High frequency circuit module
A high frequency circuit module for use in an automotive radar or the like, in which RF circuit parts are mounted on both sides of a hard multilayer dielectric substrate, and a transmission line...
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7236070 |
Electronic component module and manufacturing method thereof
An electronic component module has a device-side module A and an antenna-side module B. The device-side module A is equipped with a first dielectric substrate 11 that is formed with a first...
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7221244 |
Localized enhancement of multilayer substrate thickness for high Q RF components
An exemplary system and method for providing differential adjustment of the height of a multilayer substrate in localized areas for improved Q-factor performance of RF devices is disclosed as...
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7187559 |
Circuit board device and its manufacturing method
This invention is a circuit board device having a filter element. It has a base board ( 4 ), a circuit part ( 2 ) mounted on the base board ( 4 ), a filter element ( 5 ) arranged between the...
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7187256 |
RF package
A novel package includes a substrate including an upper surface ground plane connected to a lower surface ground plane by vias through the substrate, a die located on the upper ground plane and...
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7180394 |
Millimeter wave (MMW) radio frequency transceiver module and method of forming same
A low cost and high performance millimeter wave (MMW) radio frequency transceiver module includes a substrate board and plurality of microwave monolithic integrated circuit (MMIC) chips supported...
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7180393 |
Device with hybrid microwave circuits shielded by elastic contact members
A hybrid microwave circuit device comprises a base provided with an external peripheral wall and at least one internal wall together delimiting at least two cavities to accommodate hybrid microwave...
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7170361 |
Method and apparatus of interposing voltage reference traces between signal traces in semiconductor devices
A method and apparatus for substantially reducing or eliminating electromagnetic and electrostatic coupling between signal traces on a substrate is disclosed. A substrate, such as a printed circuit...
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7170314 |
Multiple channel modules and bus systems using same
Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.
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7164905 |
High frequency module
Heretofore, a plurality of packages were used in a high frequency module in which a plurality of waveguide terminals were positioned resulting in problems, such as degradation of characteristics in...
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7157992 |
Systems and methods for blocking microwave propagation in parallel plate structures
Systems and methods are taught for blocking the propagation of electromagnetic waves in parallel-plate waveguide (PPW) structures. Periodic arrays of resonant vias are used to create broadband high...
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7145411 |
Flexible differential interconnect cable with isolated high frequency electrical transmission line
A high speed flexible interconnect cable includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the...
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7123118 |
Systems and methods for blocking microwave propagation in parallel plate structures utilizing cluster vias
Systems and methods are taught for blocking the propagation of electromagnetic waves in parallel-plate waveguide (PPW) structures. Periodic arrays of resonant vias are used to create broadband high...
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7113054 |
Arrangement and method impedance matching
An arrangement and method for impedance matching (e.g., for a power amplifier) comprising a first node ( 204 a ) for receiving an output current to be impedance matched; a second node ( 212, 214 )...
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7084722 |
Switched filterbank and method of making the same
An integrated switched filterbank and method of forming an integrated switched filterbank is disclosed. One embodiment includes a switched filterbank that includes an active subassembly, a...
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7034641 |
Substrate structure for photonic assemblies and the like having a low-thermal-conductivity dielectric layer on a high-thermal-conductivity substrate body
A substrate structure useful for photonics modules comprises a high-thermal-conductivity (e.g., greater than 20 W/m°K) substrate body with a low-thermal-conductivity (e.g., less than 5 W/m°K)...
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7030721 |
High frequency apparatus for transmitting or processing high frequency signal
In a high frequency apparatus for transmitting or processing a high frequency signal, a substrate has a recessed portion in a surface of the substrate, a first interconnecting conductor is on the...
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7026869 |
Broadband amplifier having offset microstrip section in a housing module
A broadband driver amplifier module is made using an arrangement of MMICS and microstrip to provide inline rf connectors for the input and output and a small package size. The input and output...
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7019600 |
Waveguide/planar line converter and high frequency circuit arrangement
A waveguide/planar line converter is provided which enables a simplified assembling operation and accurate positioning of a signal line. The waveguide/planar line converter includes a housing...
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7015869 |
High frequency antenna disposed on the surface of a three dimensional substrate
The present invention consists of an electrical communications device including a three-dimensional substrate and a plurality of electrical devices attached thereto. The substrate is preferably a...
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7012490 |
High frequency signal transmission structure
A connection pad, an insulating film, a ground layer a protective film, first to third wirings and posts S 0 , S 1 , G, D on the wirings are disposed on a semiconductor substrate. In this case, the...
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6998944 |
Method and apparatus for microwave interconnection
Microwave signals are coupled from a microwave module to a microstrip transmission line, each installed on a chassis plate. The microwave signals are fed through the bottom or side of the microwave...
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6989790 |
Integrated antenna device with resistive connection
A planar metal antenna mounted on a semiconductor body and incorporating an active circuit element, for example a diode, integrated in the path of the antenna. Connection between the antenna metal...
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6972646 |
Filter circuit device and method of manufacturing the same
This invention is a filter circuit having a filter element. A filter element ( 4 ) is a parallel resonator circuit including a pair of first resonator lines ( 19 a ) ( 19 b ) formed by a thick film...
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6961229 |
Electronic circuit device
An electronic circuit device having a power-supply structure capable of supporting fast signals in and above a GHz band is offered. A driver transistor is formed in a surface of a semiconductor...
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6958662 |
Waveguide to stripline transition with via forming an impedance matching fence
The invention relates to a device for guiding electromagnetic waves from a wave guide ( 10 ), in particular a multi-band wave guide, to a transmission line ( 20 ), in particular a micro strip line,...
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6940361 |
Self-aligned transition between a transmission line and a module
The invention relates to a method for forming a self-aligned transition between a transmission line ( 1 ) and a module ( 2 ) to be connected to said transmission line ( 1 ). The invention equally...
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6933813 |
Interconnection structure with etch stop
An interconnection structure includes: a dielectric layer; a first metallization pattern on the dielectric layer, the first metallization pattern including at least one etch stop having a perimeter...
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6917262 |
Integrated microwave filter module with a cover bonded by strips of conductive paste
An integrated microwave module comprising a conductive ground plane, a non-conductive substrate on the ground plane, at least two microwave circuits mounted on the substrate, a microstrip line...
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6917254 |
Balanced-to-unbalanced transformer
A method relating to a balun for transmitting a high degree of high-frequency power where metal sheet element is soldered onto the loop conductor tract of the symmetrical circuit loop, the...
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6914500 |
Filter circuit device and method of manufacturing the same
This invention is a filter circuit having a filter element. A filter element ( 4 ) is a parallel resonator circuit including a pair of first resonator lines ( 19 a ) ( 19 b ) formed by a thick film...
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6914280 |
Switching circuit device
Since a 5 GHz-band broadband has a frequency twice that of 2.4 GHz, the parasitic capacitance greatly influences deterioration in isolation of a switching device used in this frequency region....
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6911734 |
Semiconductor device and electronic device
A high-frequency signal from a tape-shaped line section having a surface layer signal lead and surface layer GND lead disposed on both sides thereof is directly inputted to a semiconductor chip via...
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6907178 |
Optoelectronic assembly with embedded optical and electrical components
The invention provides an optoelectronic assembly for coupling an optical conductor to a light emitting surface of an optoelectronic semiconductor device on a substrate. The optoelectronic assembly...
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6894581 |
Monolithic nonlinear transmission lines and sampling circuits with reduced shock-wave-to-surface-wave coupling
A monolithic non-linear transmission line and sampling circuit with reduced shock-wave-to-surface-wave coupling are presented herein. In coplanar-waveguide (CPW) technology, this reduced coupling...
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6888428 |
High frequency semiconductor integrated circuit capable of switching between characteristics
A high frequency semiconductor integrated circuit includes a main circuit, a circuit block, a pad, and a wire. The main circuit includes an input terminal, a transistor, transmission lines, a pad,...
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6884656 |
Semiconductor device having a flip-chip construction
A semiconductor device includes a mount substrate, a high-frequency transmission line provided on a top surface of the mount substrate, and a semiconductor chip mounted on the top surface of the...
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6882858 |
Flexible board and method of fabricating the same
There is provided a flexible board including (a) an internal layer, (b) a line formed in a first area of the internal layer, the line radiating unnecessary radiation, (c) a first ground layer...
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6882241 |
Method, memory system and memory module board for avoiding local incoordination of impedance around memory chips on the memory system
A signal line of a data bus includes first wires on a first board and a second wire on a second board. The second board is installed on the first board to connect the first and second wires with...
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6882239 |
Electromagnetically coupled interconnect system
An electromagnetic interconnect method and apparatus effects contactless, proximity connections between elements in an electronics system. Data to be communicated between elements in an electronic...
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