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Match Document Document Title
7411279 Component interconnect with substrate shielding  
An example of a circuit structure may include a first dielectric layer having first and second surfaces, and a channel extending at least partially between the first and second surfaces and along a...
7400222 Grooved coaxial-type transmission line, manufacturing method and packaging method thereof  
Disclosed herein are a transmission line of coaxial type and a manufacturing method thereof, capable of preventing a radiative signal loss of signal lines during transmission of an RF signal and...
7388451 Thickness tapered substrate launch  
A technique for interconnecting monolithic microwave integrated circuits (MMICS) on a substrate, and a method for fabricating substrate sections that facilitate such interconnection. A MMIC is...
7342471 Systems and methods for blocking microwave propagation in parallel plate structures  
Systems and methods are taught for blocking the propagation of electromagnetic waves in parallel-plate waveguide (PPW) structures. Periodic arrays of resonant vias are used to create broadband high...
7312671 Multiplier crystal oscillator  
The present invention has a configuration such that in a multiplier crystal oscillator wherein a multilayer board having earthing metal films on both principal planes of an intermediate board, and...
7301243 High-reliable semiconductor device using hermetic sealing of electrodes  
The present invention relates to a high-reliable semiconductor device in which electrodes formed on substrates are prevented from deteriorating by sealing the electrodes with a frame member rather...
7298235 Circuit board assembly and method of attaching a chip to a circuit board with a fillet bond not covering RF traces  
An antenna array is assembled by direct attaching a flip chip transmit/receive (T/R) module to an antenna circuit board. A fillet bond is applied to the circuit board and the flip chip T/R module...
7259644 Substrate having microstrip line structure, semiconductor device having microstrip line structure, and manufacturing method of substrate having microstrip line structure  
A substrate having a microstrip line structure is provided comprising a trench provided at least in one main surface of a base body constituting the substrate having an inner surface geometry of an...
7248222 High-frequency module  
A high-frequency module includes a stiffener (a support substrate), a resin base member of which one surface is fixed to the stiffener, a first conductive pattern formed on said one surface of the...
7245884 RF module  
An RF module includes a multi-layered substrate. A base-band IC, a memory IC, a quartz oscillator and surface-mount components are mounted on the upper surface of the multi-layered substrate. A...
7239222 High frequency circuit module  
A high frequency circuit module for use in an automotive radar or the like, in which RF circuit parts are mounted on both sides of a hard multilayer dielectric substrate, and a transmission line...
7236070 Electronic component module and manufacturing method thereof  
An electronic component module has a device-side module A and an antenna-side module B. The device-side module A is equipped with a first dielectric substrate 11 that is formed with a first...
7221244 Localized enhancement of multilayer substrate thickness for high Q RF components  
An exemplary system and method for providing differential adjustment of the height of a multilayer substrate in localized areas for improved Q-factor performance of RF devices is disclosed as...
7187559 Circuit board device and its manufacturing method  
This invention is a circuit board device having a filter element. It has a base board ( 4 ), a circuit part ( 2 ) mounted on the base board ( 4 ), a filter element ( 5 ) arranged between the...
7187256 RF package  
A novel package includes a substrate including an upper surface ground plane connected to a lower surface ground plane by vias through the substrate, a die located on the upper ground plane and...
7180394 Millimeter wave (MMW) radio frequency transceiver module and method of forming same  
A low cost and high performance millimeter wave (MMW) radio frequency transceiver module includes a substrate board and plurality of microwave monolithic integrated circuit (MMIC) chips supported...
7180393 Device with hybrid microwave circuits shielded by elastic contact members  
A hybrid microwave circuit device comprises a base provided with an external peripheral wall and at least one internal wall together delimiting at least two cavities to accommodate hybrid microwave...
7170361 Method and apparatus of interposing voltage reference traces between signal traces in semiconductor devices  
A method and apparatus for substantially reducing or eliminating electromagnetic and electrostatic coupling between signal traces on a substrate is disclosed. A substrate, such as a printed circuit...
7170314 Multiple channel modules and bus systems using same  
Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.
7164905 High frequency module  
Heretofore, a plurality of packages were used in a high frequency module in which a plurality of waveguide terminals were positioned resulting in problems, such as degradation of characteristics in...
7157992 Systems and methods for blocking microwave propagation in parallel plate structures  
Systems and methods are taught for blocking the propagation of electromagnetic waves in parallel-plate waveguide (PPW) structures. Periodic arrays of resonant vias are used to create broadband high...
7145411 Flexible differential interconnect cable with isolated high frequency electrical transmission line  
A high speed flexible interconnect cable includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the...
7123118 Systems and methods for blocking microwave propagation in parallel plate structures utilizing cluster vias  
Systems and methods are taught for blocking the propagation of electromagnetic waves in parallel-plate waveguide (PPW) structures. Periodic arrays of resonant vias are used to create broadband high...
7113054 Arrangement and method impedance matching  
An arrangement and method for impedance matching (e.g., for a power amplifier) comprising a first node ( 204 a ) for receiving an output current to be impedance matched; a second node ( 212, 214 )...
7084722 Switched filterbank and method of making the same  
An integrated switched filterbank and method of forming an integrated switched filterbank is disclosed. One embodiment includes a switched filterbank that includes an active subassembly, a...
7034641 Substrate structure for photonic assemblies and the like having a low-thermal-conductivity dielectric layer on a high-thermal-conductivity substrate body  
A substrate structure useful for photonics modules comprises a high-thermal-conductivity (e.g., greater than 20 W/m°K) substrate body with a low-thermal-conductivity (e.g., less than 5 W/m°K)...
7030721 High frequency apparatus for transmitting or processing high frequency signal  
In a high frequency apparatus for transmitting or processing a high frequency signal, a substrate has a recessed portion in a surface of the substrate, a first interconnecting conductor is on the...
7026869 Broadband amplifier having offset microstrip section in a housing module  
A broadband driver amplifier module is made using an arrangement of MMICS and microstrip to provide inline rf connectors for the input and output and a small package size. The input and output...
7019600 Waveguide/planar line converter and high frequency circuit arrangement  
A waveguide/planar line converter is provided which enables a simplified assembling operation and accurate positioning of a signal line. The waveguide/planar line converter includes a housing...
7015869 High frequency antenna disposed on the surface of a three dimensional substrate  
The present invention consists of an electrical communications device including a three-dimensional substrate and a plurality of electrical devices attached thereto. The substrate is preferably a...
7012490 High frequency signal transmission structure  
A connection pad, an insulating film, a ground layer a protective film, first to third wirings and posts S 0 , S 1 , G, D on the wirings are disposed on a semiconductor substrate. In this case, the...
6998944 Method and apparatus for microwave interconnection  
Microwave signals are coupled from a microwave module to a microstrip transmission line, each installed on a chassis plate. The microwave signals are fed through the bottom or side of the microwave...
6989790 Integrated antenna device with resistive connection  
A planar metal antenna mounted on a semiconductor body and incorporating an active circuit element, for example a diode, integrated in the path of the antenna. Connection between the antenna metal...
6972646 Filter circuit device and method of manufacturing the same  
This invention is a filter circuit having a filter element. A filter element ( 4 ) is a parallel resonator circuit including a pair of first resonator lines ( 19 a ) ( 19 b ) formed by a thick film...
6961229 Electronic circuit device  
An electronic circuit device having a power-supply structure capable of supporting fast signals in and above a GHz band is offered. A driver transistor is formed in a surface of a semiconductor...
6958662 Waveguide to stripline transition with via forming an impedance matching fence  
The invention relates to a device for guiding electromagnetic waves from a wave guide ( 10 ), in particular a multi-band wave guide, to a transmission line ( 20 ), in particular a micro strip line,...
6940361 Self-aligned transition between a transmission line and a module  
The invention relates to a method for forming a self-aligned transition between a transmission line ( 1 ) and a module ( 2 ) to be connected to said transmission line ( 1 ). The invention equally...
6933813 Interconnection structure with etch stop  
An interconnection structure includes: a dielectric layer; a first metallization pattern on the dielectric layer, the first metallization pattern including at least one etch stop having a perimeter...
6917262 Integrated microwave filter module with a cover bonded by strips of conductive paste  
An integrated microwave module comprising a conductive ground plane, a non-conductive substrate on the ground plane, at least two microwave circuits mounted on the substrate, a microstrip line...
6917254 Balanced-to-unbalanced transformer  
A method relating to a balun for transmitting a high degree of high-frequency power where metal sheet element is soldered onto the loop conductor tract of the symmetrical circuit loop, the...
6914500 Filter circuit device and method of manufacturing the same  
This invention is a filter circuit having a filter element. A filter element ( 4 ) is a parallel resonator circuit including a pair of first resonator lines ( 19 a ) ( 19 b ) formed by a thick film...
6914280 Switching circuit device  
Since a 5 GHz-band broadband has a frequency twice that of 2.4 GHz, the parasitic capacitance greatly influences deterioration in isolation of a switching device used in this frequency region....
6911734 Semiconductor device and electronic device  
A high-frequency signal from a tape-shaped line section having a surface layer signal lead and surface layer GND lead disposed on both sides thereof is directly inputted to a semiconductor chip via...
6907178 Optoelectronic assembly with embedded optical and electrical components  
The invention provides an optoelectronic assembly for coupling an optical conductor to a light emitting surface of an optoelectronic semiconductor device on a substrate. The optoelectronic assembly...
6894581 Monolithic nonlinear transmission lines and sampling circuits with reduced shock-wave-to-surface-wave coupling  
A monolithic non-linear transmission line and sampling circuit with reduced shock-wave-to-surface-wave coupling are presented herein. In coplanar-waveguide (CPW) technology, this reduced coupling...
6888428 High frequency semiconductor integrated circuit capable of switching between characteristics  
A high frequency semiconductor integrated circuit includes a main circuit, a circuit block, a pad, and a wire. The main circuit includes an input terminal, a transistor, transmission lines, a pad,...
6884656 Semiconductor device having a flip-chip construction  
A semiconductor device includes a mount substrate, a high-frequency transmission line provided on a top surface of the mount substrate, and a semiconductor chip mounted on the top surface of the...
6882858 Flexible board and method of fabricating the same  
There is provided a flexible board including (a) an internal layer, (b) a line formed in a first area of the internal layer, the line radiating unnecessary radiation, (c) a first ground layer...
6882241 Method, memory system and memory module board for avoiding local incoordination of impedance around memory chips on the memory system  
A signal line of a data bus includes first wires on a first board and a second wire on a second board. The second board is installed on the first board to connect the first and second wires with...
6882239 Electromagnetically coupled interconnect system  
An electromagnetic interconnect method and apparatus effects contactless, proximity connections between elements in an electronics system. Data to be communicated between elements in an electronic...
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