Matches 201 - 250 out of 459 < 1 2 3 4 5 6 7 8 9 10 >
Match Document Document Title
5773887 High frequency semiconductor component  
A high frequency semiconductor component (10) includes a first substrate (12) having a first surface (13) opposite a second surface (14), a first electrically conductive layer (16) supported by the...
5768109 Multi-layer circuit board and semiconductor flip chip connection  
A multi-layer circuit board (11) has a cofired ceramic with a configuration of circuit traces (27) extending though differing layers of the multi-layer circuit board (11) to facilitate mountable...
5764119 Wiring board for high-frequency signals and semiconductor module for high-frequency signals using the wiring board  
A wiring board for high-frequency signals, which comprises, a substrate, a dielectric layer formed on the substrate and provided on its surface with a U-shaped groove having an arcuate bottom for...
5751201 Resonator with metal layers devoid of DC connection and semiconductor device in substrate  
A resonator includes a substrate (15) having a first dielectric constant, an insulative layer (16, 31) overlying the substrate (15) and having a second dielectric constant wherein the second...
5752182 Hybrid IC  
On a ceramic substrate, spiral-type inductors of a single layer wiring of a metal thin film are provided and respectively connected to a wiring pattern formed on another face of the substrate via...
5729439 Printed wiring substrate  
A printed wiring substrate in which first and second parts are mounted in adjacent with each other on soldering lands formed on an insulative board and put to reflow soldering, wherein the width of...
5698898 Semiconductor apparatus with a multiple element electrode structure  
A bolt (42a) is connected to a copper plate (9a) by a first electrode (51a), a second electrode (52a) and a wire (10a) for connecting the first and second electrodes. Similarly, a bolt (42b) is...
5691673 Semiconductor integrated circuit apparatus having input/output portions impedance-matched for transmission lines  
In a semiconductor integrated circuit apparatus, a semiconductor chip (device, or module) has input/output portions each connected to two external pins (or terminals). The two external pins are...
5689138 Integrated microwave semiconductor device with active and passive components  
A semiconductor device for microwave frequencies with a substrate which is provided at a first side with a semiconductor element, a passive element, and a pattern of conductive elements, while the...
5677570 Semiconductor integrated circuit devices for high-speed or high frequency  
A semiconductor integrated circuit device is provided for high-frequency or high-speed circuitry having stabilized characteristics and reduced influence on surrounding devices. In the device...
5668512 Coplanar waveguide-mounted flip chip having coupled ground conductors  
A radio-frequency power amplifier includes a multiple-FET chip that is flip mounted on a connection region of a substrate. An input impedance-matching network is also mounted on the substrate. The...
5652696 Mechanically captivated integrated circuit chip  
A high frequency microwave integrated circuit assembly (14,20) includes a fragile monolithic microwave integrated circuit (MMIC) chip (22) mounted in an MMIC subassembly (20) that is completely...
5650760 Microwave enclosure  
Microwave ports and low-frequency ports of a microwave enclosure are configured to realize high return losses and low insertion losses and suppress resonance modes below a predetermined microwave...
5644277 Three-wire-line vertical interconnect structure for multilevel substrates  
A vertical interconnect structure comprising a three-wire-line transmission line structure for providing electrical continuity between different levels of a multilevel substrate. The present...
5635762 Flip chip semiconductor device with dual purpose metallized ground conductor  
Semiconductor device for the microwave frequency ranges includes a semiconductor element of the "flip chip" type which comprises a semiconductor substrate having an active surface with at least one...
5631809 Semiconductor device for ultrahigh frequency band and semiconductor apparatus including the semiconductor device  
A semiconductor device comprising a semiconductor chip, a sheet-like metal member electrically connected to a major surface of the semiconductor chip and serving as a ground electrode for the chip,...
5614743 Microwave integrated circuit (MIC) having a reactance element formed on a groove  
MMIC elements are formed on the surface of a GaAs semiconductor substrate. Rectangular U grooves having V-shaped bottoms are formed on the bottom surface of the substrate up to the surface of the...
5612556 Monolithic integration of microwave silicon devices and low loss transmission lines  
A monolithic integrated circuit capable of operation in the microwave range which is fabricated using silicon technology wherein transmission line interconnects are fabricated along with active...
5612657 Inherently impedance matched integrated circuit socket  
A socket having primary conductors and secondary conductors. The socket provides electrical connection between active circuitry installed on a substrate and external circuitry. The impedance...
5610563 Slot line to CPW circuit structure  
A means of connecting a plurality of essentially identical active devices is presented for the purpose of multifunction and multiple function operation. These devices, mounted on a chip, are...
5611008 Substrate system for optoelectronic/microwave circuits  
A low-loss substrate system is provided for carrying and interconnecting optoelectronic/microwave circuits. The system includes a high-resistivity substrate, e.g., silicon of resistivity >1×10...
5596804 Method of constructing an electromagnetically shielded microstrip circuit  
A method of constructing a circuit for communicating electrical signals and assembled at least in part by an automated assembly machine is disclosed. The automated assembly machine is operable to...
5587887 Printed circuit board having a configurable voltage supply  
The present invention is a printed circuit board design having a configurable voltage supply and a method for implementing a configurable voltage supply PCB with a family of circuit designs. The...
5583468 High frequency transition from a microstrip transmission line to an MMIC coplanar waveguide  
A high frequency transition (10) from a microstrip transmission line (57) to an MMIC coplanar waveguide (41) is provided. The microstrip transmission line (57) is representative of that typically...
5559363 Off-chip impedance matching utilizing a dielectric element and high density interconnect technology  
A high-frequency, high-power, semiconductor device chip is impedance matched to an off-chip impedance by a matching network including a dielectric element located on a substrate ground plane...
5557144 Plastic packages for microwave frequency applications  
A plastic package for microwave applications up to 14 Ghz is disclosed. The plastic package includes a plastic platform, a lead frame embedded on the surface of the platform and, in one embodiment,...
5545924 Three dimensional package for monolithic microwave/millimeterwave integrated circuits  
A three-dimensional interconnect package is provided for monolithic microwave/millimeterwave integrated circuits. A mating substrate for receiving an MMIC has transmission lines disposed over its...
5538433 Electrical connector comprising multilayer base board assembly  
A PGA connector for a microprocessor has a multilayer base board assembly with alternating conductive and dielectric layers of preselected thicknesses through which signal pins, current source pins...
5532514 High frequency semiconductor device  
The semiconductor device of the present invention includes a semiconductor substrate on which an integrated circuit equipped with a connection electrode is formed on its main surface. At the center...
5528209 Monolithic microwave integrated circuit and method  
A monolithic microwave integrated circuit is formed by positioning a distributed, transmission-line network over a microwave-device structure. The ground plane of the transmission-line network...
5528074 Microwave semiconductor device and integrated circuit including microwave semiconductor devices  
A semiconductor device includes a substrate having a microwave semiconductor element, a microwave transmission line disposed on the substrate and electrically connected to the microwave...
5521406 Integrated circuit with improved thermal impedance  
A flip-chip integrated circuit having passive 302, 304, 306 as well as active 308, 310 components on a frontside surface of a substrate. The active devices have airbridges which contact a heatsink...
5510758 Multilayer microstrip wiring board with a semiconductor device mounted thereon via bumps  
A semiconductor device includes a microstrip wiring board. The microstrip wiring board includes a substrate having a main surface, a ground conductor extending on the main surface of the substrate,...
5511238 Monolithic microwave transmitter/receiver  
Preferred embodiments include a microstrip patch antenna (38) which also acts as the resonator for an oscillator powered by IMPATT diodes (34, 36); this forms a monolithic transmitter (30) for...
5477083 Chip carrier for enabling production of high performance microwave semiconductor device by disposing semiconductor chip thereon  
A chip carrier for a semiconductor chip, the chip having a specified thickness and lateral configuration and size. A conductive holder of the carrier has a main surface including a chip mounting...
5451818 Millimeter wave ceramic package  
An improved millimeter wave device package design in which the package includes a dielectric substrate disposed upon a supporting base such that the substrate extends substantially along the...
5451905 Microwave semiconductor device comprising stabilizing means  
A semiconductor device microwave integrated circuit includes at least a transistor stage which stage includes a microwave matching circuit and a d.c. bias circuit interconnected at a link node (A)....
5450046 Composite microwave circuit module assembly and its connection structure  
A composite microwave circuit module assembly has a dielectric substrate which is formed by a lower layer, an intermediate layer and an upper layer. The lower layer and the upper layer include a...
5449953 Monolithic microwave integrated circuit on high resistivity silicon  
A silicon-based monolithic microwave integrated circuit architecture is described. This architecture, called MICROX™, is a combination of silicon material growth and wafer processing...
5440283 Inverted pin diode switch apparatus  
The present invention describes a switch (10) designed primarily for use in the radio frequency and microwave spectrums. The switch (10) of the present invention uses a lumped element network (16),...
5438305 High frequency module including a flexible substrate  
A high frequency module is disclosed which comprises a high frequency device in a package, a circuit formed on a flexible substrate in the package, the circuit, the high frequency device and...
5438697 Microstrip circuit assembly and components therefor  
A microwave antenna and receiver assembly is described for use at gigaherz frequencies wherein the antenna is a microstrip antenna and the receiver includes a stripline filter circuit which is...
5428506 Circuit board EMI suppressor including a lossy dielectric layer  
An improved printed circuit card or second level electronics package (circuit board) including a laminate of lossy material and dielectric material between the voltage supply plane (Vcc) and the...
5428327 Microwave feedthrough apparatus  
An improved microwave feedthru apparatus is disclosed which provides enhanced performance over the 1-20 GHz frequency range. In its preferred embodiment the apparatus will be used to transmit...
5426319 High-frequency semiconductor device including microstrip transmission line  
A semiconductor device includes a silicon substrate on which a circuit having a predetermined function is formed and a high frequency circuit chip which is mounted on the silicon substrate and...
5426405 Family of different-sized demountable hybrid assemblies with microwave-bandwidth interconnects  
A family of modular hybrid assemblies with high frequency interconnections is effected by a high frequency circuit assembly attached to a motherboard. Each assembly comprises standardized...
5424693 Surface mountable microwave IC package  
A surface mountable microwave IC package with broad bandwidth and low loss has been developed. The impedance mismatch due to the electrical discontinuity of the I/O pads and via holes in the...
5422615 High frequency circuit device  
In a high frequency circuit device, inductive circuit elements constituting a matching circuit are constructed of so-called helical coils having fine metal wires wound in a hollow solenoid form,...
5420506 Apparatus and method for testing packaged integrated circuits  
The present invention discloses an apparatus for testing an integrated circuit (IC) chip having a plurality of testing ports, each of the testing ports being used for connection with an testing...
5406125 Semiconductor device having a metalized via hole  
A semiconductor device having a metalized via hole used when mounting and connecting semiconductor chips, such as microwave chips, digital chips, analog chips and the like, on a top portion of a...
Matches 201 - 250 out of 459 < 1 2 3 4 5 6 7 8 9 10 >