Matches 401 - 450 out of 3056 < 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 >
Match Document Document Title
7355419 Enhanced signal observability for circuit analysis  
Methods and arrangements to enhance photon emissions responsive to a signal within an integrated circuit (IC) for observability of signal states utilizing, e.g., picosecond imaging circuit analysis...
7355433 Configurations and method for carrying out wafer level unclamped inductive switching (UIS) tests  
This invention discloses a circuit for performing an unclamped inductive test on a metal oxide semiconductor field effect transistor (MOSFET) device driven by a gate driver. The circuit includes a...
7355421 Semiconductor apparatus testing arrangement and semiconductor apparatus testing method  
A semiconductor apparatus testing arrangement for testing a plurality of semiconductor devices produced on a semiconductor substrate, has a substrate on which a plurality of testing units are...
7355385 Voltage injector and detector using pixel array for printed circuit board testing  
One embodiment includes an injector pixel array having injector pixels each coupled to the bottom surface of a conductive material having a directional electrical conductivity only in a direction...
7355386 Method of automatically carrying IC-chips, on a planar array of vacuum nozzles, to a variable target in a chip tester  
A method of automatically carrying IC-chips, on a planar array of vacuum nozzles, to a variable target in a chip tester uses a set of laser distance sensors to align the vacuum nozzles with the...
7355431 Test arrangement including anisotropic conductive film for testing power module  
A testing apparatus and method for testing a semiconductor device, and more particularly a test arrangement for measuring a guaranteed power loss of a semiconductor module, not requiring the module...
7355432 Buffer circuit, driver circuit, and semiconductor testing apparatus  
There is provided a buffer circuit that can deal with input and output signals having a large voltage swing. Such a buffer circuit is designed for outputting an output signal corresponding to an...
7352195 Electron beam apparatus with detailed observation function and sample inspecting and observing method using electron beam apparatus  
Provided is a sample observing method allowing for a detailed observation of a sample by using one and the same electron beam apparatus. The method uses an electron beam apparatus 1 comprising a...
7352197 Octal/quad site docking compatibility for package test handler  
A test system configuration is provided to enable testing of integrated circuit (IC) packages. The test system includes a test controller, an interface apparatus including a PC board with lines...
7352201 System and method for testing devices utilizing capacitively coupled signaling  
An apparatus and method for testing a semiconductor device in an AC test regime. The test apparatus includes a test plate capacitively couple to the signal terminals of the integrated circuit. The...
7352199 Memory card with enhanced testability and methods of making and using the same  
By decreasing the amount of card substrate required in a memory card to support the actual memory unit, the test interface of the card, which is usually removed before final assembly of the card,...
7352169 Testing components of I/O paths of an integrated circuit  
Testing the components of I/O paths in an integrated circuit at-speed operation (i.e., the speed at which the integrated circuit would be operated during normal non-test mode). In an embodiment,...
7348791 High voltage, high frequency, high reliability, high density, high temperature automated test equipment (ATE) switch design  
An electronic switching apparatus for use in automated test equipment. The electronic switching apparatus includes a transconducting device having source and drain regions where at least one of the...
7348597 Apparatus for performing high frequency electronic package testing  
Various apparatus for performing high frequency electronic package testing are disclosed. A test fixture assembly includes an electronics package having an interface structure, a mock-up IC,...
7348792 Packaging reliability super chips  
A test chip module for testing the integrity of the flip chip solder ball interconnections between chip and substrate. The interconnections are thermally stressed through an array of individual...
7348790 AC testing of leakage current in integrated circuits using RC time constant  
Some embodiments of the invention include apparatus and systems having integrated circuits. Terminals or pins of the integrated circuits are configured to be driven to a state, to be floated for a...
7348559 Defect inspection and charged particle beam apparatus  
In a defect inspection apparatus which combines a plurality of probes for measuring electric properties of a specimen including a fine circuit line pattern with a charged particle beam apparatus,...
7349223 Enhanced compliant probe card systems having improved planarity  
Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that...
7345366 Apparatus and method for testing component built in circuit board  
A multi-layered circuit board a built-in component including multiple terminals, at least one signal pad formed on a top surface of the multi-layered circuit board for signal transmission, each of...
7345495 Temperature and voltage controlled integrated circuit processes  
The present application relates to apparatus and methods for burn-in and other diagnostics performed on integrated circuits. In one embodiment, the invention includes a plurality of sockets, each...
7345498 Method and measurement program for burn-in test of two semiconductor devices simultaneously  
A method for a burn-in test includes steps (a) and (b). In the step (a), an operation test of a first semiconductor device is executed through first probes provided on a probe card. In the step...
7342404 Device for measurement and analysis of electrical signals of an integrated circuit component  
According to the invention, one or more external test connection contact points (pads; pins; balls), are provided in an integrated circuit component (chip) ( 1 ), through which signals ( 4, 5, 6 )...
7342409 System for testing semiconductor components  
A system for testing semiconductor components includes an interconnect, an alignment system for aligning a substrate to the interconnect, a bonding system for bonding the component to the...
7343571 Simulation model for a semiconductor device describing a quasi-static density of a carrier as a non-quasi-static model  
There is disclosed a simulation model for designing a semiconductor device, comprising adding at least a part of a difference between a density of a carrier described in a quasi-static manner with...
7342406 Methods and apparatus for inline variability measurement of integrated circuit components  
A method of measuring variability of integrated circuit components is provided. A specified parameter of at least one first array configuration comprising a plurality of the integrated circuit...
7342408 Semiconductor test device using leakage current and compensation system of leakage current  
The present invention relates to a semiconductor test device which may use a leakage current and/or a compensation system of leakage current. The semiconductor test device, according to exemplary...
7342405 Apparatus for reducing power supply noise in an integrated circuit  
A power supply provides power to a power terminal of an integrated circuit device under test (DUT). The DUT's demand for current at the power input terminal may temporarily increase due, for...
7342407 Temperature compensation circuit and testing apparatus  
A temperature compensation circuit for effectively compensating the difference of a switching timing due to temperature change of a switching element included in a logic circuit is provided. The...
7339364 Circuit and method for on-chip jitter measurement  
An improved built-in self-test (BIST) circuit and an associated method for measuring phase and/or cycle-to-cycle jitter of a clock signal, the BIST circuit implement a Variable Vernier Digital...
7339393 Gate drive circuit for an insulated gate power transistor  
The invention relates to a gate drive circuit for, and in combination with, an insulated gate power transistor. The drive circuit is connected to the gate terminal of the transistor for the purpose...
7339392 Apparatus measuring substrate leakage current and surface voltage and related method  
An apparatus and related method for testing a semiconductor device are provided. The apparatus includes a unit depositing charge on an insulating layer formed on a semiconductor substrate, a unit...
7339385 Semiconductor test apparatus and interface plate  
There is provided a semiconductor testing apparatus having a test head body having signal modules for processing the test signals, a plurality of connection cables electrically connected with the...
7339391 Defect detection method  
A defect detection method is disclosed, in which the method includes: providing a semiconductor sample, wherein the semiconductor sample comprises at least one defect; utilizing a failure analysis...
7339389 Semiconductor device incorporating characteristic evaluating circuit operated by high frequency clock signal  
In a semiconductor device, a main circuit is operated by a first clock signal, and at least one characteristic evaluating circuit is operated by a second clock signal whose frequency is higher than...
RE40105 Probe card having groups of probe needles in a probing test apparatus for testing semiconductor integrated circuits  
A probe card which can help to enhance the productivity of semiconductor integrated circuits manufacturing and to reduce the manufacturing cost thereof, and a method of probe-testing semiconductor...
7336092 Closed loop feedback control of integrated circuits  
Systems and methods for closed loop feedback control of integrated circuits. In one embodiment, a plurality of controllable inputs to an integrated circuit is adjusted to achieve a predetermined...
7336066 Reduced pin count test method and apparatus  
Testing of an electronic device is carried out by combining power and signal delivery on a single pair of wires. The power delivery is decoupled from the signal delivery, using inductors, so the...
7336091 Assembly for simultaneously testing multiple electronic components  
An assembly for simultaneously electrically testing a plurality of electronic components. There is a test fixture, and a lead frame carrying a plurality of electronic components to be tested, each...
7336086 Measurement of bias of a silicon area using bridging vertices on polysilicon shapes to create an electrical open/short contact structure  
An apparatus and method are disclosed for measuring bias of polysilicon shapes relative to a silicon area wherein the presence of an electrical coupling is used to determine the presence of bias....
7332925 Engaging device of circuit board  
An engaging device of a circuit board is disclosed. The engaging device is for engaging a circuit board having a positioning hole to a housing of an electronic device. The engaging device includes...
7332907 Semiconductor device having a connection inspecting circuit for inspecting connections of power source terminals and grounding terminals  
The invention provides a semiconductor device that can inspect the connection states of power source terminals and grounding terminals of a test LSI at a low cost and in a short time, and an...
7332926 Semiconductor test apparatus  
Good device PASS/FAIL determination is realized by measuring timings of a cross point of differential clock signals CLK and a data signal DATA output from a DUT, and obtaining a relative phase...
7332927 Apparatus for temporary thermal coupling of an electronic device to a heat sink during test  
A method, system and apparatus for testing an integrated circuit chip. The system including: means for forming a liquid polyalphaolefine layer on a bottom surface of the integrated circuit chip, a...
7332360 Early detection of metal wiring reliability using a noise spectrum  
The present invention generally provides an apparatus and a method for inspecting a substrate in a substrate processing system. In one aspect, a voltage or current source is used in conjunction...
7332916 On-chip signal waveform measurement apparatus for measuring signal waveforms at detection points on IC chip  
An on-chip signal waveform measurement apparatus mounted on an IC chip measures signal waveforms at detection points on the IC chip. A reference voltage generator successively generates reference...
7332924 Embedded test circuitry and a method for testing a semiconductor device for breakdown, wearout or failure  
Reliability testing circuitry is built into the wafer or IC package in the form of one or more individual testers that use small-area transistors as DUTs. Stress can be applied to the DUTs in...
7332917 Method for calculating frequency-dependent impedance in an integrated circuit  
A method for calculating frequency-dependent impedance in an integrated circuit (IC) having transistors coupled together by a line follows. First, partition the line into a plurality of rectangles...
7330582 Bonding program  
With an assumption that the three data of the position (X 1 , Y 1 ) of the first positioning pattern 202 and position (X 2 , Y 2 ) of the second positioning pattern 212 of the reference chip ...
7330045 Semiconductor test apparatus  
Output data of a device under test (DUT) is obtained at timing of both rising and falling edges of a clock output from the DUT, and output data of a DDR type device is fetched in synchronization...
7330040 Test circuitry wafer  
Method and apparatus for testing a plurality of devices on a device wafer. One embodiment provides a test circuitry wafer having a first surface and a second surface, the test circuitry wafer...
Matches 401 - 450 out of 3056 < 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 >