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7304487 |
Test method of semiconductor devices
A contactor apparatus having a first contactor ( 2 ) and a second contactor ( 4 ) acquires an electrical conduction to a plurality of semiconductor devices formed on a semiconductor wafer ( 6 )....
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7304485 |
Analysis of the quality of contacts and vias in multi-metal fabrication processes of semiconductor devices, method and test chip architecture
A test chip performs measurements to evaluate the performances of interconnects. In particular, the statistical failure distribution, the electromigration and the leakage current are measured. An...
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7304491 |
Interconnect for testing semiconductor components
An interconnect for testing semiconductor components includes interconnect contacts configured for bonding to, and then separation from component contacts on the components. The interconnect can be...
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7299566 |
Substrate-placing mechanism having substrate-heating function
The present invention is a substrate-placing mechanism to be provided in a processing container of a substrate-processing apparatus including: a stage having: a base body on which a substrate is...
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7301325 |
Method and apparatus for creating performance limits from parametric measurements
A measurement device includes a measurement circuit that generates a parametric measurement data signal including parametric characteristics of an input signal. In an exemplary embodiment, the...
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7301327 |
Testing of a system-on-a-chip having a programmable section and a plurality of high-speed interfaces
Testing of a system-on-a-chip having a programmable section and a plurality of high-speed interfaces begins by configuring the programmable section to support a 1 st level testing of the plurality...
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7301359 |
Testing apparatus, and testing method
Here is provided a testing apparatus for judging whether or not a device-under-test is defect-free based on static power-supply current of the device-under-test, having a power supply for supplying...
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7301357 |
Inspection method and inspection equipment
In an inspection method according to the invention, a plurality of drivers 21 incorporated in a tester 20 apply a fritting voltage to respective electrodes P via first probe pins 11 A included...
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7298159 |
Method of measuring the leakage current of a deep trench isolation structure
The trench leakage current of a deep trench isolation structure is measured. The deep trench isolation structure, which is filled with polysilicon, contacts both a first region of a first...
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7299389 |
Test circuit, integrated circuit, and test method
A test circuit comprises a selector SEL 1 having a first input to which signals M 1 OUT from a macro block MB 1 are input and a second input to which test input signals TIN 1 and TIN 2 for a...
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7298154 |
Probe apparatus
A probe apparatus and a probe system are provided. The probe apparatus uses a larger printed circuit board to dispose a plurality of testers. The layout of each of the testers on the circuit board...
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7298157 |
Device for generating internal voltages in burn-in test mode
The disclosure is a device for applying a test voltage from the external of a memory device in a burn-in test mode. An internal voltage generator for a burn-in test is comprised of pad means...
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7298156 |
Electronic part test apparatus
A holding side contact arm ( 317 ) for holding an IC to be tested is positioned on the optical axis (OP) of an alignment CCD camera ( 326 ) of an alignment device ( 320 ), the IC to be tested is...
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7298158 |
Network analyzing apparatus and test method
A network analyzing apparatus that analyzes the network properties of a device under test by applying reference signals to a device under test by frequency sweeping or power sweeping comprises...
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7298161 |
Circuitry and methodology to establish correlation between gate dielectric test site reliability and product gate reliability
A method and system for predicting gate reliability. The method comprises the steps of stressing a gate dielectric test site to obtain gate dielectric test site data and using the test site data to...
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7295029 |
Chip-scale package for integrated circuits
A chip-scale packaged IC is made by bonding one or more singulated die chips (from an IC wafer) to a common substrate, such as a single cap wafer (or a portion thereof) and cutting (singulating)...
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7294853 |
Substrate for mounting a semiconductor
A substrate ( 1 ) is formed from a non-electrically conducting material and is for mounting a semiconductor chip ( 10 ). The substrate has a semiconductor chip mounting portion ( 6 ). A number of...
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7295031 |
Method for non-contact testing of marginal integrated circuit connections
Non-contact connectivity testing of joints connecting circuit junctions are improved through knowledge of characteristics of semiconductor junctions connected to component nodes of components of a...
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7295021 |
Process and circuit for protection of test contacts in high current measurement of semiconductor components
To limit the current in heavy current testing of semiconductor components with test needles, upstream of each needle a circuit is connected which has low resistance in the range of allowable...
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7295030 |
Thin film transistor tester and corresponding test method
To test electrical characteristics of a Thin Film Transistor (TFT) with a source or drain terminal left open and exposed, using a non-contact current source and protecting the TFTs from adverse...
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7292058 |
Method for estimating the early failure rate of semiconductor devices
According to one embodiment of the invention, a method for estimating the failure rate of semiconductor devices includes obtaining accelerated stress duration data for a plurality of semiconductor...
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7288954 |
Compliant contact pin test assembly and methods thereof
A compliant contact pin assembly and a contactor card and methods for testing therewith are provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate...
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7288953 |
Method for testing using a universal wafer carrier for wafer level die burn-in
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer,...
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7285948 |
Method and apparatus providing single cable bi-directional triggering between instruments
System and apparatus enabling the use of a single cable to communicate triggering information between each of a plurality of signal acquisition devices and, illustratively, an external trigger...
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7285973 |
Methods for standardizing a test head assembly
A standardized test head assembly for testing a plurality of integrated circuit dice each having a different bonding pad footprint, the test head assembly including an arrangement of probe holes...
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7282942 |
Enhanced sampling methodology for semiconductor processing
The present invention improves wafer sampling methods by partitioning a semiconductor wafer into a set of sampling regions and calculating yield of a sampling region(s) of the semiconductor wafer.
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7282931 |
Full wafer contacter and applications thereof
A replacement for probe cards includes a full wafer contacter. A first surface of the full wafer contacter is brought into contact with, and the contacter is attached to, a wafer, thereby making...
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7282925 |
Apparatus to facilitate functional shock and vibration testing of device connections and related method
An apparatus and associated method are disclosed for facilitating the testing of device connections, including functional shock and vibration testing of peripheral card slots or any other desired...
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7282941 |
Method of measuring semiconductor wafers with an oxide enhanced probe
A method of measuring at least one electrical property of a semiconductor wafer includes providing an elastically deformable and electrically conductive contact having an insulative oxide layer...
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7282930 |
Device for testing thin elements
A device for testing thin elements, such as wafers or individual substrates, while at the same time offering a facility for inspecting the reverse side of the thin elements is provided in which any...
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7282940 |
Semiconductor device with electrode pads for test probe
A semiconductor device includes a plurality of I/O regions provided in a peripheral region of the semiconductor device. Each of the plurality of I/O regions includes an electrode pad. The electrode...
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7283918 |
Apparatus for analyzing fault of semiconductor integrated circuit, method for the same, and computer readable medium for the same
A fault on a measuring point and information about a driving circuit of the fault are extracted. A signal value of a portion related to the fault on the measuring point and an input value of the...
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7282905 |
System and method for IDDQ measurement in system on a chip (SOC) design
System and method for detecting transistor failure in large-scale integrated circuits by measuring IDDQ. A preferred embodiment comprises a switch structure for an integrated circuit made up of a...
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7279922 |
Sub-sampling of weakly-driven nodes
A method and apparatus for performing on-chip voltage sampling of a weakly-driven node of a semiconductor device are disclosed. In some embodiments, the node is a floating node or is...
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7279923 |
LSI inspection method and defect inspection data analysis apparatus
The present invention provides an LSI inspection method and a defect inspection data analysis apparatus capable of shortening a time needed for a wafer test. In a first database 11 is stored...
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7279887 |
In-process system level test before surface mount
Methods and systems for testing an integrated circuit during an assembly process are described. The integrated circuit is received from inventory. The integrated circuit is placed in a socket on a...
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7279921 |
Apparatus and method for testing power and ground pins on a semiconductor integrated circuit
To achieve the foregoing, and in accordance with the purpose of the present invention, a method and apparatus for testing individual power and ground pins on a semiconductor integrated circuit are...
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7279918 |
Methods for wafer level burn-in
A method, circuit and system for determining burn-in reliability from wafer level burn-in are disclosed. The method includes recording the number of failures in each IC die in nonvolatile elements...
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7279888 |
Handling unit for electronic devices
A handling unit includes a frame, at least one arrangement module, and at least one chip carrier. The frame has at least one recess for the interchangeable mounting of at least one of the...
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7279920 |
Expeditious and low cost testing of RFID ICs
System and method for integrated circuit manufacturing. A preferred embodiment comprises transmitting a first set of data to integrated circuits (ICs) while they are in an on-wafer state and having...
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7279703 |
Self-heating burn-in
A method and an apparatus for self-heating burn-in have been disclosed. In one embodiment, a semiconductor device includes a plurality of gates, a multiplexer to select a clock signal out of a...
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7279919 |
Systems and methods of allocating device testing resources to sites of a probe card
Systems and methods of allocating device testing resources are described. In one aspect, a system for allocating m resources for testing devices to n sites of a probe card configured to...
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7279915 |
Test method for electronic modules using movable test contactors
A pass through test system for testing an electronic module includes an interface board, and test contactors movably mounted to the interface board for electrically engaging terminal contacts on...
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7278079 |
Test head utilized in a test system to perform automated at-speed testing of multiple gigabit per second high serial pin count devices
A portion of a test head utilized to perform simultaneous automated at-speed testing of a plurality of devices that generate serial data signals having gigabit per second baud rates. The portion of...
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7276929 |
Inspection system, inspection method, and method for manufacturing semiconductor device
The present invention provides an inspection system of ID chips that can supply a signal or power supply voltage to an ID chip without contact, and can increase throughput of an inspection process...
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7276923 |
Semiconductor device test probe
A semiconductor device test probe having a tip portion for being urged against an electrode pad of an integrated semiconductor device to establish an electrical contact against the electrode pad...
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7276925 |
Operating an integrated circuit at a minimum supply voltage
In one embodiment, an integrated circuit comprises at least one measurement unit configured to generate an output indicative of a supply voltage at which the integrated circuit is operable for a...
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7276896 |
Test apparatus and method for testing circuit units to be tested
The invention provides a test apparatus for testing a circuit unit ( 101 ) to be tested having a test system ( 100 ), a control bus ( 102 ) for transferring control data ( 106 ), an address bus (...
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7274194 |
Apparatuses and methods for repairing defects in a circuit
Methods and apparatuses to repair defects in a circuit, such as during or subsequent to the manufacture of the circuit. Defects may be detected through, for example, optical processing of an...
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7274203 |
Design-for-test circuit for low pin count devices
A design-for-test (DFT) circuit for an integrated circuit (IC) for enabling accurate quiescent current testing. The IC includes a voltage supply pin, a ground pin and an internal voltage regulator...
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