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7057406 |
Integrated type probe card and its fabrication method
An integrated type probe card includes a circuit space converter having first and second contacts arranged at different density at two sides, probes connected to the contacts at one side of the...
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7057405 |
Wafer test method utilizing conductive interposer
A wafer test method is performed for a wafer prior to forming bumps on the wafer, using a conductive interposer having one side with test pads and the other side with test bumps electrically...
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7053643 |
Radio frequency (RF) test probe
A test probe apparatus having a housing and a probe pin is provided. The housing includes a first housing end portion having a round tapered wall defining a tapered cavity. The probe pin includes a...
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7053644 |
System for testing and burning in of integrated circuits
A system for testing integrated circuits is described. A contactor board of the system has pins with ends that contact terminals on a power and signal distribution board. Opposing ends of the pins...
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7049837 |
Probe sheet, probe card, semiconductor test equipment and semiconductor device fabrication method
A probe card has first contact terminals electrically connected to the fine-pitch electrodes of a test target; wirings drawn from the first contact terminals; and second contact terminals...
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7049835 |
Probe card for high speed testing
Epoxy probe cards are modified by mounting passive and/or active electronic components on the insulating surface of the probe card and connecting those components to the probe wires with short,...
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7049838 |
Semiconductor device tester with slanted contact ends
A semiconductor tester device includes at least a probe having a plunger making contact with a semiconductor device at one end and being slanted at the other end, and an elastic member able to...
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7046020 |
Probes with perpendicularly disposed spring pins, and methods of making and using same
A probe for probing test points on a target board uses a printed circuit board (PCB) having a plurality of signal routes for routing signals to a test instrument. The probe also has a plurality of...
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7036218 |
Method for producing a wafer interposer for use in a wafer interposer assembly
A method for producing a wafer interposer ( 210 ) for use in a wafer interposer assembly is disclosed. The wafer interposer ( 210 ) is produced by attaching solder bumps ( 140 ) to a lower surface...
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7032307 |
Method for fabricating a probe pin for testing electrical characteristics of an apparatus
A probe pin for testing electric characteristics of a semiconductor device comprises a silicon pin core ( 3, 23, 33 ), and a conductive film ( 4, 24, 34 ) covering the entire surface, including the...
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7034558 |
Test system for device and method thereof
In one embodiment, a contactor ( 200 ) is provided. The contactor ( 200 ) comprises a device side ( 210 ), a test circuit board side ( 155 ), and a thickness ( 110 ). The device side ( 210 ) is in...
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7030636 |
Low pin testing system
A low pin testing system for efficiently detecting unlocked terminals within an electrical connector. The low pin testing system includes a housing with a receiver opening for removably receiving...
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7027946 |
Broadside compare with retest on fail
A tester routine is provided that evaluates multiple test pins, on multiple devices under test, at the same time and only if a fail occurs does any evaluation have to be made. In the case of a...
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7026833 |
Multiple-chip probe and universal tester contact assemblage
A probe card assemblage for simultaneously testing one or more integrated circuit chips including an interposer having on one surface a plurality of protruding contact elements for electrically...
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7023231 |
Work function controlled probe for measuring properties of a semiconductor wafer and method of use thereof
In a method of measuring at least one electrical property of a semiconductor wafer, an elastically deformable conductive contact formed from an electrically conductive coating overlaying an...
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7015714 |
Testing device for printed circuit boards
A testing device for testing a printed circuit board comprises a testing signal converting module which comprises a connector for receiving testing signals from the printed circuit board and a...
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7015710 |
Contact probe and probe device
A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form...
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7015707 |
Micro probe
Described are probes, designed to make electrical contact with high-density chips or similar electronic devices. Two groups of probes are covered. The first group includes probes that are moved...
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7015708 |
Method and apparatus for a high frequency, impedance controlled probing device with flexible ground contacts
A spring loaded, high frequency, controlled impedance, coaxial probe assembly located within an insulated or conductive housing. A high frequency coaxial probe assembly consisting of a central...
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7012441 |
High conducting thin-film nanoprobe card and its fabrication method
A conducting thin-film nanoprobe card fabrication method includes the steps of: (a) arranging nanotubes on a substrate in vertical; (b) covering the nanotubes with a liquid polymeric resin and then...
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7002225 |
Compliant component for supporting electrical interface component
An apparatus in one example includes a compliant component for supporting an electrical interface component that serves to electrically and mechanically couple a die with a separate layer. In one...
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6998864 |
Structures for testing circuits and methods for fabricating the structures
One embodiment of the present invention is a structure useful for testing circuits that includes: (a) a flexible substrate having contactors on a first side and pads on a second side; (b) a rigid...
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6998859 |
Test probe with side arm
The present invention discloses an electrical test probe having a side arm member attached to a main probe element at an angle less than 90 degrees. The length of the side arm is such that the end...
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6991960 |
Method of semiconductor device package alignment and method of testing
A method and apparatus for aligning a semiconductor device with a corresponding landing site on a carrier substrate. At least two apertures are formed in a semiconductor device, the apertures...
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6984997 |
Method and system for testing multi-chip integrated circuit modules
A system and method for utilizing a multi-probe tester to test an electrical device having a plurality of contact pads. Multi-probe tester test probes and electrical device contact pads are arrayed...
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6984998 |
Multi-function probe card
A multi-function probe card ( 40 ) includes a PCB ( 41 ), a plurality of probe needles ( 47 ), a counter ( 71 ) to acquire a “piece sequence parameter”, a signal-measuring device ( 72 ) via the...
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6985820 |
Conductor arrangement for reduced noise differential signalling
A method for analyzing input output (I/O) pin arrangements to determine the effect of differential pair and power and ground pin placement on signal quality which includes constructing an array of...
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6984996 |
Wafer probing that conditions devices for flip-chip bonding
A probing system or process for electrical testing of a device fabricated on a wafer also conditions terminals such as solder balls on the device to improve uniformity of the heights of the...
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6975127 |
Planarizing and testing of BGA packages
The planarity of external terminals or a ball grid array on a device package can be improved through use of test probes that flatten the electrical terminals while forming the electrical contacts...
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6972579 |
Wafer integrated plasma probe assembly array
A wafer integrated plasma diagnostic apparatus for semiconductor wafer processing system having a multiplicity of plasma probe assemblies arranged on a wafer in a planar array fashion such that one...
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6972582 |
Apparatus and method for measuring semiconductor wafer electrical properties
An apparatus for measuring at least one electrical property of a semiconductor wafer includes a probe including a shaft having at a distal end thereof a conductive tip for electrically...
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6968614 |
Method for positioning an electronic module having a contact column array into a template
A method for positioning an electronic module having a plurality of interconnecting elements into a template. A first portion of the interconnecting elements are aligned with holes in the template...
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6967493 |
Probe card and contactor of the same
A probe card used for measuring electrical characteristics of a semiconductor device such as an LSI chip and comprising a contactor mounting substrate on which a plurality of contactors are...
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6958619 |
Inspecting apparatus and inspecting method for circuit board
The present invention provides an apparatus and method for inspecting a circuit board at a high speed. A PDP driver module 100 as an object to be inspected has an onboard PDP driving LSI 110 . A...
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6952111 |
Apparatus and method for universally testing semiconductor devices with different pin arrangement
An apparatus for testing a semiconductor device is disclosed. According to the present invention, the apparatus includes a pair of input pins, a first conductive wire, a second conductive wire, a...
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6951125 |
System and method for aligning an integrated circuit die on an integrated circuit substrate
A system and method is disclosed for aligning an integrated circuit die on an integrated circuit substrate. A plurality of deposits of deformable material are placed on the substrate where the...
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6946866 |
Measurement of package interconnect impedance using tester and supporting tester
A tester head from a tester is used to mount a probe card. A DUT/load board has a socket which is configured to hold a substrate. Probe pins from the probe card make contact with bump pads on the...
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6937039 |
Tip and tip assembly for a signal probe
A signal probe includes a tip assembly having a first tip for contacting a first signal node, a second tip for contacting a second signal node, and a tip body for positioning the first tip a...
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6937037 |
Probe card assembly for contacting a device with raised contact elements
A probe card is provided for probing a semiconductor wafer with raised contact elements. In particular, the present invention is useful with resilient contact elements, such as springs. A probe...
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6937042 |
Contact probe and probe device
A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form...
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6937045 |
Shielded integrated circuit probe
A test probe consists of an elongated screw machine contact biased by a helical spring and mounted in a through hole of a non-conductive substrate. One end of the contact includes a crown for...
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6933853 |
Apparatus and method for detecting and communicating interconnect failures
One embodiment disclosed relates to a printed circuit assembly (PCA) with built-in circuitry to detect and communicate an interconnect failure. The PCA includes a connector, a continuity detect...
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6927586 |
Temperature compensated vertical pin probing device
An improved vertical pin probing device is constructed with a housing with spaced upper and lower spacers of a metal alloy, each having a thin sheet of silicon nitride ceramic material held in a...
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6917212 |
Test fixture for printed circuit board assembly
A test fixture for a printed circuit board (PCB) assembly ( 6 ) includes lower and upper units ( 2, 4 ). The PCB assembly includes a PCB ( 60 ) defining two spaced positioning holes ( 62 ), and a...
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6910924 |
Wireless CASS interface device
An interface device for interfacing automatic test equipment (ATE) with a unit under test (UUT) comprises at least one general purpose interface (GPI) connector body carrying at least one floating...
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6911834 |
Multiple contact vertical probe solution enabling Kelvin connection benefits for conductive bump probing
Apparatus and methods for testing conductive bumps or target test points on integrated circuits. A multiplicity of probes are extended through a support substrate. At least one of the multiplicity...
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6911835 |
High performance probe system
A probe system for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs to be tested includes a probe board assembly, a...
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6909300 |
Method for fabricating microelectronic fabrication electrical test apparatus electrical probe tip having pointed tips
A method for fabricating an electrical test apparatus electrical probe tip first provides a probe tip substrate having a topographic surface. A high density plasma chemical vapor deposition...
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6902416 |
High density probe device
A probe block assembly has an electrically insulative housing and an electrically conductive plate. The front side of the housing has a forward face and a recessed face. The electrically conductive...
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6900651 |
Electroconductive contact unit assembly
A low electric resistance is accomplished because there are no parts connecting different components as opposed to the arrangement using an electroconductive needle member and an electroconductive...
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