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7323892 |
Probe having a frame to align spring pins perpendicularly to a printed circuit board, and method of making same
In one embodiment, a probe for probing test points on a target board includes a printed circuit board, a frame, and a plurality of spring pins. The printed circuit board (PCB) has a first side with...
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7323890 |
Multi-point probe
A multi-point electrical probe for testing location-specific electrical properties on circuit boards. Four generally parallel, electrically conducting probe arms are produced preferably by...
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7315176 |
Electrical test probes, methods of making, and methods of using
Disclosed herein is an electronic test probe including a compression spring disposed in the housing in engagement with a plunger, the compression spring including a first section of coils including...
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7312617 |
Space transformers employing wire bonds for interconnections with fine pitch contacts
Method and apparatus for electrical testing of a device under test (DUT) that employs a connection board with signal contacts for applying test signals and a space transformer that has low pitch...
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7309991 |
Scanning probe inspection apparatus
A pair of pads is formed on an insulating layer formed on a top surface of a substrate, and a plurality of through-holes is laid out at equal intervals between the pads. Adjoining through holes are...
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7304481 |
Apparatus for testing electric cables
In one preferred embodiment, an apparatus for testing a cable includes an interface for connecting to a connector of the cable, many resistors, a socket, and a meter for testing resistance of the...
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7304490 |
In-situ wafer and probe desorption using closed loop heating
A semiconductor wafer is tested by heating an electrical contact to a temperature sufficient to desorb water vapor and/or organic material from a surface thereof. The semiconductor wafer is also...
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7301326 |
Modular interface
An apparatus for interfacing a test head to a peripheral system is provided. The apparatus includes a first unit having a first connection member for providing electrical communication with the...
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7298154 |
Probe apparatus
A probe apparatus and a probe system are provided. The probe apparatus uses a larger printed circuit board to dispose a plurality of testers. The layout of each of the testers on the circuit board...
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7292055 |
Interposer for use with test apparatus
An interposer including at least two dielectric layers bonded to each other, sandwiching a plurality of conductors there-between. The conductors each electrically couple a respective pair of...
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7288954 |
Compliant contact pin test assembly and methods thereof
A compliant contact pin assembly and a contactor card and methods for testing therewith are provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate...
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7287421 |
Semiconductor probe with high resolution resistive tip and method of fabricating the same
A semiconductor probe with a high-resolution tip and a method of fabricating the same are provided. The semiconductor probe includes: a cantilever doped with a first impurity; a resistive convex...
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7288952 |
Contact probe, probe socket, electrical characteristic measuring device, and method for pushing the contact probe against object to be measured
A contact probe includes a probe tip and a damper. The probe tip includes a first barrel, a probe pin, and a first spring. The first barrel has a cavity with a bottom, an opening being disposed in...
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7285972 |
Test fixture for assembled wireless devices
A fixture for radio frequency (“RF”) testing of an assembled wireless device, the wireless device having a removable casing concealing one or more RF spring connectors, the fixture comprising:...
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7285968 |
Apparatus and method for managing thermally induced motion of a probe card assembly
A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate...
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7285973 |
Methods for standardizing a test head assembly
A standardized test head assembly for testing a plurality of integrated circuit dice each having a different bonding pad footprint, the test head assembly including an arrangement of probe holes...
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7285966 |
Probe and method of making same
Disclosed herein are a probe and a method of making the same, and more particularly to a probe having a minute pitch, with which a probe card corresponding to arrangement of pads formed with a...
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7282936 |
Die design with integrated assembly aid
An upper die portion ( 36 ) of a die head for aligning probe pins ( 14 ) in first array of first micro-holes ( 18 ) formed in lower die portion ( 12 ) of the die head, which generally includes a...
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7282945 |
Wafer scale high density probe assembly, apparatus for use thereof and methods of fabrication thereof
A structure useful as a probe for testing electrical interconnections to integrated circuit devices and other electronic components having a substrate with a bond wire elongated electrical...
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7282941 |
Method of measuring semiconductor wafers with an oxide enhanced probe
A method of measuring at least one electrical property of a semiconductor wafer includes providing an elastically deformable and electrically conductive contact having an insulative oxide layer...
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7279912 |
Dual arcuate blade probe tip
Provided is a dual arcuate blade probe tip for probing a node, such as a node hole, on a circuit. The probe has a shaft made from an electrically conductive material, concentric to a longitudinal...
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7276923 |
Semiconductor device test probe
A semiconductor device test probe having a tip portion for being urged against an electrode pad of an integrated semiconductor device to establish an electrical contact against the electrode pad...
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7276919 |
High density integral test probe
A high density integrated test probe and method of fabrication is described. A group of wires are ball bonded to contact locations on the surface of a fan out substrate. The wires are sheared off...
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7276921 |
Probe of under side of component through opening in a printed circuit board
A test device includes an element having a surface for contacting a first plane, and a probe having a free end positioned in a second plane. The element of the test having the surface to contact...
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7271602 |
Probe card assembly and method of attaching probes to the probe card assembly
A probe card assembly is provided. The probe card assembly includes a substrate layer defining a plurality of apertures and a plurality of probes. Each of the probes has a base and a tip. The base...
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7271606 |
Spring-based probe pin that allows kelvin testing
The voltage at a node of an integrated circuit can be measured or controlled using a two-wire kelvin contact with spring-based probe pins by offsetting and tapering the lower end section of the...
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7271607 |
Electrical, high temperature test probe with conductive driven guard
A probe needle apparatus and method provides a drive guard having the same potential as a probe needle for reducing signal noise in low current measurements. The probe needle apparatus includes a...
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7271600 |
Semiconductor switch circuit
First, second, and third semiconductor switches are connected in series between input and output terminals and first and second voltage application circuits are connected in parallel to first and...
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7262620 |
Resource matrix, system, and method for operating same
In one embodiment, a resource matrix is provided with a first set of pins, a second set of pins, and at least one programmable switching circuit. The first set of pins electrically couples the...
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7256598 |
Non-abrasive electrical test contact
A hybrid non-abrasive electrical test contact element of a test socket is taught. Unlike cantilever contact elements of the prior art, the contact element of the present invention is able to...
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7248065 |
Arcuate blade probe
An arcuate blade probe is disclosed. The arcuate blade probe includes a shaft with a pair of faces that converge towards each other along a probe axis and terminate at a single edge that includes...
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7245138 |
POGO pin and test socket including the same
A POGO pin that can measure low frequency products as well as RF products and also have a long life span, and a test socket including the POGO pin are provided. The POGO pin includes a metal...
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7243410 |
Method for manufacturing a probe card
A method for manufacturing a probe card includes a first contact formation step of forming a first contact on a first surface of a first sacrificial substrate, a second contact formation step of...
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7242199 |
Active interconnects and control points in integrated circuits
In various embodiments of the present invention, tunable resistors are introduced at the interconnect layer of integrated circuits in order to provide a for adjusting internal voltage and/or...
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7242202 |
Signal probe and probe assembly
A probe includes an electrical element. The probe has reduced parasitic loading. A probe assembly with a plurality of probes is also disclosed.
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7235993 |
High speed electromechanically driven test ahead
A method for testing an integrated circuit (IC) that includes a step of mechanically turning on off an electrical connection to a test pin disposed on an electronic test head. The method further...
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7233157 |
Test board for high-frequency system level test
A test board for a high-frequency system level test: The test board includes a main board having through holes filled with a conductive material. These holes may be located at a portion of the main...
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7227368 |
Testing head contact probe with an eccentric contact tip
A contact probe for a testing head effective to test a plurality of semiconductor-integrated electronic devices comprises a rod-like probe body having a cross section of prefixed contour and...
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7219418 |
Method to prevent damage to probe card
Probe cards are configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. Protective fuses are provided in electrical...
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7215131 |
Segmented contactor
A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted...
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7212019 |
Probe needle for testing semiconductor chips and method for producing said probe needle
A probe needle for testing semiconductor chips includes one end that is fixed in a holding element and a free end that includes a contact tip. The probe needle is provided—at least on the surface...
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7208957 |
Method for non-contact testing of fixed and inaccessible connections without using a sensor plate
A method for testing for a defect condition on a node-under-implicit-test of an electrical device is presented. The technique according to the invention includes stimulating a first node of the...
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7202686 |
Socket and test apparatus
A socket electrically coupled to a BGA unit includes a plurality of ball contacts including a housing wherein a through-hole having a larger diameter than that of the ball contact is formed in a...
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7196532 |
Test probe for semiconductor package
An embodiment may comprise a test probe to measure electrical properties of a semiconductor package having ball-shaped terminals. The probe may include a signal tip and a ground tip. The signal tip...
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7183775 |
Systems and methods for determining whether a heat sink is installed
Disclosed are systems and methods for determining when a heat sink is installed. In one embodiment, a system comprises an electrically-conductive heat sink retainer clip that is adapted to maintain...
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7180318 |
Multi-pitch test probe assembly for testing semiconductor dies having contact pads
Die probing devices can include multiple sets of probe wires, where certain probe wires correspond to test pads and other correspond to bond pads. The probe wires can be electrically coupled to...
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7180312 |
Probe card and method for manufacturing probe card
A probe card that is manufactured inexpensively. The probe card includes a base plate, a flexible substrate, and a contact probe. The contact probe is a flexible substrate formed from polyimide...
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7176703 |
Test probe with thermally activated grip and release
An electrical test probe has a thermally activated, configurable shape probe tip. At low temperatures, the probe tip is in a generally hooked configuration. Upon heating, the probe tip is converted...
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7170305 |
Apparatus and method for terminating probe apparatus of semiconductor wafer
A probe apparatus and method of terminating a probe that probes a semiconductor device with a signal cable from a tester side by side at a proximal end of the probe and a distal end of the signal...
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7167011 |
Differential measurement probe having retractable double cushioned variable spacing probing tips with EOS/ESD protection capabilities
A differential measurement probe has spring loaded, double cushioned probe assemblies and a pressure sensors disposed in a housing. The pressure sensors forms an electrical switch having an...
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