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7616018 |
Integrated circuit probing apparatus having a temperature-adjusting mechanism
A probing apparatus for integrated circuit devices comprises a probe card, a probe holder for holding the probe card, a test head and a temperature-adjusting mechanism. The probe card comprises at...
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7616017 |
Probe station thermal chuck with shielding for capacitive current
To reduce the time to make measurements and the noise in measurements obtained by probing a device supported on surface of a thermal chuck in a probe station, a conductive member is arranged to...
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7598722 |
Method and apparatus for sensing temperature
Method and system for periodically measuring the junction temperature of a semiconductor device. The junction exited by at least two sequential predetermined currents of different magnitudes. The...
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7595652 |
System and method for reducing heat dissipation during burn-in
A plurality of devices under test are each subject to a body bias voltage during burn-in testing. The body bias voltage reduces leakage current associated with the devices under test. A test...
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7592821 |
Apparatus and method for managing thermally induced motion of a probe card assembly
A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate...
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7589551 |
On-wafer AC stress test circuit
To make an alternating current (AC) stress test easier to perform in a wafer, an AC stress test circuit for performing the AC stress test on a test device fabricated in a test region of the wafer...
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7589546 |
Inspection apparatus and method for semiconductor IC
The connection between a PTC element 22 a corresponding to each semiconductor IC 11 a and a power-supply line 25 a is performed via a relay, a high voltage is supplied to the power-supply...
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7589545 |
Device for final inspection
A device is provided for subjecting a plurality of singulated semiconductor components to functional verification, which includes contact pins that are integrated in a test socket and establish a...
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7579854 |
Probe station and method for measurements of semiconductor devices under defined atmosphere
A prober is described that is suitable for testing of semiconductor substrates under atmospheric conditions that deviate from ambient conditions. The prober includes a chuck for mounting of a...
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7576553 |
Integrated circuit probing apparatus having a temperature-adjusting mechanism
A probing apparatus for integrated circuit devices comprises a probe card, a probe holder for holding the probe card, a test head and a temperature-adjusting mechanism. The probe card comprises at...
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7567090 |
Liquid recovery, collection method and apparatus in a non-recirculating test and burn-in application
A heat sink for use in the burn-in of an I/C chip, which chip has a generally “flat” surface. The heat sink has a “flat” surface with micro-channels therein, positioned to open and close in...
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7564253 |
Temperature characteristic inspection device
Optoelectronic properties of optical communication LEDs, LDs and PDs should be examined in a wide range of temperatures between −40° C. and +85° C. Low temperature photocharacteristics of...
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7560950 |
Packaging reliability superchips
A test chip module for testing the integrity of the flp chip solder ball interconnections between chip and substrate. The interconnections, are thermally stressed through an array of individual...
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7558064 |
Cooling apparatus
The cooling apparatus comprises an air supply system, a water supply system, and a sprayer, and has a structure such that water and compressed air are mixed and the air is sprayed together with the...
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7554349 |
Handlers for testing semiconductor devices that are capable of maintaining stable temperature in test environments
A semiconductor device test handler for maintaining stable temperature in a test environment may include a loading unit that loads a plurality of semiconductor devices mounted on a test tray; a...
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7554323 |
Direct facility water test head cooling architecture
An apparatus is provided to cool high-performance instruments within a semiconductor test head using direct facility water. The direct facility water cooling apparatus consists of an air chamber, a...
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7549794 |
In-furnace temperature measuring method
There is provided an in-furnace temperature measuring method that is capable of reducing the number of operation steps that are required for temperature measurement, and effectively applying a...
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7548081 |
System and method for controlling environmental parameters of a device under test
The present invention is directed to a system and method to seal a device under test (DUT) into a portable chamber wherein the magnitude of the temperature, either up or down, is maintained by...
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7548080 |
Method and apparatus for burn-in optimization
The present invention provides a method and apparatus for optimizing the burn-in of integrated circuits. One embodiment of the method comprises: performing a first portion of the burn-in process of...
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7541828 |
Burn-in sorter and sorting method using the same
Provided is an apparatus for sorting burn-in tested packaged chips, including a DC test unit performing a DC test on packaged chips, a DC failure/loading head moving in a first direction to load...
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7541824 |
Forced air cooling of components on a probecard
A probe card with an air channel over the active components for cooling the active components on the probe card is provided.
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7541822 |
Wafer burn-in and text employing detachable cartridge
A cartridge ( 10 ) includes a chuck plate ( 12 ) for receiving a wafer ( 74 ) and a probe plate ( 14 ) for establishing electrical contact with the wafer. In use, a mechanical connecting device (...
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7536571 |
System and method to maintain data processing system operation in degraded system cooling condition
A method, computer program product, and a data processing system for maintaining operation of the data processing system in the event of a degraded system cooling condition is provided. A first...
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7532023 |
Apparatus and methods for self-heating burn-in processes
A method includes installing a device under test (DUT) into each of a plurality of burn-in boards. The method further includes docking each of the burn-in boards to a respective docking location,...
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7518389 |
Interface assembly and dry gas enclosing apparatus using same
An interface assembly provided at a test head, for connecting a probe card to the test head. The interface assembly includes an interface comprising an interface body and a coaxial connector...
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7514947 |
Method of and system for functionally testing multiple devices in parallel in a burn-in-environment
A method of and a system for testing semiconductor devices heat a plurality of devices to a burn-in temperature, and perform functional tests in parallel on the plurality of devices at the burn-in...
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7514946 |
Semiconductor carrier tray, and burn-in board, burn-in test method, and semiconductor manufacturing method using the semiconductor carrier tray
By mounting a semiconductor carrier tray in an accommodating portion of a housing of a burn-in board and then closing a lid member, a large number of semiconductors can be placed on the burn-in...
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7504845 |
Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis
A micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes micro-spray heads disposed about a probe head. The...
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7501844 |
Liquid cooled DUT card interface for wafer sort probing
A water block heat dissipation on a probe card interface for cooling active components and other devices requiring heat dissipation on the probe card is presented.
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7498831 |
Conduction-cooled accelerated test fixture
According to one embodiment of the invention, a testing apparatus for executing highly accelerated life testing on at least one test subject including at least one structure operable to thermally...
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7498830 |
Burn-in apparatus
The burn-in apparatus includes a water supply system and a sprayer and has a structure such that water is converted into mist and sprayed onto the upper surface of a device attached to a socket of...
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7495460 |
Body for keeping a wafer, heater unit and wafer prober
A wafer holding body used for a wafer prober for testing a semiconductor wafer includes a chuck top having a conductive layer on a surface thereof and a support body supporting the chuck top. The...
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7492176 |
Prober and probe contact method
A prober and a method for reducing errors in the contact position between a probe and an electrode without lowering throughput when conducting a test of a wafer at a high or low temperature. The...
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7482825 |
Burn-in testing apparatus and method
An integrated circuit (IC) package testing apparatus integrates a temperature sensor, heater (or cooler), and controller within a single modular unit. The controller is a microprocessor embedded...
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7479796 |
Functional and stress testing of LGA devices
Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test...
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7479795 |
Temperature control apparatus
A temperature control apparatus includes a socket holder which is provided on a tester head and holds a socket to mount an IC chip. A socket cover has an opening to pass the end of a handler pusher...
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7472038 |
Method of predicting microprocessor lifetime reliability using architecture-level structure-aware techniques
A method of predicting the lifetime reliability of an integrated circuit device with respect to one or more failure mechanisms includes breaking down the integrated circuit device into structures;...
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7471100 |
Semiconductor integrated circuit tester with interchangeable tester module
A test head for an integrated circuit tester includes a main chassis defining a chamber that is open at the top. Tester modules are installed in the chamber, each tester module being removable as a...
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7457117 |
System for controlling the temperature of electronic devices
The system for controlling the temperature of electronic devices under test includes a housing, a seal, a heat-exchanger within the housing, and a Peltier module within the housing. The housing is...
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7453277 |
Apparatus for full-wafer test and burn-in mechanism
Assemblies include a substrate, such as a printed circuit board, with a first array of contact pads disposed thereon; a guide ring structure disposed on the substrate and at least partially...
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7449905 |
Automated characterization system for laser chip on a submount
A temperature-controlled system for testing a laser die mounted on a submount is disclosed. The testing system comprises a base having a motor-driven translation platform. The translation platform...
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7449904 |
Integrated circuit burn-in methods and apparatus
Improved methods for performing burn-in of electronic components, such as integrated circuits (ICs) with on-board thermal sense circuits, are used to obtain a higher bin split. According to an...
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7446547 |
Cooling apparatus and testing machine using the same
A cooling apparatus includes a cooling device, a baseplate and at least one shock absorber. The cooling device is used for absorbing and dissipating heat. The shock absorber comprises a pole and a...
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7446398 |
Bump pattern design for flip chip semiconductor package
A bump pattern design for flip chip semiconductor packages includes a pattern of contact pads formed on a package substrate. Each contact pad is adapted to receive a corresponding solder bump from...
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7443185 |
Apparatus and method for the application of prescribed, predicted, and controlled contact pressure on wires
The mechanical behavior of wires subjected to axial loading and experiencing bending deformation is used to ensure effective control of the contact pressure in mechanical and/or heat removing...
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7432729 |
Methods of testing electronic devices
A method and system of testing an electronic device can be performed by estimating the die temperature using correlation data previously collected for other electronic devices. In one embodiment,...
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7427768 |
Apparatus, unit and method for testing image sensor packages
The present invention relates to an apparatus, unit and method for testing image sensor packages, which can automatically test whether the image sensor packages are defective before they are...
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7425838 |
Body for keeping a wafer and wafer prober using the same
According to the invention, there is provided a wafer holding member for use in a wafer prober for inspecting a semiconductor wafer, including a chuck top and a supporting member for supporting the...
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7417448 |
System to calibrate on-die temperature sensor
A system may include biasing of diodes of a temperature sensor disposed in an integrated circuit die using a current from an off-die current source, generation of a voltage based on the current and...
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7397259 |
Method and apparatus for statistical CMOS device characterization
A unified test structure having a large number of electronic devices under test is used to characterize both capacitance-voltage parameters (C-V) and current-voltage parameters (I-V) of the...
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