|
Match
|
Document |
Document Title |
|
|
6242931 |
Flexible semiconductor interconnect fabricated by backside thinning
An interconnect for testing semiconductor components includes a thinned substrate, and first contacts on the substrate for electrically engaging second contacts on the components. The interconnect...
|
|
|
6239602 |
Temperature managing apparatus for multi-stage container
A temperature managing apparatus according to the invention comprises cooling jackets provided in each of a plurality of test containers, a tank for storing a cooling medium for the cooling...
|
|
|
6229329 |
Method of testing electrical characteristics of multiple semiconductor integrated circuits simultaneously
A method of testing semiconductor integrated circuits comprises the step of simultaneously testing a plurality of semiconductor integrated circuit elements for electric characteristics by applying...
|
|
|
6229325 |
Method and apparatus for burn-in and test of field emission displays
A method and apparatus which provides for continual monitoring of the electrical and optical performance of one or more field emission display devices while the devices are burned-in is for the...
|
|
|
6229322 |
Electronic device workpiece processing apparatus and method of communicating signals within an electronic device workpiece processing apparatus
The present invention includes an electronic device workpiece processing apparatus and method of communicating signals within an electronic device workpiece processing apparatus. One embodiment of...
|
|
|
6229326 |
Method and apparatus for testing electronic device in burn-in process
A method and an apparatus are provided for determining a defect of an electronic device in a burn-in process. The method for testing the electronic device having a plurality of output signals...
|
|
|
6225798 |
Semiconductor device tester
In an IC tester comprising a tester part and a handler which includes two test stations or an IC tester comprising a tester part and two handlers, useless waiting times wasted by the tester part...
|
|
|
6218850 |
Apparatus for selecting high-reliability integrated circuits
An apparatus provided for selecting high-reliability integrated circuits is disclosed. The apparatus includes pattern boards, feedthrough cards, a main board, a signal board, a plurality of...
|
|
|
6213636 |
Furnace for testing integrated circuits
A furnace for testing integrated circuits has a furnace body for holding the integrated circuits undergoing testing. A water outlet pipe and an air exhaust pipe are connected to the furnace body....
|
|
|
6215323 |
Method and apparatus for temperature-controlled testing of integrated circuits
Method and apparatus for testing integrated circuits at controlled temperatures in a low thermal mass environment. The test system uses heat transfer elements such as Peltier devices inside the...
|
|
|
6215324 |
Dynamic burn-in test equipment
There is provided a dynamic burn-in test equipment being capable of testing a large number of multi-pin LSI chips in a short test time and at a low cost. The dynamic burn-in test equipment includes...
|
|
|
6208130 |
Electrical transfer switch and related method
The disclosure involves a transfer switch having a stationary frame and a front terminal matrix for connection to circuit boards undergoing test. There are two stationary connectors mounted on the...
|
|
|
6204679 |
Low cost memory tester with high throughput
An automatic test system for testing semiconductor devices, particularly memory devices. The test system includes a handling device with several temperature controlled chambers, each associated...
|
|
|
6194907 |
Prober and electric evaluation method of semiconductor device
A prober can make an appropriate evaluation in a microcurrent region. A wafer (9) is disposed on a chuck (8) in a casing (1). In the upper surface of the chuck (8), an electrode (8a) is formed...
|
|
|
6191599 |
IC device under test temperature control fixture
A temperature control fixture for an integrated circuit under test which provides for heating or cooling of the back side of the integrated circuit while it is being tested by contacts and...
|
|
|
6184504 |
Temperature control system for electronic devices
An apparatus 10 for controlling a temperature of an electronic device 40, comprising a temperature regulated surface 100 and an actuator 105 adapted to alternately pulse the temperature regulated...
|
|
|
6181143 |
Method for performing a high-temperature burn-in test on integrated circuits
A method for performing a high-temperature burn-in test on integrated circuits is disclosed. A thin-film is placed on top of an integrated circuit having multiple transistors. An infra-red filter...
|
|
|
6181146 |
Burn-in board
A burn-in board Vcc circuit changeover socket 204A and a GND circuit changeover socket 205A wich are arranged in a wiring area between terminals 1 to 7 of an IC socket 202 and resistors 203...
|
|
|
6181145 |
Probe card
A probe card provides electrical connection between an IC device under test (DUT) and a testing apparatus. The probe card includes: a test chip for transferring a signal between the DUT and the...
|
|
|
6169413 |
System for testing hard disk drives
A system for multi-testing a number of hard disk drives (HDDs) comprises a burn-in chamber of high temperature for orderly stacking the HDDs in rows and columns, a control chamber thermally...
|
|
|
6166555 |
Apparatus and method for seating and/or unseating printed circuit boards in a chamber
An apparatus for connecting and/or disconnecting at least one printed circuit board with at least one socket in a chamber, the printed circuit board being at least partially disposed within the...
|
|
|
6163161 |
Directed self-heating for reduction of system test time
An integrated circuit provides self-heating in order to assist an externally applied thermal control unit raise the temperature of the integrated circuit to a specified range of temperatures at...
|
|
|
6163145 |
Transporting apparatus for semiconductor device
A transporting apparatus used in testing a plurality of semiconductor devices includes a magazine in which a plurality of pallets are stacked in plural stages, each pallet with a plurality of...
|
|
|
6157202 |
Hybrid IC with circuit for burn-in test
A hybrid IC with a semiconductor power device and a control circuit for controlling the power device being bare-chip mounted on a substrate includes a wiring arranged between a power source line...
|
|
|
6157201 |
Burn-in system for reliable integrated circuit manufacturing
A burn-in system for integrated circuits (ICs) generates thorough input stimuli from within the burn-in chamber. A very high node-toggle percentage within the IC being exercised is achieved,...
|
|
|
6154042 |
Uniform temperature environmental testing apparatus for semiconductor devices
A method and apparatus for maintaining a uniform temperature of semiconductor devices mounted on a burn-in board. A cover is positioned on the burn-in board to enclose all of the semiconductor...
|
|
|
6150829 |
Three-dimensional programmable connector
A three dimensional programmable connector used in a burn-in test system for manufactured integrated circuits is provided with a plurality of planar electrodes which are selectively connectable to...
|
|
|
6147506 |
Wafer test fixture using a biasing bladder and methodology
A wafer test and burn-in fixture and methodology including a wafer probe having flexible tabs and a load board coupled to the wafer probe using the flexible tabs. The fixture also includes a...
|
|
|
6144215 |
Setup for testing an integrated circuit in a semiconductor chip wherein the temperature of the semiconductor chip is controlled
A test setup for testing an integrated circuit. A holder is provided which is capable of releasably receiving and holding the integrated circuit. Apparatus is provided which tests the integrity of...
|
|
|
6137299 |
Method and apparatus for testing integrated circuit chips
Formation of a contact probe having a pattern of dendritic textured contacts complementary to that of a contact pad array on a bare chip allows formation of simultaneous temporary connections to...
|
|
|
6114868 |
Uniform temperature environmental testing method for semiconductor devices
A method and apparatus for maintaining a uniform temperature of semiconductor devices mounted on a burn-in board. A cover is positioned on the burn-in board to enclose all of the semiconductor...
|
|
|
6114866 |
Semiconductor device test board and method for evaluating semiconductor devices
A semiconductor device test board solves a problem with conventional test boards in that test results obtained through a burn-in procedure could be identified only before the test board is taken...
|
|
|
6114867 |
Device testing apparatus
The present invention relates to a device testing apparatus used for screening testing of semiconductor devices and the like, and having a constant temperature oven in which a through hole is...
|
|
|
6111421 |
Probe method and apparatus for inspecting an object
A probe method is disclosed which inspects the electrical characteristics of an object to be inspected (wafer W) by bringing the electrodes of the object to be inspected placed on a main chuck and...
|
|
|
6104203 |
Test apparatus for electronic components
A test apparatus (1) has a temperature controlled chuck (8) which provides good mechanical stability across a wide temperature range. This significantly reduces the number of times the probes (9)...
|
|
|
6104204 |
Semiconductor device testing apparatus
An IC tester is provided which is capable of preventing the temperature of an IC heated to a predetermined temperature from falling during the test. A box-like housing 70 constructed of a thermally...
|
|
|
6100708 |
Probe card and wafer testing method using the same
A probe needle has one end and the other end. Probe needle has its one end fixed to the bottom surface of a substrate, and extending at a prescribed angle to substrate. A portion of probe needle...
|
|
|
6100706 |
Burn-in board support frame having inserter and ejector bars for racks of burn-in boards
An automatic loading and unloading support for use on the interior of a burn-in oven includes a frame that supports a rack of printed circuit burn-in boards connected to connectors along edges of...
|
|
|
6097200 |
Modular, semiconductor reliability test system
A system (10) for performing semiconductor reliability tests is disclosed including an oven (36) having open axial ends for slideably receiving a board (12). The board (12) includes an oven region...
|
|
|
6097201 |
System to simultaneously test trays of integrated circuit packages
A test system for testing numerous parts simultaneously. A stack of test boards is provided in a test chamber. Each of the test boards has a region of contactors on it. To perform a test, trays are...
|
|
|
6094059 |
Apparatus and method for burn-in/testing of integrated circuit devices
A technique for testing/stressing integrated circuit devices, especially wafers, having a plurality of contacts on one face thereof arranged in a predetermined pattern is provided. An interposer...
|
|
|
6094060 |
Test head for applying signals in a burn-in test of an integrated circuit
A technique for testing/stressing integrated circuit devices, especially wafers, having a plurality of contacts on one face thereof arranged in a predetermined pattern is provided. An interposer...
|
|
|
6091255 |
System and method for tasking processing modules based upon temperature
An on-chip thermometer and methods for using the on-chip thermometer to measure a local temperature and to operate an integrated circuit. The on-chip thermometer comprises a clock circuit, a...
|
|
|
6091062 |
Method and apparatus for temperature control of a semiconductor electrical-test contractor assembly
A semiconductor device handler with a temperature controlled test area. Temperature control is provided in part through the use of temperature controlled air forced across the test area. For...
|
|
|
6091252 |
Method, apparatus and system for testing bumped semiconductor components
A method, apparatus and system for establishing temporary electrical communication with semiconductor components having contact bumps are provided. The apparatus includes an interconnect having...
|
|
|
6084215 |
Semiconductor wafer holder with spring-mounted temperature measurement apparatus disposed therein
A temperature measuring unit of a wafer chuck measures the temperature of a wafer chuck when the wafer chuck holding a wafer W making in-unison contact with a contactor is made to contact a bottom...
|
|
|
6072325 |
Probe device
A probe device for testing a wafer divided into IC chips has a vessel that accommodates a wafer mounting stand and a flexible probe card having contactor bumps. The vessel is configured in a...
|
|
|
6069483 |
Pickup chuck for multichip modules
A pickup chuck which includes a body defining a fluid flow path and a first recess for receiving a semiconductor chip package, at least two chip contact members extending out of the body into the...
|
|
|
6064214 |
Perimeter trace probe for plastic ball grid arrays
A test probe assembly for testing integrated circuit (IC) packages mounted onto a ball grid array is described. The test probe assembly can also be used to interconnect test instrumentation to the...
|
|
|
6064217 |
Fine pitch contact device employing a compliant conductive polymer bump
A reusable test socket is described for testing fine pitch devices including singulated bare die, semiconductor wafers, chip sized packages, printed circuit boards, and the like to determine that...
|