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5831445 |
Wafer scale burn-in apparatus and process
An apparatus for wafer scale burn-in and testing of semiconductor integrated circuits and a method for its utilization is disclosed. A wafer is mated to a printed circuit board which electrically...
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5825171 |
Universal burn-in board
A universal burn-in board for burning-in semiconductor devices. The universal burn-in board is easily reconfigurable so that it may be used with a variety of semiconductor devices having the same...
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5796246 |
Test board and process of testing wide word memory parts
Wide word memory parts (608) are tested in a design for test "DFT" mode at elevated temperatures. The parts are mounted on test boards (600) and only the set of data I/O leads 0-3 active in the...
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5773986 |
Semiconductor wafer contact system and method for contacting a semiconductor wafer
A semiconductor wafer contact system includes a sealed bladder (32) containing incompressible material. The sealed bladder (32) presses against a flexible circuit layer (28) including an array of...
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5760595 |
High temperature electromigration stress test system, test socket, and use thereof
A test socket is provided as part of a high temperature electromigration test system to allow the prediction of median time to failure to temperatures in excess of 450° C. of VSLI interconnects.
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5744975 |
Enhanced defect elimination process for electronic assemblies via application of sequentially combined multiple stress processes
A method for testing electronic assemblies having an electronic component affixed via solder or other such connections to a printed circuit board. The method includes combining, in order, three...
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5742168 |
Test section for use in an IC handler
A test section for use in an IC handler capable of testing even high speed operating IC devices with precision is provided. A mounting fixture 62 for connecting a test head 32 of an IC tester with...
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5742177 |
Method for testing a semiconductor device by measuring quiescent currents (IDDQ) at two different temperatures
A method for detecting defects in a semiconductor device using an IDDQ testing technique that is not dependent upon the background leakage current for defect resolution. One embodiment of the...
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5731709 |
Method for testing a ball grid array semiconductor device and a device for such testing
A ball grid array semiconductor device (30) includes a plurality of conductive balls (36) and a plurality of conductive castellations (18) around its periphery as redundant electrical connections...
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5704220 |
Testing equipment having refrigerator incorporated therein
A testing equipment having a refrigerator incorporated therein which is capable of accomplishing a test for electrical characteristics of a tested object under stable circumstances substantially...
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5701667 |
Method of manufacture of an interconnect stress test coupon
This disclosure describes an Interconnect Stress Testing (IST) system and a printed wiring board test coupon which is used with the IST system. The system includes a computer device and a cabinet...
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5703482 |
Apparatus for testing electronic devices in hostile media
An apparatus for testing electronic devices in hostile media includes an isolation tank (24) which contains an inert or relatively inert material (26) such as fluorinated hydrocarbon liquid. Within...
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5696452 |
Arrangement and method for improving room-temperature testability of CMOS integrated circuits optimized for cryogenic temperature operation
Room temperature-testing of an MOS field effect transistor architecture, whose parameters have been optimized for operation at cryogenic temperatures, is facilitated by applying a prescribed...
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5691651 |
Device for testing integrated circuits
Device for testing integrated circuits by establishing a connection between the instrument and the circuit's pads, with a test card (1) that has pads or pins (4) on top of the instrument and...
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5672981 |
Universal power interface adapter for burn-in board
A power interface adapter that provides device power connections in a universal burn-in board system. The power interface adapter is a low-cost printed circuit board which interfaces on a...
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5670889 |
Probe card for maintaining the position of a probe in high temperature application
Probe card is a part which is incorporated into a probing equipment to test finished IC chips, This card is customarily mounted with a plurality of probes, very fine needle and generally bent, and...
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5656944 |
Burn-in voltage detection circuit for semiconductor chip
An improved burn-in voltage detection circuit for a semiconductor chip capable of detecting a predetermined voltage level related to a burn-in operation using a specific element irrespective of...
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5646540 |
Apparatus and method for measuring electromagnetic ageing parameter of a circuit element and predicting its values
An apparatus and method for determining the reliability of an electronic component by performing measurements which enable the ageing behavior of a parameter of that component to be predicted over...
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5638003 |
Method and apparatus for testing surface breakdown of dielectric materials caused by electrical tracking
An apparatus for testing a dielectric sample for susceptibility to surface electrical failure due to tracking. The apparatus includes an enclosure continuously purged of air-borne contaminants,...
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5635850 |
Intelligent test line system
Process information obtained by a process section is input to a host computer. The process information includes information about a film, information about etching, information about cleaning,...
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5617036 |
Laser/pin assembly with integrated burn-in assembly
A burn-in assembly is disclosed having a substrate on which devices to be tested are die and wire bonded. Circuitry for effecting the burn-in testing is connected to the devices under test, and...
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5614837 |
Probe apparatus and burn-in apparatus
A loader section for supplying semiconductor wafers is arranged at one end of a linear first convey path for a convey unit. Burn-in test sections, probe test sections, a laser repair section, a...
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5610529 |
Probe station having conductive coating added to thermal chuck insulator
A probe station suitable for low noise measurements includes a chuck for supporting a test device and a supporting surface for the test device. The probe station has means for controlling the...
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5602491 |
Integrated circuit testing board having constrained thermal expansion characteristics
A board (10) for testing an integrated circuit disposed on a semiconductor wafer. The board contains a plurality of substantially parallel signal layers (14) and power planes (16) that are...
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5582235 |
Temperature regulator for burn-in board components
The present invention is directed to an apparatus suitable for regulating, with an impinging flow of gas, the temperature of an electronic component under thermal stress testing at selected...
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5579826 |
Method for burn-in of high power semiconductor devices
A thermal control system for use with a burn-in system, the thermal control system capable of delivering a thermally preconditioned liquid to a plurality of semiconductor devices during burn-in....
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5576630 |
Probe structure for measuring electric characteristics of a semiconductor element
A probe structure for measuring electric characteristics of a semiconductor element containing a first electrically conductive circuit board having a structure wherein the contact portions, which...
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5574384 |
Combined board construction for burn-in and burn-in equipment for use with combined board
An apparatus for burn-in of semiconductor devices has board assemblies including a burn-in board and a driver board. The burn-in board has sockets on a first surface for accepting the semiconductor...
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5568054 |
Probe apparatus having burn-in test function
A probe apparatus having a burn-in test function includes an apparatus body, a probe card, having a plurality of probes, for causing the plurality of probes to electrically contact a semiconductor...
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5563520 |
Probe system
A probe system has a wafer storing section for storing a semiconductor wafer as an object to be measured, a plurality of probe units for electrically measuring the wafer, a marking unit for marking...
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5559446 |
Probing method and device
A probing device for inspecting semiconductor devices such as IC chips includes a mounting section for supporting a silicon substrate wafer (i.e., an object to be inspected), a moving section for...
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5543727 |
Run-in test system for PC circuit board
An automated functional test system for PC circuit boards. The test system includes a test chamber for removably receiving circuit boards to be tested, heating and cooling systems for controlling...
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5541524 |
Burn-in technologies for unpackaged integrated circuits
A device and method for burn-in of bare chips prior to assembly into a multichip module. Each die to be tested is positioned with its I/O pads positioned to face an interconnection burn-in test...
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5534786 |
Burn-in and test method of semiconductor wafers and burn-in boards for use in semiconductor wafer burn-in tests
Disclosed is an improved burn-in and test method of semiconductor wafers each having numerous integrated circuits formed therein. It includes the steps of dividing each semiconductor wafer into...
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5532612 |
Methods and apparatus for test and burn-in of integrated circuit devices
Methods and specially adapted reusable test carriers provide for burn-in test of semiconductor integrated circuit devices and economical production of known good dice (KGD). Methods for temporary...
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5532610 |
Apparatus for testing semicondctor wafer
The apparatus for collectively burning-in or testing a plurality of semiconductor chips disposed on a wafer without dicing the chips into individuals, the apparatus including a testing substrate,...
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5528161 |
Through-port load carrier and related test apparatus
Disclosed is a load carrier for use with a test chamber. Such carrier includes (a) an insertion portion having a length about equal to the thickness of a chamber wall, (b) a carrier portion...
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5528160 |
Spacing frame structure for IC handler
An improved structure for a spacing frame for interfacing a test head of an IC tester and an IC handler wherein the spacing frame can be changed in a short period of time without moving the test...
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5528157 |
Integrated circuit package for burn-in and testing of an integrated circuit die
A method for and a disassemblable prepackage arrangement for testing and burning-in an integrated circuit die which will be hermetically sealed within and form part of an overall integrated circuit...
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5521523 |
Probe card assembly and method of manufacturing probe card assembly
A probe card assembly thermal influenced from a wafer with which a probe makes contact during a probe test. The assembly includes a probe card unit having a great number of probes to be brought...
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5517126 |
Probe apparatus
A probe apparatus for measuring electrical characteristics of an object to be tested by putting a plurality of probes in electrical contact with the object comprises an apparatus body, a probe card...
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5517127 |
Additive structure and method for testing semiconductor wire bond dies
A structure and method for achieving burn-in and full functional testing of a semiconductor wire bond die are provided. The structure comprises an electrical conductor which connects a wire bond...
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5517125 |
Reusable die carrier for burn-in and burn-in process
A reusable carrier (10) for temporarily holding an integrated circuit (12) during burn-in and electrical test includes a base (14) and a lid (16) attached to the base (14) by hinges (18). A...
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5515910 |
Apparatus for burn-in of high power semiconductor devices
A thermal control system for use with a burn-in system, the thermal control system capable of delivering a thermally preconditioned liquid to a plurality of semiconductor devices during burn-in....
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5510705 |
Electrical test arrangement and apparatus
Apparatus is disclosed for use in the testing of the electromagnetic compatibility (EMC) and electrostatic discharge (ESD) performance of an electrical unit. The apparatus comprises a cable tray...
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5502398 |
Semiconductor device burn-in apparatus
In a semiconductor device burn-in apparatus, a film on which a plurality of TAB products, each having a semiconductor device thereon, are arranged in succession and a flexible tape-like wiring...
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5498971 |
Method and control circuit for measuring the temperature of an integrated circuit
A method and circuit for relatively accurately measuring the die temperature of an IC, such as a microprocessor, by sensing one or more internal circuit elements which have an electrical parameter...
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5496450 |
Multiple on-line sensor systems and methods
A control device and associated methodology select from at least two on-line sensors to assure an accurate and reliable feedback input to control the heat treating conditions within a furnace. The...
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5489851 |
Identification of pin-open faults by measuring current or voltage change resulting from temperature change
A method and apparatus for determining whether semiconductor components are electrically connected to a printed circuit board. A voltage (or current) is connected to two traces leading to...
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5475318 |
Microprobe
A microprobe comprises a base, a microcantilever extending in a plane from the base, and a probe tip projecting from the microcantilever out of the plane. The microcantilever is a bimorph structure...
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