|
Match
|
Document |
Document Title |
|
|
7626406 |
Probing method, probe apparatus and storage medium
A probing method measures electrical characteristics of an object to be inspected by bringing a probe needle to make a contact with an electrode pad of the object, the probe needle formed to be...
|
|
|
7626405 |
Suspension system and adjustment mechanism for an integrated chip and method
Disclosed herein is a suspension system and adjustment mechanism for an integrated chip held in a clamping or similar assembly and a related method for same. The suspension system Includes a...
|
|
|
7626404 |
Replaceable probe apparatus for probing semiconductor wafer
A probe apparatus for probing a device on a semiconductor wafer to be tested by a testing equipment is provided. The probe apparatus includes a replaceable probe tile removably mounted in a probing...
|
|
|
7622939 |
Methods and apparatuses for improved stabilization in a probing system
Improved methods and apparatuses for automatically and accurately maintaining the alignment of a wafer prober to the bonding pads of a semiconductor device in the presence of motion disturbances...
|
|
|
7622938 |
Contact unit for a device to place a part into operation, testing device, and method for placing into operation of and testing a part
A contact unit is provided. The contact unit is adjusted in order to create an electric contact in a test device and comprises an arrangement for contact guides ( 140; 340′; 440 ′), and a...
|
|
|
7609078 |
Contact alignment verification/adjustment fixture
In an electronic testing machine including at least one test module having a plurality of contacts for testing electronic components, the improvement of a contact alignment tool for aligning the...
|
|
|
7602203 |
Probe and probe card
An object of the present invention is to make it possible that a probe for testing electrical characteristics of an object to be tested is easily attached to a support member such as a contactor. A...
|
|
|
7602200 |
Probe for electrical test comprising a positioning mark and probe assembly
A probe for electrical test provided with positioning marks parallel to a plane where tips are provided and at a height position lower than the plane on a plane directed in the same direction as...
|
|
|
7598725 |
Alignment receptacle of a sensor adapted to interact with a pin to generate position data along at least two transverse axes for docking a test head
An apparatus and method are provided for the automatic operation of a manipulator to move a test head or peripheral into position for proper alignment and docking of the test head with the...
|
|
|
7592817 |
Alignment correction system and method of use
A system and method for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool...
|
|
|
7592796 |
Plate with an indicator for discerning among pre-identified probe holes in the plate
Disclosed is a system and method for providing an effective means for making it easy to identify which holes in an interface plate are to be populated with probes and which are to be left empty....
|
|
|
7589544 |
Probe test apparatus
The present invention provides a probe test apparatus capable of easily correcting a probe needle of a probe card. A pad image by which the position of an electrode pad P can be specified is...
|
|
|
7589543 |
Probe card having a conductive thin film on the surface of an insulating film behind each of the alignment marks each marks comprises a plurality of second bumps
A probe card for a wafer level test of electrical characteristics of a plurality of semiconductor integrated circuit devices formed on a semiconductor wafer. The card has a thin film with bumps on...
|
|
|
7586319 |
Methods of retaining semiconductor component configurations within sockets
The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that...
|
|
|
7583101 |
Probing structure with fine pitch probes
A microelectronic resilient structure can comprise a support member and a platform attached to the support member. The platform can comprise a non-conductive, resilient beam that extends away from...
|
|
|
7583099 |
Method for re-registering an object to be aligned by re-capturing images using previously registered conditions and storage medium storing a program for executing the method
A method for re-registering at least one set of image information of an object to be aligned to align the object by an imaging unit, the image information including photographing conditions and...
|
|
|
7583098 |
Automated probe card planarization and alignment methods and tools
A method and apparatus for performing automated alignment of probes of a probe card is provided. The desired horizontal location for a probe is compared with the actual horizontal position for the...
|
|
|
7583097 |
Contactor nest for an IC device and method
An improved contactor nest for receiving and holding IC devices against a pin board interposer during the test or burn-in of the devices includes a frame having an IC pocket with a top opening,...
|
|
|
7579853 |
Apparatus for obtaining planarity measurements with respect to a probe card analysis system
A system and method of mitigating the effects of component deflections in a probe card analyzer system may implement three-dimensional comparative optical metrology techniques to model deflection...
|
|
|
7577517 |
Guided vehicle system and teaching method in the guided vehicle system
Each of guided vehicles has an operating condition memory unit for storing the total travel distance, the travel time, the number of travels, the number of errors at a stop position, and the number...
|
|
|
7573283 |
Method for measurement of a device under test
A method is disclosed for measurement of wafers and other semiconductor components in a probe station, which serves for examination and testing of electronic components. The device under test is...
|
|
|
7573280 |
Semiconductor device, method and apparatus for testing same, and method for manufacturing semiconductor device
A semiconductor device wherein an electrode pad to be contacted a test probe for performing probe testing, a bonding area mark for defining a bonding area which performs wire boding on the...
|
|
|
7573276 |
Probe card layout
Multi-touchdown, parallel test probe cards having probe elements arranged to provide greater than 99% efficiency during testing of a substrate having a plurality of die thereon, and methods of use.
|
|
|
7557594 |
Automated contact alignment tool
A method for determining the alignment of a plurality of contacts in an electronic testing machine is disclosed. The contacts are swept over an electronic component taking a plurality of electrical...
|
|
|
7554348 |
Multi-offset die head
An upper die portion of a die head for aligning probes having different offsets in a first array of first micro-holes formed in a lower die portion of the die head. The upper die portion includes a...
|
|
|
7538567 |
Probe card with balanced lateral force
A novel method and structure for counter-balancing a lateral force exerted by a probe card onto a device under test (“DUT”) is disclosed. Many DUTs (particularly memory devices) are tested in...
|
|
|
7521915 |
Wafer bevel particle detection
An apparatus adapted to detect a particle present on a bevel of a wafer. The apparatus includes a substrate support and a sensor housing adapted to receive an edge of the wafer. The sensor housing...
|
|
|
7514945 |
Systems configured for utilizing semiconductor components
The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that...
|
|
|
7514943 |
Coordinate transforming apparatus for electrical signal connection
Vertical contactors regularly arrayed over a film is brought into vertical contact with the end faces of wiring terminals formed at one end of a flexible flat cable, and signal lines from a...
|
|
|
7514915 |
Chuck for holding a device under test
A chuck for a probe station.
|
|
|
7513036 |
Method of controlling contact load in electronic component mounting apparatus
A method of controlling contact load in an apparatus for mounting electronic components on a substrate, in which a head is lowered at high speed to slow down starting position where there is no...
|
|
|
7511522 |
Electronic device test apparatus
An electronic device test apparatus for testing IC chips (IC) by pushing their input/output terminals (HB) against contact units of a test head, provided with an IC moving system ( 410 ) for...
|
|
|
7511269 |
Method of approaching probe and apparatus for realizing the same
A method of approaching a probe to a target position on a sample mounted on a sample stage tilted at a preselected tilt angle about a tilt axis of the sample stage. A distance between the tip of...
|
|
|
7504844 |
Inspection apparatus and method
An inspection apparatus for inspecting electrical characteristics of an inspection target object includes a movable mounting table for mounting the inspection target object thereon, a probe card...
|
|
|
7501843 |
Movement amount operation correction method for prober, movement amount operation correction processing program, and prober
A movement amount operation correction method of a prober capable of easily performing an error measurement for the movement distance. In the method, the position of a probe of a probe card is...
|
|
|
7498800 |
Methods and apparatus for rotationally accessed tester interface
A wafer/wafer translator pair in the attached state, with the wafer translator extending beyond the outer circumference of the wafer, is disposed on a rotation stage. At least one surface of the...
|
|
|
7492176 |
Prober and probe contact method
A prober and a method for reducing errors in the contact position between a probe and an electrode without lowering throughput when conducting a test of a wafer at a high or low temperature. The...
|
|
|
7492174 |
Testing apparatus for surface mounted connectors
This invention describes a device for testing a surface mounted connector using a test probe assembly that utilizes a vacuum to force the test wires and the test probe's wire array into intimate...
|
|
|
7492172 |
Chuck for holding a device under test
A chuck that includes an upper surface for supporting a device under test and a conductive element that extends through the chuck to the upper surface of the chuck. The conductive element is...
|
|
|
7489148 |
Methods for access to a plurality of unsingulated integrated circuits of a wafer using single-sided edge-extended wafer translator
An apparatus for providing electrical pathways between one or more unsingulated integrated circuits and one or more test circuits external to the integrated circuits, includes a flexible substrate...
|
|
|
7486094 |
Apparatus for testing un-moulded IC devices using air flow system and the method of using the same
An apparatus minimizes stress on un-moulded IC devices by use of an airflow system. A vacuum urges the DUT's into contact with the pivoted test fingers, thereby reducing damage to the IC. A fitting...
|
|
|
7486090 |
Testing device
A printed-circuit-board testing device that tests an electronic component disposed on a printed circuit board includes printed-circuit-board-tilt measuring means for measuring tilting of the...
|
|
|
7477064 |
Probing apparatus and positional deviation acquiring method
In a prober, a post-contact image representing a region including a pad is acquired by capturing an image of a substrate after a probe has been brought into contact with the pad having an existing...
|
|
|
7474104 |
Wafer-to-wafer alignments
Structures for aligning wafers and methods for operating the same. The structure includes (a) a first semiconductor wafer including a first capacitive coupling structure, and (b) a second...
|
|
|
7471095 |
Electrical connecting apparatus and method for use thereof
An electrical connecting apparatus is used for electrical inspection of a device under test having electrodes each of which a recess is formed on a flat upside. The electrical connecting apparatus...
|
|
|
7471078 |
Stiffener assembly for use with testing devices
A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener for use with testing devices includes an inner member; an outer member disposed in a...
|
|
|
7466122 |
Test head docking system and method
A system for docking an electronic test head with a handling apparatus is provided. The system includes an assembly for at least partially aligning and subsequently bringing together the electronic...
|
|
|
7463764 |
Probe area setting method and probe device
With a wafer having an indefinite shape or a broken wafer, it is hard for an operator to assign the design address of an edge chip and set a probe area. In a probe-area setting method of this...
|
|
|
7463044 |
Adapter for positioning of contact tips
An adapter for positioning of contact tips has a location surface for locating a contact tip and a base element with a base for setting the adapter on a mounting surface. A positioning element is...
|
|
|
7463043 |
Methods of probing an electronic device
An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then...
|