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7605583 |
Modular interface
An apparatus for interfacing a test head to a peripheral system is provided. The apparatus includes a first unit having a first connection member for providing electrical communication with the...
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7602203 |
Probe and probe card
An object of the present invention is to make it possible that a probe for testing electrical characteristics of an object to be tested is easily attached to a support member such as a contactor. A...
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7602202 |
Semiconductor probe with high resolution resistive tip having doping control layer and method of fabricating the same
A semiconductor probe and a method of fabricating the same are provided. The semiconductor probe includes a cantilever doped with first impurities, a resistive tip which protrudes from an end of...
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7595651 |
Cantilever-type probe card for high frequency application
A cantilever-type probe card includes a circuit board, a grounding block electrically connected to a zero potential, signal probes, and at least one grounding probe connected to the grounding...
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7586317 |
Inspection apparatus, probe card and inspection method
By allowing an electrical conduction between a probe and an electrode by a fritting phenomenon before inspection, simplification of circuit configuration and shortening of inspection time is...
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7583101 |
Probing structure with fine pitch probes
A microelectronic resilient structure can comprise a support member and a platform attached to the support member. The platform can comprise a non-conductive, resilient beam that extends away from...
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7541823 |
Circuit board checker and circuit board checking method
The present invention provides an inspection apparatus for circuit board for conducting electrical inspection by electrically connecting inspection object electrodes of the circuit board to a...
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7537943 |
Method of manufacturing a semiconductor integrated circuit device
A technique of manufacturing a semiconductor integrated circuit device is provided for reducing the possibility of attachment of foreign matter to a membrane probe when performing probe inspection...
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7532020 |
Probe assembly
A probe assembly having a plurality of probes, each of which is secured to an anchor portion on a probe base plate, extends in a direction apart from the anchor portion through a fulcrum, has a tip...
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7521947 |
Probe needle protection method for high current probe testing of power devices
A test system, apparatus and method for applying high current test stimuli to a semiconductor device in wafer or chip form includes a plurality of probes for electrically coupling to respective...
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7518388 |
Contactor for electronic components and test method using the same
A contactor configured to be electrically connected to the terminals of an electronic component is disclosed. The connector includes multiple contact electrodes contacting the terminals of the...
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7511521 |
Assembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component
In one embodiment, the invention provides a test assembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component. The assembly...
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7511518 |
Method of making an interposer
A method of making an interposer in which at least two dielectric layers are bonded to each other to sandwich a plurality of conductors there-between. The conductors each electrically couple a...
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7501839 |
Interposer and test assembly for testing electronic devices
A test apparatus which uses a pair of substrates and housing to interconnect a host substrate (e.g., PCB) to an electronic device (e.g., semiconductor chip) to accomplish testing of the device. The...
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7482824 |
Polycrystalline contacting component and test tool having the contacting component
A contacting component has a probe contact formed by plating and adapted to be contacted with a target portion. The contacting component includes an insulating substrate, a conductive circuit...
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7482822 |
Apparatus and method for limiting over travel in a probe card assembly
Methods and apparatuses for testing semiconductor devices are disclosed. Over travel stops limit over travel of a device to be tested with respect to probes of a probe card assembly. Feedback...
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7474089 |
Contact mechanism cleaning
One embodiment of the present invention includes a method for reactively cleaning a contact mechanism. The method includes measuring contact resistance (CRES) associated with a plurality of...
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7463043 |
Methods of probing an electronic device
An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then...
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7453275 |
Probe card
The board of a probe card of the present invention comprises a first substrate having a first inclined surface at the side surfaces and a second substrate having a second inclined surface. The...
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7449903 |
Method and system for the optical inspection of contact faces at semiconductor devices with different appearances
A system and method is provided that reliably determines the position of contact needle tips on a contact pad irrespective of the contact pad geometry and the character of the contact pad surface....
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7446544 |
Probe apparatus, wafer inspecting apparatus provided with the probe apparatus and wafer inspecting method
A probe device including a circuit board for inspection having a great number of inspection electrodes, a probe card having a circuit board for connection having a great number of terminal...
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7443179 |
Zero motion contact actuation
A device for testing small electronic components includes a test plate for moving a plurality of spaced electronic components to a test station. A roller is designed to press on the test plate and...
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7436193 |
Thin film probe card contact drive system
A probe card includes a flexible membrane, a plurality of probes attached to the flexible membrane, and a layer of foam connected to the flexible membrane so that when the probes are moved into the...
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7405578 |
Device for monitoring the contact integrity of a joint
The invention relates to a device that can be used to monitor the contact integrity of a joint that is of an impervious contact surface between two parts ( 4 and 5 ) including a set of conductive...
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7398181 |
Method for retrieving reliability data in a system
An aspect of the present invention is a method for retrieving reliability data in a system. The method includes coupling a device to the system, collecting the reliability data with the device and...
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7394265 |
Flat portions of a probe card flattened to have same vertical level with one another by compensating the unevenness of a substrate and each identical height needle being mounted on the corresponding flat portion through an adhesive
A probe card on which micro probe needles are arranged at high density and with high precision without need of a complicated structure or variation in needle height. A probe card 1 installed in a...
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7385412 |
Systems and methods for testing microfeature devices
Systems and methods for testing microelectronic imagers and microfeature devices are disclosed herein. In one embodiment, a method includes providing a microfeature workpiece including a substrate...
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7372286 |
Modular probe card
A modular probe card comprises a printed circuit board, an interposer, and a probe head where the printed circuit board has a plurality of first contact pads, the probe head has a plurality of...
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7319339 |
Inspection apparatus to break the oxide of an electrode by fritting phenomenon
Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film...
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7319337 |
Method and apparatus for pad aligned multiprobe wafer testing
A control unit of a wafer prober for implementing wafer examination, using a probe card including a multiple number of probes, executes a multiple number of measuring operations by bringing the...
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7304489 |
Inspection method and inspection apparatus
Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film...
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7301357 |
Inspection method and inspection equipment
In an inspection method according to the invention, a plurality of drivers 21 incorporated in a tester 20 apply a fritting voltage to respective electrodes P via first probe pins 11 A included...
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7292055 |
Interposer for use with test apparatus
An interposer including at least two dielectric layers bonded to each other, sandwiching a plurality of conductors there-between. The conductors each electrically couple a respective pair of...
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7288950 |
Contacting component, method of producing the same, and test tool having the contacting component
A contacting component has a probe contact formed by plating and adapted to be contacted with a target portion. The contacting component includes an insulating substrate, a conductive circuit...
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7282933 |
Probe head arrays
A probe head for testing devices formed on a semiconductor wafer includes a plurality of probe DUT (device under test) arrays. Each device under test includes pads that are urged into pressure...
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7279915 |
Test method for electronic modules using movable test contactors
A pass through test system for testing an electronic module includes an interface board, and test contactors movably mounted to the interface board for electrically engaging terminal contacts on...
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7276924 |
Electrical connecting method
An electrical connecting method has the step of bringing a contact member connected to an electric circuit into contact with a terminal of an electronic part. A desired processing is performed by...
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7268574 |
Systems and methods for sensing obstructions associated with electrical testing of microfeature workpieces
Systems and methods for sensing obstructions associated with electrical testing of microfeature workpieces are disclosed. An apparatus in accordance with one embodiment includes a first support...
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7268568 |
Probe card
The invention aims to provide a vertical type probe card in which a probe can scrape an oxide film on a surface of an electrode of the measurement object, thereby ensuring stable contact with the...
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7265563 |
Test method for semiconductor components using anisotropic conductive polymer contact system
A contact system for electrically engaging semiconductor components includes an interface board mountable to an automated test handler, and a floating substrate on the interface board. The...
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7259581 |
Method for testing semiconductor components
A method for testing a semiconductor component includes the steps of bonding an interconnect to the component to form bonded electrical connections, applying test signals through the bonded...
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7256595 |
Test sockets, test systems, and methods for testing microfeature devices
Test sockets, test systems, and methods for testing microfeature devices with a substrate and a plurality of conductive interconnect elements projecting from the substrate. In one embodiment, a...
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7250780 |
Probe card for semiconductor wafers having mounting plate and socket
A probe card for testing semiconductor wafers, and a method and system for testing wafers using the probe card are provided. The probe card is configured for use with a conventional testing...
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7245137 |
Test head assembly having paired contact structures
A test head assembly can include a probe card, which can include first contact areas. The test head assembly can also include a contactor, which can include second contact areas. An interposer can...
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7243410 |
Method for manufacturing a probe card
A method for manufacturing a probe card includes a first contact formation step of forming a first contact on a first surface of a first sacrificial substrate, a second contact formation step of...
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7239161 |
Gantry-type XY stage
Nine vibration isolating mounts are disposed on a pedestal, and a granite plate is placed thereon. A pair of guide bases are disposed on the granite plate, and disposed thereon are a pair of posts...
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7230439 |
Method for detecting and monitoring wafer probing process instability
A system and method for detecting and monitoring wafer probe stability including the steps of, probing each die on a wafer, and for each die determining whether the result of the probe is a pass or...
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7227370 |
Semiconductor inspection apparatus and manufacturing method of semiconductor device
When electrical properties of semiconductor chips of a semiconductor wafer are inspected by bringing plural contact terminals disposed on the principal surface of a probe sheet of a probe cassette...
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7218127 |
Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component
An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then...
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7209849 |
Test system, added apparatus, and test method
There is provided a test system that tests a device under test. The test system includes a test apparatus that tests the device under test on the basis of an event, and an added apparatus that is...
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