Matches 151 - 200 out of 356 < 1 2 3 4 5 6 7 8 >
Match Document Document Title
6366112 Probe card having on-board multiplex circuitry for expanding tester resources  
A probe card for testing semiconductor wafers includes probe card contacts for electrically engaging die contacts on the wafer. The probe card also includes an on board multiplex circuit adapted to...
6366106 Probe needle for probe card  
A probe needle for a probe card which is characterized by applying a Ni plating containing PTFE to at least an end face of a tip portion thereof is disclosed. A Ni plating containing PTFE layer may...
6366105 Electrical test apparatus with gas purge  
A method for electrically testing an electrical circuit formed upon a substrate, and an apparatus employed within the method for electrically testing the electrical circuit formed upon the...
6359456 Probe card and test system for semiconductor wafers  
A probe card for testing semiconductor wafers, and a method and system for testing wafers using the probe card are provided. The probe card is configured for use with a conventional testing...
6350957 Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board  
A circuit board which is formed with bump patterns subject to a narrow variation in height on the surface of the circuit board, and which permits high-density packaging of a semiconductor component...
6342788 Probing systems for chilled environment  
A probe test assembly for testing electronic devices maintained at lowered temperatures includes heaters and flows of dried air to prevent condensation from forming on the devices. The devices have...
6340894 Semiconductor testing apparatus including substrate with contact members and conductive polymer interconnect  
A die contacting substrate establishes ohmic contact with the die by means of raised portions on contact members. The raised portions are dimensioned so that a compression force applied to the die...
6337575 Methods of testing integrated circuitry, methods of forming tester substrates, and circuitry testing substrates  
A method of testing integrated circuitry includes providing a substrate comprising integrated circuitry to be tested. The circuitry substrate to be tested has a plurality of exposed conductors in...
6337573 Contact test circuit  
A method and apparatus for contact testing a plurality of devices under test, either sequentially or simultaneously. In a first test phase it is determined whether the test probe to each contact is...
6333638 Semiconductor test apparatus and test method using the same  
A semiconductor test apparatus tests a semiconductor device having plate connection terminals. The apparatus includes a test substrate having deformable connection parts connected with the plate...
6331781 Spaced adaptor plate for semiconductor tester  
A load board is attached to the test head of a semiconductor tester and has a receptacle surface oriented substantially perpendicular to a Z-axis and presented toward a handler location. An adaptor...
6330744 Customized electrical test probe head using uniform probe assemblies  
An improved method of manufacturing an electrical probe test head is provided for testing electrical circuits, such as, e.g., IC-chips and circuit boards. The test head can be employed in circuit...
6329829 Interconnect and system for making temporary electrical connections to semiconductor components  
An interconnect and system for making temporary electrical connections with semiconductor components are provided. The interconnect can be included in a wafer level test system for testing...
6323667 Contact probe unit  
In an electroconductive contact probe unit, the electroconductive needle member is axially slidably received in a support hole formed in an insulating support plate, and is urged by the compression...
6323670 PCB adapter for IC chip failure analysis  
An arrangement that allows convenient and cost effective mounting of semiconductor die during the process of semiconductor failure analysis. The die that is analyzed can be biased and electrical...
6300782 System for testing semiconductor components having flexible interconnect  
A system for testing semiconductor components includes a testing apparatus, such as a test carrier for discrete components, or a wafer prober for wafer sized components The system also includes an...
6297655 Integrated circuit probing method  
A circuit probing method includes contacting a conductive probe with a contact pad of an electronic circuit. An electric signal is sent between the contacted probe and the contact pad. After...
6294921 Apparatus for testing an integrated circuit device  
A method and apparatus for contact testing a plurality of devices under test, either sequentially or simultaneously. In a first test phase it is determined whether the test probe to each contact is...
6294920 Test mounting for surface mount device packages  
A test mounting for LGA packages uses curved contact fingers to make electrical contact between lands on the LGA package and surface mount circuitry on a circuit board or the like. The mounting...
6292007 Probe head assembly  
An apparatus for testing semiconductor devices including probe tips for contacting input/output pads on the device attached to a probe membrane fixed to a package using a layer of elastomeric...
6292005 Probe card for IC testing apparatus  
A probe card 2 for an IC testing apparatus electrically connected to a test head board 11 of the IC testing apparatus and having a plurality of needle contacts 211 provided on a main surface for...
6287878 Method of fabricating chip scale package  
A chip scale package (CSP) fabricating method is provided. In this method, CSP chips are fabricated on a wafer and subjected to an electric die sorting (EDS) process. Then, CSP chips determined to...
6285204 Method for testing semiconductor packages using oxide penetrating test contacts  
A method for testing semiconductor packages using oxide penetrating test contacts is provided. The test contacts are attached to a burn-in board and include a base metal formed in compliant shape....
6281693 Semiconductor device test board and a method of testing a semiconductor device  
A semiconductor device test board for performing a test on a semiconductor device includes a supporting board formed of an insulating material and contact parts which are formed on the supporting...
6281695 Integrated circuit package pin indicator  
An integrated circuit package pin indicator that may include probe guides. The indicator includes a top marking plate with indicia for the multiple pins of the IC package. The top plate has...
6275052 Probe card and testing method for semiconductor wafers  
A probe card for testing semiconductor wafers, and a method and system for testing wafers using the probe card are provided. The probe card is configured for use with a conventional testing...
6263566 Flexible semiconductor interconnect fabricated by backslide thinning  
An interconnect for testing semiconductor components includes a thinned substrate, and first contacts on the substrate for electrically engaging second contacts on the components. The interconnect...
6252289 Electrical contact and housing for use as an interface between a testing fixture and a device under test  
An electrical contact, preferably made from a gold-plated, beryllium-copper flat stock which allows radio-frequency signal to pass with low noise, is provided within a housing. The electrical...
6249135 Method and apparatus for passive optical characterization of semiconductor substrates subjected to high energy (MEV) ion implantation using high-injection surface photovoltage  
A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening...
6245445 Rough electrical contact surface  
A method for rendering a surface of a contact rough includes submerging the surface of the contact in an electroplating bath having a dissolved metal salt, and pulsing an electric current through...
6204678 Direct connect interconnect for testing semiconductor dice and wafers  
An interconnect and system for testing semiconductor dice, and a test method using the interconnect are provided. The interconnect includes a substrate having patterns of contact members for...
6204464 Electronic component handler  
A high-speed handler for receiving a heap of randomly oriented parallel piped-shaped ceramic components, each component of the type having at least one set of metal terminations located on opposite...
6204677 Contact pressure jig for signal analysis  
A testing apparatus has a load board and a device under test electrically interconnected with the load board. A pressure jig, which has a forcing unit and a structural member for fixing a fixed...
6194905 Method for testing integrated circuit components of a multi-component card  
An apparatus/method is provided for temporarily electrically contacting leads of an integrated circuit component on a multi-component board under test. A flexible circuit member having a plurality...
6191594 Adapter for a measurement test probe  
A probe adapter for coupling probe tip contacts of a electrical measurement probe to leads of a surface mounted integrated circuit IC device has an insulating housing from which extend first and...
6169411 Integrated circuit testing assembly and method  
An assembly and method for testing leads of an integrated circuit package. The assembly includes a testing substrate with a plurality of conductive portions for use in connection with a test probe....
6160410 Apparatus, method and kit for adjusting integrated circuit lead deflection upon a test socket conductor  
An apparatus, method and kit is provided for aligning small, closely spaced leads of an integrated circuit to small, closely spaced test conductors within a test apparatus. The leads can be...
6158119 Circuit board panel test strip and associated method of assembly  
A test strip (209-211) is associated with a circuit board (201-203) to facilitate inspection of the circuit board (201-203) during an assembly process (100). The board (201-203) has a plurality of...
6147505 Adapter arrangement for electrically testing printed circuit boards  
An adapter arrangement for electrically testing printed circuit boards consists of two probe adapters with a uniform grid separation of the probes and two translator foils on whose sides facing the...
6137299 Method and apparatus for testing integrated circuit chips  
Formation of a contact probe having a pattern of dendritic textured contacts complementary to that of a contact pad array on a bare chip allows formation of simultaneous temporary connections to...
6137297 Electronic test probe interface assembly and method of manufacture  
An interface module for testing integrated circuits and a method of manufacture are disclosed wherein a planar self supporting diaphragm supports signal paths connected to a pattern of probe...
6130546 Area array (flip chip) probe card  
A method and apparatus for testing an integrated circuit die including a probe card (10) having a plurality of surface mount pads (45) arranged in a pattern (50) substantially corresponding to an...
6130545 Method and apparatus for scrubbing the bond pads of an integrated circuit during wafer sort  
An improved method and apparatus for electrically coupling the bond pads of an integrated circuit to a tester. One embodiment the invention includes a probe card having a plurality of test probes...
6127837 Method of testing semiconductor devices  
A semiconductor device testing method using a semiconductor device testing apparatus that can improve the contact characteristic between probe needles and power-supply terminals and signal...
6124721 Method of engaging electrically conductive test pads on a semiconductor substrate  
A method of engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof includes: a) providing an engagement probe having an...
6121783 Method and apparatus for establishing electrical contact between a wafer and a chuck  
A needle is pressed into the backside oxide of a semiconductor wafer and a voltage applied to the wafer greater than the breakdown voltage of the oxide in order to make an electrical contact with...
6107812 Apparatus and method for testing integrated circuit components of a multi-component card  
An apparatus/method is provided for temporarily electrically contacting leads of an integrated circuit component on a multi-component board under test. A flexible circuit member having a plurality...
6097198 Inspection jig  
While a depression body supporting portion having a depression body depressing an upper surface of a semiconductor element is guided and supported by a support shaft, after a slide member arranged...
6094059 Apparatus and method for burn-in/testing of integrated circuit devices  
A technique for testing/stressing integrated circuit devices, especially wafers, having a plurality of contacts on one face thereof arranged in a predetermined pattern is provided. An interposer...
6094060 Test head for applying signals in a burn-in test of an integrated circuit  
A technique for testing/stressing integrated circuit devices, especially wafers, having a plurality of contacts on one face thereof arranged in a predetermined pattern is provided. An interposer...
Matches 151 - 200 out of 356 < 1 2 3 4 5 6 7 8 >