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7619426 |
Performance board and cover member
A performance board which is attached to a semiconductor test apparatus and on which devices under test are mounted is provided. The performance board includes: a substrate; sockets which are...
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7615992 |
Apparatus and method for detecting electronic device testing socket
An apparatus for detecting an electronic device testing socket including a testing base, a detecting circuit board, a depth gauge, and a conductive pressing block is provided. The detecting circuit...
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7610538 |
Test apparatus and performance board for diagnosis
A test apparatus being capable of replacing a test module with the other kind of test module that tests device under tests by using the test module is provided. The test apparatus includes a...
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7602201 |
High temperature ceramic socket configured to test packaged semiconductor devices
A test socket assembly is for use in testing integrated circuits. A single piece socket is formed substantially of an insulating material and having a plurality of holes formed therein configured...
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7598760 |
High temperature ceramic die package and DUT board socket
A strip-shaped package is provided that can accept a single die up to many dice. Conduction paths are printed (or otherwise integrally formed) thereon to the edge of the package, and a...
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7589521 |
Universal cover for a burn-in socket
In one embodiment, the present invention includes a universal cover to be adapted to burn-in sockets, where at least some of the burn-in sockets have different dimensions. In this way, the...
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7583097 |
Contactor nest for an IC device and method
An improved contactor nest for receiving and holding IC devices against a pin board interposer during the test or burn-in of the devices includes a frame having an IC pocket with a top opening,...
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7576552 |
Surface mount package fault detection apparatus
A fault detection apparatus for surface mount packages is provided. The apparatus can include a retainer for releasably securing a circuit board such as a printed circuit board having an electrical...
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7576551 |
Test socket and test board for wafer level semiconductor testing
A test board for wafer level semiconductor testing is disclosed. The test board comprises a plurality of wires and microelectronic devices; and a plurality of test sockets on an upper surface of...
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7575460 |
IC socket
An IC socket for receiving an IC package includes a socket body with a plurality of contacts disposed therein, a lid mounted on the socket body and movable relative to the socket body in an up-down...
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7573279 |
Jig for Kelvin test
A jig for Kelvin Test includes a first probe and a second probe which are arranged in parallel in a socket comprised of insulating material. Probes include a conductive tube and a conductive...
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7567075 |
Single latch manual actuator for testing microcircuits, and having a mechanical interlock for controlling opening and closing
An actuator device applies force to an integrated circuit package to enable temporary contact between a plurality of contacts on the integrated circuit package and to a set of test contacts carried...
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7550985 |
Methods of testing memory devices
A testing apparatus, system and method for testing computer memory modules are disclosed. The apparatus includes a motherboard having a processor and at least one resident memory socket fixed to...
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7548079 |
Semiconductor device including analog voltage output driver LSI chip having test circuit
An LSI chip includes a plurality of output terminals and a test circuit. The test circuit includes a single test signal input terminal, a single test signal output terminal, a shift register, and a...
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7548078 |
Performance board for electronically connecting a device under test with a test apparatus for testing a device under test
There is provided a test apparatus having a test head containing test modules for sending/receiving signals to/from a device-under-test, a device mounting section having a socket for mounting the...
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7541827 |
BGA package holder device and method for testing of BGA packages
An apparatus for supporting BGA packages for one or more testing processes is disclosed. The apparatus includes a substrate member. The substrate member has a plurality of contact pads, with each...
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7541822 |
Wafer burn-in and text employing detachable cartridge
A cartridge ( 10 ) includes a chuck plate ( 12 ) for receiving a wafer ( 74 ) and a probe plate ( 14 ) for establishing electrical contact with the wafer. In use, a mechanical connecting device (...
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7535713 |
IC socket
An IC socket includes a socket body with a plurality of contacts disposed therein, a lid pivotably coupled to the socket body, a pushing member connected to the lid, and a heat sink fixed to said...
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7535214 |
Apparatus for testing system-in-package devices
Apparatus for testing System-In-Package (SIP) devices each having a plurality of electrical leads is described. The apparatus utilizes industry standard JEDEC trays and tests at least a...
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7534654 |
Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component
Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor...
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7528616 |
Zero ATE insertion force interposer daughter card
A zero automated electrical testing (ATE) interposer daughter card (IDC) is provided for use in a test apparatus for ATE. Embodiments of the IDC include a first side having a first set of pads for...
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7523010 |
Automated circuit board test actuator system
A method for automatically inserting connectors and coupling test probes to circuit boards, such as computer system boards and the like. The method is implemented via an apparatus that enables...
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7518357 |
Test circuits of an apparatus for testing micro SD devices
Apparatus for testing micro SD devices each having a plurality of electrical leads is described. The apparatus utilizes industry standard JEDEC trays and tests all devices in such trays at the same...
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7514950 |
Semiconductor device testing apparatus and device interface board
A interface board is provided with a first and second contact instruments each comprising a first and second contact terminal groups to which a first to third type semiconductor devices having...
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7514914 |
Test circuits of an apparatus for testing system-in-package devices
Apparatus for testing System-In-Package (SIP) devices each having a plurality of electrical leads is described. The apparatus utilizes industry standard JEDEC trays and tests all devices in such...
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7511520 |
Universal wafer carrier for wafer level die burn-in
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer,...
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7492175 |
Membrane probing system
A membrane probing assembly includes a probe card with conductors supported thereon, wherein the conductors include at least a signal conductor located between a pair of spaced apart guard...
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7492174 |
Testing apparatus for surface mounted connectors
This invention describes a device for testing a surface mounted connector using a test probe assembly that utilizes a vacuum to force the test wires and the test probe's wire array into intimate...
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7486094 |
Apparatus for testing un-moulded IC devices using air flow system and the method of using the same
An apparatus minimizes stress on un-moulded IC devices by use of an airflow system. A vacuum urges the DUT's into contact with the pivoted test fingers, thereby reducing damage to the IC. A fitting...
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7486092 |
Apparatus for supporting semiconductor devices during testing
An apparatus supports, during a testing operation, a leadframe formed with at least one row of non-singulated semiconductor devices. The apparatus includes a main body and a leadframe support...
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7486091 |
Test unit usable with a board having an electronic component
A test unit usable with a board having, an electronic component includes at least one testing point provided in each electronic component to test electric properties and a connection state of the...
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7477063 |
Universal insert tool for fixing a BGA package under test
A universal insert for carrying a BGA package under test primarily comprises a meshed base, at least a latch, and a plurality of lift pins. The meshed base has a component cavity, a mounting...
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7477062 |
LSI test socket for BGA
There is provided an LSI socket containing a pogo-pin type decoupling capacitor for reducing the potential fluctuation of power supplies and GNDs at the time of testing LSI incorporated in a BGA...
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7474531 |
Circuit board testing jig
A circuit board testing jig for testing a circuit board and dissipating heats generated by a heat-generating electronic element of the circuit board is provided. The circuit board testing jig...
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7471096 |
Contactor for electronic parts and a contact method
A contactor for electronic parts can provide an appropriate and uniform contact with respect to a plurality of electrode terminals in an electronic part such as an IC. Each of a plurality of...
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7468609 |
Switched suspended conductor and connection
A probe assembly having a switch that selectively electrically connects, for example, either a Kelvin connection or a suspended guard element with the probe assembly.
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7456639 |
Compliant contact structure
A compliant contact structure and contactor card for operably coupling with a semiconductor device to be tested includes a substantially planar substrate with a compliant contact formed therein....
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7453932 |
Test device and setting method
A testing apparatus for testing a device under test is provided, wherein the testing apparatus includes: a comparator for receiving a signal output from the device under test and converting the...
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7453259 |
Loading a socket and/or adapter device with a semiconductor component
A process, device and apparatus for loading a socket and/or adapter device with a semi-conductor component, where the mechanism has a device, in particular a mechanical device, for instance and...
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7449907 |
Test unit to test a board having an area array package mounted thereon
A test unit to test a board having an area array package mounted therein includes the board, the area array package having an electronic component, a plurality of package pins including a plurality...
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7446398 |
Bump pattern design for flip chip semiconductor package
A bump pattern design for flip chip semiconductor packages includes a pattern of contact pads formed on a package substrate. Each contact pad is adapted to receive a corresponding solder bump from...
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7443183 |
Motherboard test machine
A test machine for testing a printed circuit board (PCB) ( 50 ) includes a base box ( 10 ), a top test device ( 70 ), a raising board ( 41 ), and a control system. The top test device is pivotably...
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7430123 |
Rack for computer system modules
A rack for mounting modules of a computer system to be tested includes a chassis including a bracing frame for mounting test components of the computer system, and a top panel attached to the...
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7429497 |
Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication therefor
A hybrid electronic circuit package ( 102, FIG. 1 ) includes non-insertable conductive features ( 110 ) and insertable conductive features ( 112 ) at a surface of the package. A hybrid receptacle...
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7427768 |
Apparatus, unit and method for testing image sensor packages
The present invention relates to an apparatus, unit and method for testing image sensor packages, which can automatically test whether the image sensor packages are defective before they are...
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7425839 |
Systems and methods for testing packaged microelectronic devices
Systems and methods for testing packaged microelectronic devices are disclosed herein. One such system for testing a packaged microelectronic device includes a test socket configured to receive the...
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7408367 |
Micro Kelvin probes and micro Kelvin probe methodology with concentric pad structures
A micro Kelvin probe assembly and method of accomplishing a micro Kelvin measurement that determines the resistance or impedance of a device under test (DUT) that has two spaced contacts. An...
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7405582 |
Measurement board for electronic device test apparatus
A performance board able to secure low loss, low reflection, stable transmission characteristics even when using a high frequency signal to test an electronic device and able to suppress signal...
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7400135 |
Test fixture and method for circuit board testing
A Printed Circuit Board (PCB) test fixture includes flex sensors for monitoring the flex (or distortion) of the PCB during testing. The PCB is positioned above irregular array of test probes. The...
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7397255 |
Micro Kelvin probes and micro Kelvin probe methodology
A micro Kelvin probe assembly and method of accomplishing a micro Kelvin measurement that determines the resistance or impedance of a device under test (DUT) that has two spaced contacts. An...
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