Matches 1 - 50 out of 88 1 2 >


Match Document Document Title
8159248 Interposer structures and methods of manufacturing the same  
Flexible and rigid interposers for use in the semiconductor industry and methods for manufacturing the same are described. Auto-catalytic processes are used to minimize the costs associated with...
8159243 Probe tip to device pad alignment in obscured view probing applications  
A method of performing alignment of an array of probe tips of a probe card to corresponding contact pads for wafer probing applications by performing the steps of: obtaining a backside image of the...
8143898 Systems and methods for reconfiguring an ultrasound device  
Systems and methods (the “utility”) presented herein provide for the assessment of acousto-electrical probes, such as their connections (e.g., transducer leads) and their response cha...
8071496 Silicon nitride-melilite composite sintered body and device utilizing the same  
A silicon nitride-melilite composite sintered body in accordance with the invention includes silicon nitride and a melilite Me2Si3O3N4, where Me denotes a metal element combining with silicon...
8067718 Method and apparatus for probing  
A probe comprises a small “consumable” probe substrate permanently mounted to a circuit-under-test. The probe substrate includes a high-fidelity signal pathway, which is inserted into a con...
8051555 Circuit manufacturing apparatus  
An assembling apparatus includes a chip transfer unit, a heating unit, a testing unit, and an output unit. The chip transfer unit mounts first semiconductor chip to a circuit board to form an...
8054097 Method and system for automatically managing probe mark shifts  
Disclosed is a method and a system for automatically managing probe mark shifts. A determination is made from test data as to whether a die on a wafer is defective. A probe mark check on the wafer...
8013621 Inspection method and program for inspecting electrical characteristics of a semiconductor wafer  
Disclosed is an inspection method capable of performing an inspection of high reliability even for very fine and thin-film electrode pads of a target object, by using needle traces formed on the...
7982487 System for multiple layer printed circuit board misregistration testing  
A test apparatus for determining layer-to-layer misregistration of a multiple layer printed circuit board having an electrical test pattern formed on an inner layer and an electrical test reference...
7952373 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies  
Several embodiments of integrated circuit probe card assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring...
7898274 Structure of probe  
A split-type probe is used to contact with an object under test to detect an electrical characteristic thereof. The probe provided by the present invention has a contact head used to contact with...
7868632 Composite motion probing  
An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the...
7855567 Electronic device testing system and method  
The invention provides a testing system and method suitable for determining whether the pins of the socket are properly connected to a printed circuit board. The testing system includes a testing...
7845072 Method and apparatus for adjusting a multi-substrate probe structure  
A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate...
7782070 Probing device  
A probing device includes a rack that has an outer support member supporting a circuit layer and a center support member supporting a probe assembly. When the tester touching down the circuit layer...
7759961 Ball grid array connection monitoring system and method  
A system for monitoring the connection on an integrated circuit ball grid array (BGA) comprises a connection indicator circuit coupled to at least one monitor pin of the BGA and configured to...
7724018 Methods and apparatus for translated wafer stand-in tester  
A translated wafer stand-in tester, being a hybrid apparatus capable of emulating the form factor and some or all behaviors of a translated wafer under test, which is operable to store, quantify,...
7663387 Test socket  
A support block has a first face, a second face opposed to the first face, and first and second through holes communicating between the first face and the second face, and is formed with resin...
7612573 Probe sensing pads and methods of detecting positions of probe needles relative to probe sensing pads  
A probe sensing pad used to detect a position of a probe needle includes a probe area, at least two sensing regions contacting peripheral portions of the probe area, sensing elements of different...
7395166 Connector including an integrated circuit powered by a connection to a conductor terminating in the connector  
A connector including an integrated circuit, for connecting two conductors directly or indirectly. The integrated circuit derives power either from one of the connectors being connected by the...
7385410 Method of and apparatus for testing for integrated circuit contact defects  
Various tester configurations are provided that injects test signals into nets (e.g. 24). Non-linear characteristics of the response are detected (e.g. harmonics, do offset) and used to assess the...
7368929 Methods and apparatuses for improved positioning in a probing system  
An improved method and apparatus for automatically and accurately aligning a wafer prober to the bonding pads of a semiconductor device are provided. In one embodiment of one aspect of the...
7362116 Method for probing impact sensitive and thin layered substrate  
A method of moving a substrate to a probe card. The method includes moving a probe card and a substrate vertically closer to one another employing dynamically changing velocities during the moving....
7319337 Method and apparatus for pad aligned multiprobe wafer testing  
A control unit of a wafer prober for implementing wafer examination, using a probe card including a multiple number of probes, executes a multiple number of measuring operations by bringing the...
7304489 Inspection method and inspection apparatus  
Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film...
7265569 Test apparatus  
A test apparatus for testing electronic devices, comprising a control section for generating control signals based on a test program set in advance to test the electronic devices, a plurality of...
7262626 Connection apparatus and cable assembly for semiconductor-device characteristic measurement apparatus  
A connection apparatus includes a switch; a control signal connector that transmits a switching signal, sent from a controller, to the switching means; a first plurality of connectors that are...
7250782 Method for testing non-componented circuit boards  
A method of testing circuit boards, in particular non-componented circuit boards in which the level of the surface of a circuit board to be tested is detected automatically in a contacting process,...
7235984 Probe device and probe method  
A probe device 20 having a contact load monitoring device 10. This contact load monitoring device measures the displacement of a loading table caused by a contact load exerted on the mounting table...
7224175 Probe mark reading device and probe mark reading method  
A probe mark reading device for reading probe marks stormed on electrode pads of semiconductor chips contained in a semiconductor wafer (90), comprising a CCD camera (20) for taking an image of the...
7211995 Method and system for detecting electronic component failures  
The invention relates to a method for analysing connection conditions between an integrated circuit package and a circuit board, wherein said integrated circuit package is electrically coupled to...
7208724 Apparatus and method of detecting probe tip contact with a surface  
We disclose an apparatus and method for detecting probe-tip contact with a surface, generally inside a focused ion-beam instrument, where the probe tip is attached to a capsule, and the capsule is...
7135876 Electrical feedback detection system for multi-point probes  
An electrical feedback detection system for detecting electrical contact between a multi-point probe and an electrically conducting material test sample surface. The electrical feedback detection...
7075322 Testing apparatus with electronic camera  
A testing apparatus (2) includes a probe station (21), a micropositioner (22), a probe (23), an electronic camera (27), and a monitor. The probe station has a working surface (211) for supporting...
7053637 Method for testing signal paths between an integrated circuit wafer and a wafer tester  
Signal paths within an interconnect structure linking input/output (I/O) ports of an integrated circuit (IC) tester and test points of an IC die on a wafer are tested for continuity, shorts and...
7042237 Semiconductor test system having a tester and a prober and test method thereof  
A semiconductor test system having a tester and a prober and the test method thereof are proposed. A test mark signal and a control board having a discrimination circuit and a protection circuit...
6989682 Test key on a wafer  
A test key formed on a wafer has a plurality contacting pads, a first wire, and a second wire. The contacting pads are separated into a first group and a second group. The first wire surrounds at...
6946856 Thermal testing method for integrated circuit chips and packages  
A method of thermally testing for whether an integrated circuit die is attached to a die pad, is provided. Heat is applied from an external heat source to a first side of the die pad. The die is...
6897668 Double-faced detecting devices for an electronic substrate  
Double-faced detecting devices for an electronic substrate, the detecting device have a base and two probe-detecting machines oppositely located beside the base. The base has a guiding groove and a...
6853207 Method for evaluating contact pin integrity of electronic components having multiple contact pins  
An apparatus and method for evaluating the integrity of each contact pin of an electronic component having multiple contact pins. In one embodiment, the apparatus includes a test device and a...
6710798 Methods and apparatus for determining the relative positions of probe tips on a printed circuit board probe card  
A probe card inspection system uses a fiduciary plate having a plurality of targets deposited thereon by photolithography and vapor deposition. A plurality of semiconductor probe card probe tips...
6552556 Prober for electrical measurement of potentials in the interior of ultra-fine semiconductor devices, and method of measuring electrical characteristics with said prober  
A prober for measuring electrical characteristics of a semiconductor device includes a contact device having a contactor with a sharp tip provided at a position close above the position of the...
6469537 System for testing semiconductor wafers having interconnect with pressure sensing mechanism  
An interconnect for testing semiconductor wafers, and a method and system for testing wafers using the interconnect are provided. The interconnect includes a substrate with contact members...
6448758 Method for determining wear and other characteristics of electrodes in high voltage equipment  
A diagnostic method for determining a characteristic of electrode contacts and/or contacted surfaces comprising the steps of: sensing, during a movement that causes an electrode to have a break...
6429645 Verification gauge for an electronic package lead inspection apparatus  
A verification gauge for verifying the operation of an inspection system for inspecting the leads of an electronic package, particularly a ball grid array. The gauge has a predetermined mechanical...
6429672 Contamination-tolerant electrical test probe  
A bed-of-nails type or needle-card type test probe has clusters of parallel buckling beams arranged in a spaced arrangement. The buckling beams are arranged and electrically connected within a...
6353325 Apparatus for examining posture of an electronic part  
A piezoelectric sensor has a piezoelectric element having a specific axis of sensitivity and a package for the piezoelectric element. The package has a rectangular parallelopiped configuration with...
6337573 Contact test circuit  
A method and apparatus for contact testing a plurality of devices under test, either sequentially or simultaneously. In a first test phase it is determined whether the test probe to each contact is...
6329830 Screen display for automated verification and repair station  
A flying prober having at least one prober head for contacting test sites on a unit under test which is programed for measuring isolations and continuities of test sites through the prober head....
6275053 Touch probe  
A touch probe has a stylus holder 16 which is supported on a radially extending flange 14 in a kinematic seat comprising pairs of balls 20 supporting rollers 24. To avoid the use of glue to fix the...
Matches 1 - 50 out of 88 1 2 >