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8164355 |
Electronic component pressing device and electronic component test apparatus
An electronic component pressing device includes a first pressing member for pressing a predetermined first region of the electronic component to be tested; a second pressing member for pressing a...
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8044673 |
Method and apparatus for positioning and contacting singulated semiconductor dies
A re-configurable test socket system and test socket architecture are described involving a combination of particular micro elements and re-useable macro elements that can be reused and...
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8035406 |
Test head positioning system and method
An apparatus for supporting a load includes pneumatic units and couplers coupled to opposite sides of the load. The couplers move the load parallel to a first axis responsive to actuation of the...
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7982484 |
System for making contact between a transmit/receive module and a testing device
A system for making electrical contact between a transmit/receive module and a testing device for the transmission of high-frequency signals includes a mechanically guided, frame-shaped contacting...
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7944200 |
Probe apparatus
A probe apparatus includes a holding frame holding a test head through a biasing unit biasing the test head. An annular member is rotatably mounted in an opening of a ceiling plate of a main body....
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7945357 |
Movable body system having linear motor
Primary coils of a linear motor are arranged along a travel route. A movable body has a secondary side of the linear motor. The travel route is divided into a plurality of zones, and a zone...
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7940070 |
Singulated bare die testing fixture
A flexible redistribution membrane and a piece of silicon rubber is used in a testing fixture for testing a singulated bare die. The silicon rubber is used as a cushion under the flexible...
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7884632 |
Semiconductor inspecting device
In a semiconductor inspecting device having a contact to be electrically connected to an electrode pad formed in a semiconductor device which is an object to be measured, and a substrate provided...
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7868632 |
Composite motion probing
An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the...
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7859283 |
Probe apparatus, probing method, and storage medium
A probe apparatus is capable of being scaled-down and reducing a manufacturing cost thereof in a probe apparatus having a plurality of probe apparatus main bodies. A loader unit for transferring a...
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7855568 |
Probe apparatus with mechanism for achieving a predetermined contact load
A probe apparatus includes a mounting table having a mounting table main body and a chuck top, cylinder mechanisms surrounding a mount of the chuck top, and a connecting mechanism to releasably...
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7852096 |
Spring-loaded, removable test fixture for circuit board testers
A circuit board tester that uses an axial translation to bring a unit under test (UUT) into physical and electric contact with a series of electrical probes. The element on the tester that comes...
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7852097 |
Methods and apparatuses for improved positioning in a probing system
An improved method and apparatus for automatically and accurately aligning a wafer prober to the bonding pads of a semiconductor device are provided. In one embodiment of one aspect of the...
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7847570 |
Laser targeting mechanism
An automated test equipment system includes a peripheral including first mechanical alignment features; a test head including second mechanical alignment features arranged in a pattern...
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7839156 |
Method for detecting tip position of probe, alignment method, apparatus for detecting tip position of probe and probe apparatus
An probe tip position detecting method detects tip positions of a plurality of probes by using a tip position detecting device including a sensor unit for detecting tips of the probes and a movable...
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7755378 |
Clamping top plate using magnetic force
A test fixture, for testing an electronic device, includes: a test platform including electrically conductive contacts protruding from a device receiving surface in the test platform; a positioning...
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7755374 |
Apparatus and method for testing semiconductor devices
An apparatus for testing semiconductor devices includes a first member configured as a drawer to be movable in and out of the housing and to receive a tray assembly containing semiconductor devices...
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7746089 |
Method and apparatus for indirect planarization
Methods and apparatus for indirect planarization of a substrate are provided herein. In one embodiment, an apparatus for indirectly planarizing a probe card assembly includes an adjustment portion...
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7728579 |
Test head positioning system and method
An apparatus for supporting a load includes pneumatic units and couplers coupled to opposite sides of the load. The couplers move the load parallel to a first axis responsive to actuation of the...
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7656152 |
Pusher for match plate of test handler
A pusher for a match plate of a test handler is disclosed which assists a tester to test the produced semiconductor devices. The pusher includes: a body part installed to an installation plate; and...
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7652495 |
Pusher assemblies for use in microfeature device testing, systems with pusher assemblies, and methods for using such pusher assemblies
Pusher assemblies for use in microelectronic device testing systems and methods for using such pusher assemblies are disclosed herein. One particular embodiment of such a pusher assembly comprises...
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7626404 |
Replaceable probe apparatus for probing semiconductor wafer
A probe apparatus for probing a device on a semiconductor wafer to be tested by a testing equipment is provided. The probe apparatus includes a replaceable probe tile removably mounted in a probing...
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7609052 |
Contact pusher, contact arm, and electronic device handling apparatus
A contact pusher attached to the front end of a contact arm bringing an IC device into contact with a contact part of a test head and pushing the IC device is provided with a suction pad for...
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7598729 |
Semiconductor chip flipping assembly and apparatus for bonding semiconductor chip using the same
A semiconductor chip flipping assembly and an apparatus for bonding a semiconductor chip using the same are disclosed. In accordance with the semiconductor chip flipping assembly and the apparatus...
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7589543 |
Probe card having a conductive thin film on the surface of an insulating film behind each of the alignment marks each marks comprises a plurality of second bumps
A probe card for a wafer level test of electrical characteristics of a plurality of semiconductor integrated circuit devices formed on a semiconductor wafer. The card has a thin film with bumps on...
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7589545 |
Device for final inspection
A device is provided for subjecting a plurality of singulated semiconductor components to functional verification, which includes contact pins that are integrated in a test socket and establish a...
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7579847 |
Probe card cooling assembly with direct cooling of active electronic components
A probe card cooling assembly for use in a test system includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic...
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7567075 |
Single latch manual actuator for testing microcircuits, and having a mechanical interlock for controlling opening and closing
An actuator device applies force to an integrated circuit package to enable temporary contact between a plurality of contacts on the integrated circuit package and to a set of test contacts carried...
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7525303 |
Automatic testing apparatus and method
An automatic testing apparatus (200) includes a transmission floor (210), a board (220), a stopping unit (230), and a testing device (260) beside the transmission floor. The transmission floor...
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7525326 |
Test apparatus capable of accurately connecting a test object to a substrate
In a test apparatus for testing a test object, a connector is held by an inner frame of the test apparatus and electrically connected to a substrate. A pusher is slidably held by the inner frame....
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7511473 |
Pressing member and electronic component handling device
A first spring 54 is provided between a support member 51 driven in the Z-axis direction and a heat block 53, and biases the support member 51 and the heat block 53 in the direction of separating...
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7463042 |
Connector probing system
An improved probing system is provided for facilitating the making electrical connections to a variety of connectors. The system can be implemented with a plurality of probes capable of being...
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7389572 |
Method of retrofitting a probe station
A method of retrofitting a probe station having a head plate (12), so that the probe station (10) is adapted to mate with a predetermined probe card dish (16) and any tester (18) out of a set of...
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7382142 |
High density interconnect system having rapid fabrication cycle
An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA)...
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7378862 |
Method and apparatus for eliminating automated testing equipment index time
The present invention eliminates the indexing time of an SOC tester, or at least reduces it to the time delay for an electronic switch to toggle or a mechanical shift to occur between two banks of...
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7372250 |
Methods and apparatus for determining a position of a substrate relative to a support stage
A sensing system includes a plurality of probes arranged in a spaced relation around a stage that is adapted to support a substrate. Each probe includes a detection portion adapted to move from a...
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7365551 |
Excess overdrive detector for probe cards
A novel structure for a probe card that comprises a deformable metal or other deformable material for detecting excess overdrive and a method for using the same are disclosed. This detection...
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7358754 |
Methods and apparatus for creating a high speed connection between a device under test and automatic test equipment
Methods and apparatus are described for connecting a first plurality of signal lines to a second plurality of signal lines. A first assembly includes a plurality of first contact arrays. Each of...
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7355418 |
Configurable prober for TFT LCD array test
An improved prober for an electronic devices test system is provided. The prober is “configurable,” meaning that it can be adapted for different device layouts and substrate sizes. The prober gen...
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7352197 |
Octal/quad site docking compatibility for package test handler
A test system configuration is provided to enable testing of integrated circuit (IC) packages. The test system includes a test controller, an interface apparatus including a PC board with lines...
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7339368 |
Methods and apparatus for testing circuit boards
A method includes placing a circuit board on a test sheet so that conductive pins on an underside of the circuit board are in electrically conductive contact with electrically conductive contact...
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7332905 |
Fixture for circuit board
A fixture for clamping and fixing a circuit board is provided. The fixture includes a base and a moving element. The base includes a first supporting board and a second supporting board disposed on...
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7330040 |
Test circuitry wafer
Method and apparatus for testing a plurality of devices on a device wafer. One embodiment provides a test circuitry wafer having a first surface and a second surface, the test circuitry wafer...
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7323892 |
Probe having a frame to align spring pins perpendicularly to a printed circuit board, and method of making same
In one embodiment, a probe for probing test points on a target board includes a printed circuit board, a frame, and a plurality of spring pins. The printed circuit board (PCB) has a first side with...
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7307437 |
Arrangement with conductive pad embedment
A plurality of conductive pads of an apparatus in one example are disposed on a circuit board in a predetermined arrangement compatible with an arrangement of probes on an external test connector....
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7304491 |
Interconnect for testing semiconductor components
An interconnect for testing semiconductor components includes interconnect contacts configured for bonding to, and then separation from component contacts on the components. The interconnect can be...
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7295023 |
Probe card
The present probe card comprises a circuit board, a platform fixed on the circuit board, a tunable stage positioned on the platform, a probe carrier positioned on the tunable stage and at least one...
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7295024 |
Contact signal blocks for transmission of high-speed signals
A contact signal block for facilitating connections between test equipment and a device under test (DUT) is described. The contact signal block includes a plurality of ground layers and a plurality...
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7282936 |
Die design with integrated assembly aid
An upper die portion (36) of a die head for aligning probe pins (14) in first array of first micro-holes (18) formed in lower die portion (12) of the die head, which generally includes a spacer...
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7274197 |
Contact system for interfacing a semiconductor wafer to an electrical tester
Disclosed herein are exemplary embodiments of a contact system (referred to as a “Z-block”) for interfacing a semiconductor wafer to an electrical tester, and methods for making the same. In a pre...
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