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9024647 Sequential burn-in test mechanism  
A method includes performing a burn-in test on an integrated circuit (IC) by removing power from a first component block within the IC and applying a maximum burn-in voltage and temperature to a...
9000789 Method and equipment for testing semiconductor apparatuses simultaneously and continuously  
A method for testing a plurality of semiconductor apparatuses, the method including mounting a plurality of semiconductor apparatuses on a first test board, wherein the plurality of semiconductor...
8937482 Apparatus and method for ramping and controlling the temperature of a component using a vortex tube  
Apparatus and method adapted for use with an optionally pre-conditioned air supply that is pressurized, for ramping a component to a temperature setpoint, having a vortex tube, a ventilated mount...
8896335 Thermal controller for electronic devices  
An apparatus controls a temperature of a device by circulating a fluid through a heat sink in thermal contact with the device. The apparatus includes an adjustable cold input, which inputs a cold...
8836355 Dynamic testing based on thermal and stress conditions  
A plurality of sets of test conditions of a die in a stacked system is established, wherein the plurality of test conditions are functions of temperatures of the die, and wherein the stacked...
8779788 Burn-in testing apparatus  
A testing apparatus includes a thermal control chamber including a test room, which temperature is controlled within a testing temperature range; a carrier frame including a direction guiding unit...
8766656 Systems and methods for thermal control  
The present invention relates generally to a system and a method for thermal control. More particularly, the invention encompasses an apparatus for thermal control and management of at least one...
8749255 Electronic device test apparatus  
An electronic device test apparatus which can optimize throughput and costs is provided. An electronic device test apparatus 1 comprises: a test cell cluster 10 having cell groups 11A to 11H each...
8736289 Burn-in test apparatus with function of energy recycling  
A new electrical recycling apparatus for AC/DC power converter is provided to recycle the electricity in direct current to the input ends of the power converter to be tested to save a stage of...
8717048 System for post-processing of electronic components  
A method of post-processing a plurality of electronic components in a post-processing machine after fabrication of the electronic components including providing a carrier with align fixtures,...
8709834 Methods of fabricating semiconductor device  
A method of manufacturing a semiconductor device includes providing a wafer, forming a memory device which includes phase change material layer on the wafer, completing a wafer level process of...
8692568 Electronic apparatus having IC temperature control  
The use of a power sink function in IC testing results in a simple and rapid method for testing ICs, and assembled modules, at elevated temperature profiles without the use of environmental ovens....
8624614 Burn-in method for surface emitting semiconductor laser device  
A burn-in method includes applying a stress current for applying thermal stress to a surface-emitting semiconductor laser, measuring an operation characteristic of the surface-emitting...
8482307 Method and apparatus for the prevention of untested or improperly tested printed circuit boards from being used in a fire pump control system  
The present invention relates to a method and apparatus for preventing untested or improperly tested printed circuit boards from being used in a fire pump control system by interrogating each...
8446161 Method of self monitoring and self repair for a semiconductor IC  
A method for self repair of a semiconductor IC is presented. An IC state is set to test/repair mode upon powering up the IC. Fuse data is loaded from an e-fuse module. Defects or faults are...
8405416 Probe and method fabricating the same  
A probe includes a wire and a bump, wherein the wire is formed on a substrate; and the bump is formed upon the wire. In addition, a probe block includes a plurality of probes disposed on a...
8405412 Integrated circuit self-monitored burn-in  
An IC adapted for self-monitored burn-in includes a first memory and at least one BIST circuit coupled to the memory and operative to test the IC by executing a burn-in test and to generate test...
8384395 Circuit for controlling temperature and enabling testing of a semiconductor chip  
A circuit for controlling temperature of a semiconductor chip includes a first heating element that is built into the semiconductor chip. The first heating element generates heat to increase the...
8384405 Method for performing burn-in test  
A method of the invention for performing burn-in test includes assembling, on a fixture stand, a plurality of light source elements and a plurality of light detectors for monitoring a light output...
8344743 Testing system for power supply unit  
A testing system for a PSU includes a test chamber and a control device. The test chamber includes a first partition with the PSU accommodated therein and a second partition with an electric load...
8310246 Continuity testing apparatus and continuity testing method including open/short detection circuit  
A continuity testing apparatus includes open/short detection circuits provided for to-be-tested terminals, respectively and configured to determine the presence or absence of at least any one of...
8294484 Pulse voltage age acceleration of a laser for determining reliability  
A method of accelerating the aging of a laser to thereby determine the reliability of the laser. The method includes an act of providing a laser die for reliability testing, an act of applying a...
8274301 On-chip accelerated failure indicator  
An accelerated failure indicator embedded on a semiconductor chip includes an insulating region; a circuit located inside the insulating region; a heating element located inside the insulating...
8228082 Automated loading/unloading of devices for burn-in testing  
The automatic loading and unloading of devices for burn-in testing is facilitated by loading burn-in boards in a magazine with the stacked boards in the magazine moved into and out of a burn-in...
8212576 Method and apparatus for self-regulated burn-in of an integrated circuit  
Method and apparatus for self-regulated burn-in of an integrated circuit (IC) is described. One embodiment of a method of burn-in for the IC includes: configuring programmable resources of the IC...
8213184 Method of testing using a temporary chip attach carrier  
A method of testing integrated circuit chips. The method includes: attaching integrated circuit chips to an interposer of a temporary carrier, the carrier comprising: a substrate, a first...
8178364 Testing method of surface-emitting laser device and testing device thereof  
A method of performing a wafer level burn-in test for a plurality of surface-emitting laser devices formed on a wafer includes causing a plurality of contact electrodes arranged in a same plane...
8076951 Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis  
A micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes micro-spray heads disposed about a probe head. The...
8067949 Methods for testing lasers using optical burn-in  
Semiconductor lasers are aged to identify weak or flawed devices, resulting in improved reliability of the remaining devices. The lasers can be aged using a high-power optical burn-in that...
8030954 Internal voltage level shifting for screening cold or hot temperature defects using room temperature testing  
Operation of an internal voltage supply level (Vgg) of an IC is characterized over operating temperature or at a selected temperature to determine a temperature-equivalent internal voltage level....
8008934 Burn-in system for electronic devices  
A burn-in system (10) includes an enclosure (12) defining a burn-in chamber (14). The enclosure (12) is configured to be mounted on a burn-in board (34) over a burn-in socket (36). A heating...
7982476 Conduction-cooled accelerated test fixture  
According to one embodiment of the invention, a testing apparatus for executing highly accelerated life testing on at least one test subject includes at least one structure operable to thermally...
7944223 Burn-in testing system  
The present invention discloses a burn-in testing system including a burn-in board and a burn-in testing apparatus, the burn-in board including: a first interface component, adapted to connect...
7940064 Method and apparatus for wafer level burn-in  
A temperature regulation plate 106 is divided into at least two areas, a heater 408 for applying a temperature load in correspondence with such areas and its control system are divided and...
7932733 Apparatus for detecting defect by examining electric characteristics of a semiconductor device  
An exemplary apparatus for detecting defect is capable of measuring temperature characteristics of a semiconductor sample without restrictions in the movement range of a sample stage and a probe...
7928754 Wafer level burn-in and electrical test system and method  
A burn-in and electrical test system (20) includes a temperature controlled zone (22) and a cool zone (24) separated by a transition zone 25. The temperature controlled zone (22) is configured to...
7915902 Dynamic burn-in systems and apparatuses  
A burn-in apparatus with a radio frequency signal generator is provided. One embodiment includes a printed circuit board to carry a plurality of semiconductor devices for a burn-in process and a...
7902853 Semiconductor device, semiconductor device testing method, and probe card  
A test signal to be supplied to a driver section when the driver section is subjected to an operation test is generated by a test circuit. In the test circuit, the test signal can be generated by...
7876116 Compliant chuck for semiconducting device testing and chiller thereof  
A compliant chuck has a top base assembly, a bottom bracket assembly, a contact plate, a sensor device, a thermoelectric cooling module and a heat-dissipating module. The bottom bracket assembly...
7868633 Modular liquid cooled burn in system  
An electronic device burn-in thermal management system includes Burn-in-Boards (BIBs) with quick disconnect connectors to easily connect and disconnect the BIB (102) from liquid cooling lines...
7868642 Socket for connecting ball-grid-array integrated circuit device to test circuit  
A simple structure socket 10 for connecting a ball grid array integrated circuit device to a test circuit has a base 14, contacts 26 arranged corresponding to the ball grid array, a nest assembly...
7868641 Semiconductor device  
A semiconductor device with technology for externally deciding if the stress test was performed or not. A semiconductor device includes a stress test circuit and a stress test decision circuit....
7863915 Probe card cooling assembly with direct cooling of active electronic components  
A probe card cooling assembly for use in a test system includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic...
7863916 Device mounted apparatus, test head, and electronic device test system  
A device mounted apparatus includes a board on which a plurality of devices are mounted and a device cooling cover covering the plurality of devices, and formed inside it with a channel through...
7855569 Wafer holder for wafer prober and wafer prober equipped with the same  
The invention provides a wafer-prober wafer holder that allows positional precision and temperature uniformity to be increased, and also allows the chip to be heated and cooled rapidly, and a...
7852098 On-die heating circuit and control loop for rapid heating of the die  
An integrated circuit includes a heating circuit configured to heat the integrated circuit under the control of a controller. A transfer function with adjustable pole, zero and overall gain is...
7834648 Controlling temperature in a semiconductor device  
Systems and methods for reducing temperature dissipation during burn-in testing are described. Devices under test are each subject to a body bias voltage. The body bias voltage can be used to...
7830164 Ducted test socket  
A ducted test socket for thermally testing a device under test (DUT) is provided that can accommodate a large DUT and will improve the thermal transfer efficiency between a precision temperature...
7815369 Method of measuring temperature of tunnel magnetoresistive effect element  
A method of measuring temperature of a TMR element includes a step of obtaining in advance a temperature coefficient of element resistance of a discrete TMR element that is not mounted on an...
7812627 Test device  
A test device includes a movable mounting table having a temperature controlling mechanism therein; a probe card provided with a plurality of probes positioned above the mounting table; and a...