|
Match
|
Document |
Document Title |
|
|
7621036 |
Method of manufacturing implantable wireless sensor for in vivo pressure measurement
A method of manufacturing a sensor for in vivo applications includes the steps of providing two wafers of an electrically insulating material. A recess is formed in the first wafer, and a capacitor...
|
|
|
7617600 |
Process of making an electronic circuit device having flexibility and a reduced footprint
An electronic circuit formed by removing only a baseboard from an electronic module. The electronic circuit may be formed by providing a baseboard made of a water-soluble material, applying a...
|
|
|
7614148 |
Method of providing connector compatibility for data interface
Cable connection unions are rapidly replaced in a universal seismic data acquisition-module without opening a main electronic circuitry protective chamber. Different connector types required for...
|
|
|
7603769 |
Method of coupling a surface mount device
Methods of coupling a surface mount device with a substrate such as a printed circuit, for example, are disclosed. A method, according to one aspect, may include coupling a holder with a substrate...
|
|
|
7588965 |
Stencil and method for depositing material onto a substrate
A stencil and method for depositing a coupon of underfill material onto a substrate that is to receive an integrated circuit die.
|
|
|
7581305 |
Method of manufacturing an optical component
A method of manufacturing an optical component comprising a substrate and a mounting frame with plural contact portions disposed at predetermined distances from each other is provided. The method...
|
|
|
7578057 |
Method of fabricating segmented contactor
A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted...
|
|
|
7559140 |
Method for mounting multishaft servo amplifier module
In a method for mounting a plurality of multishaft servo-amplifier modules, each of which has an identical shape and an identical function to each other and carries semiconductor power elements, on...
|
|
|
7552532 |
Method for hermetically encapsulating a component
A method is provided to produce a hermetic encapsulation for an electronic component, which may be an optical and at least partially light-permeable component or a surface wave component, comprises...
|
|
|
7506436 |
Methods for making conforming shielded form for electronic component assemblies
The present invention provides a method for preparing a conforming shield enclosure for shielding a semiconductor device of an electronic component assembly comprising the steps of: (a) metalizing...
|
|
|
7475460 |
Method of producing an airtight terminal
A method for producing an airtight terminal having an annular stem, a lead passing through the stem and formed of a conductive material, and a filler for fixing the lead in the stem includes (1) a...
|
|
|
7444726 |
Method of making an essentially monolithic capacitor
A monolithic or essentially monolithic single layer capacitor with high structural strength and capacitance, a printed circuit board having the capacitor mounted thereon, and a method of making....
|
|
|
7392581 |
Method for manufacturing a magnetic element
A plate member includes a frame portion ( 51 ) provided in a state of coupling both one end portion and other end portion and mounting terminal portions ( 44 ) protruding from the one end portion...
|
|
|
7387740 |
Method of manufacturing metal cover with blind holes therein
An exemplary method of manufacturing a metal cover ( 1 ) with blind holes ( 3 ) therein includes: step ( 60 ), preparing a metal substrate; step ( 62 ), covering the metal substrate with a...
|
|
|
7334324 |
Method of manufacturing multilayer wiring board
A method of manufacturing a, in order to accommodate the words range and to clarify the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating...
|
|
|
7332376 |
Method of encapsulating packaged microelectronic devices with a barrier
Methods and apparatuses for encapsulating a microelectronic die or other components in the fabrication of packaged microelectronic devices. In one aspect of the invention, a packaged...
|
|
|
7310873 |
Method of manufacturing an implantable lead
An implantable lead body for a medical device with improved conductor lumens separates and insulates conductors while permitting access to the conductors through the implantable lead outer surface....
|
|
|
7310872 |
Computer enclosure
A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite...
|
|
|
7299548 |
Method of waterproof of electric cable joint
Sealing material is injected into a cap receiving an electric cable joint without remaining air bubbles. The cap has an opening at both ends and receives the joint, the electric cable being in the...
|
|
|
7296350 |
Method for fabricating a drop generator
A method for fabricating a drop generator with a uniquely formed nonconductive mandrel, which when encapsulated with electroplated metal, shapes and defines the internal ink channel entails...
|
|
|
7296345 |
Method for manufacturing a memory device
A portable memory device includes a molded housing and a printed circuit board assembly (PCBA) encased with the molded housing such that a plug connector extends from one end. A lower housing...
|
|
|
7281305 |
Method of attaching a capacitor to a feedthrough assembly of a medical device
A method for attaching a capacitor to the feedthrough assembly of a medical device having a terminal pin comprises threading a first washer over the terminal pin, and placing a body of epoxy in...
|
|
|
7246421 |
Method for manufacturing surface acoustic wave device
A surface acoustic wave device which occupies a small mounting area and has a low profile, yet having an improved reliability, and can be made available at low cost. The surface acoustic wave...
|
|
|
7231712 |
Method of manufacturing a module
A module includes a ceramic substrate, first and second electrodes provided on the ceramic substrate, a component having third and fourth electrodes connected to the first and second electrodes,...
|
|
|
7225534 |
Telecommunications cable jacket adapted for post-extrusion insertion of optical fiber and methods for manufacturing the same
The present disclosure relates to a telecommunications cable having a jacket including a feature for allowing post-extrusion insertion of an optical fiber or other signal-transmitting member. The...
|
|
|
7193161 |
SiP module with a single sided lid
A single-lid flash memory card and methods of manufacturing same are disclosed. The single-sided lid flash memory card may be formed from a semiconductor package having two or more tapered, stepped...
|
|
|
7178235 |
Method of manufacturing an optoelectronic package
A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic...
|
|
|
7174627 |
Method of fabricating known good dies from packaged integrated circuits
A known good die is economically fabricated. A tested integrated circuit is provided which includes a die having a bonding location on an upper surface and a lead. An upper portion of the...
|
|
|
7171748 |
Method of manufacturing a liquid jet recording head
Disclosed is a manufacturing method of a liquid jet recording head which includes a forming step of forming a recess portion between a flexible film wiring board and a recording element board, a...
|
|
|
7168161 |
Manufacturing method of solid-state image sensing device
In a method of manufacturing a camera module having a CMOS image sensor, a semiconductor chip to serve as a light sensor is mounted on a optical-component-mounting face of a wiring substrate mother...
|
|
|
7146720 |
Fabricating a carrier substrate by using a solder resist opening as a combination pin one indicator and fiducial
A method for forming a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions of prior art fiducials and pin one...
|
|
|
7129590 |
Stencil and method for depositing material onto a substrate
A stencil and method for depositing a coupon of underfill material onto a substrate that is to receive an integrated circuit die.
|
|
|
7122905 |
Microelectronic devices and methods for mounting microelectronic packages to circuit boards
Packaged microelectronic devices, methods of manufacturing packaged microelectronic devices, and method of mounting packaged microelectronic devices to printed circuit boards. One embodiment can...
|
|
|
7117591 |
Method of mounting a light fixture to a vertical wall
A siding block comprising an electrical junction box and a cover for mounting a light fixture to the exterior of a building. The electrical junction box includes a back wall, a front peripheral...
|
|
|
7101737 |
Method of encapsulating interconnecting units in packaged microelectronic devices
Methods and apparatuses for encapsulating a microelectronic die or other components in the fabrication of packaged microelectronic devices. In one aspect of the invention, a packaged...
|
|
|
7089661 |
Method for packaging small size memory cards
A method is disclosed for packaging a small size memory card, including xD Picture card, Memory Stick™, Secure Digital™ (SD) card, SmartMedia™ (SM) card, Multimedia card (MMC),...
|
|
|
7086147 |
Method of accommodating in volume expansion during solder reflow
Solder balls such as, low melt C4 solder balls, undergo volume expansion during reflow, such as may occur during attachment of chip modules to a PCB. Where the solder balls are encapsulated,...
|
|
|
7059042 |
Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink
A sheet-like thermally conductive resin composition containing 70 to 95 wt. % inorganic filler and 5 to 30 wt. % thermosetting resin composition, a lead frame as a wiring pattern, and an...
|
|
|
7047629 |
Method of manufacturing circuit board
A circuit board manufacturing method including the steps of forming a through hole on an insulator layer and then filling the through hole with a conductive paste; dispersing and forming a...
|
|
|
7047637 |
Method of manufacture of ceramic composite wiring structures for semiconductor devices
Method of manufacture of a composite wiring structure for use with at least one semiconductor device, the structure having a first conductive member upon which the semiconductor device can be...
|
|
|
7036223 |
Cabling method
A cabling method especially for installing thick electric cables ( 1 ) for connection to electric devices ( 8 ), in which method the cables ( 1 ) are brought to a cabling space ( 3 ), fitted and...
|
|
|
7031170 |
Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device
An electronic device has a plastic housing. The plastic housing has components of a height-structured metallic leadframe. The components are in a matrix form and contain contact islands and chip...
|
|
|
6986197 |
Method of manufacturing an IC package
A method is provided for processing leadframe items of two or more types to form integrated circuit packages. The leadframe items are delivered along respective input paths and are received into...
|
|
|
6968613 |
Fabrication method of circuit board
A fabrication method of a circuit board is proposed, wherein a core layer is formed with a plurality of conductive traces, and photo resist is respectively applied on terminals of the conductive...
|
|
|
6970360 |
Tamper-proof enclosure for a circuit card
A tamper-proof enclosure for an electrical card, such as a high speed communications card, includes an enclosure in which the card is mounted. The enclosure has a wall with an opening, and a cup...
|
|
|
6957475 |
Method of manufacturing piezoelectric component
A method of manufacturing a piezoelectric component includes forming an unhardened first elastic material partially on at least a pair of end portions of a piezoelectric element, the pair of end...
|
|
|
6948239 |
Method for fabricating semiconductor apparatus using board frame
A method for fabricating a semiconductor apparatus using a board frame. A wiring board region of the frame includes an island on which a semiconductor device is mounted. A marginal region of the...
|
|
|
6941640 |
Method of manufacturing a base plate for a miniature hard disc drive
The present invention is directed to a miniature hard disc drive having a metal base plate, an actuator assembly wherein the actuator assembly comprises a plurality of bearings, a shaft, and a...
|
|
|
6935020 |
Method of producing a battery-connecting plate
A method of producing a battery-connecting plate by providing busbars which connect batteries together, attaching terminals to one end of wires to produce terminal-attached wires for detecting...
|
|
|
6922890 |
Planarization process for thin film surfaces
A method is provided for planarization of structures which minimizes step heights, reduces process steps, improves cleanliness, and provides increased ease of debond. Structures are placed with...
|