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Match Document Document Title
7398595 Method for forming a storage cell capacitor compatible with high dielectric constant materials  
An integrated circuit structure includes a digit line and an electrode adapted to be part of a storage cell capacitor and includes a barrier layer interposed between a conductive plug and an...
7392584 Methods and apparatus for a flexible circuit interposer  
Methods and apparatus for testing a semiconductor device are disclosed. A flexible circuit interposer includes a flexible circuit substrate which allows in-situ probing of an attached device...
7389581 Method of forming compliant contact structures  
A compliant contact structure and contactor card for operably coupling with a semiconductor device to be tested includes a substantially planar substrate with a compliant contact formed therein....
7389569 Method for manfacturing an acoustic matching member  
A method for manufacturing an acoustic matching member, the acoustic matching member being incorporated into an ultrasonic transducer for transmitting and receiving ultrasonic waves, and including:...
7385144 Method and apparatus for electrically connecting printed circuit boards or other panels  
A method and apparatus is provided for forming a printed circuit board or other panel in which an array of vias are arranged in a desired connection grid within one or more layers of the board and...
7383630 Method for making a circuit plate  
A method for making a circuit plate includes: forming first holes in an insulating layer; forming a conductive layer on the insulating layer such that a portion of the conductive layer fills the...
7377033 Method of making circuitized substrate with split conductive layer and information handling system utilizing same  
A method of making circuitized substrate which includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate...
7377032 Process for producing a printed wiring board for mounting electronic components  
A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via 4...
7370412 Method for connecting electronic device  
An electronic device connecting method according to a first aspect of the present invention includes: mounting an electronic device having at least one electrode portion on a sheet-like porous...
7370411 Wiring board manufacturing method  
A method of manufacturing a wiring board includes: forming a first insulating layer on a supporting board; mounting at least one reinforcing member on the first insulating layer; mounting at least...
7367117 Electronic component mounting apparatus and electronic component mounting method  
The invention prevents mismounting of an electronic component caused by missetting of a component feeding unit in an apparatus. A recognition process of an electronic component is performed...
7367114 Method for plasma etching to manufacture electrical devices having circuit protection  
Methods of manufacturing a variety of circuit protection devices are provided as well as devices so manufactured. In an embodiment, a surface mount electrical device having a substrate and a pair...
7363706 Method of manufacturing a multilayer printed wiring board  
This invention provides a multilayer printed wiring board having flat via holes. This is a multilayer printed wiring board formed by alternately laminating multiple metal foils and insulating...
7363695 Method of fabricating a temperature sensing tube  
A temperature sensor temperature sensing tube and its fabrication method comprised of a step that provides for a tubular blank of an appropriate length, a step in which a curvilinear semifinished...
7360308 Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers  
A coaxial via structure is adapted to transmit high speed signals or high intensity current through conductive layers of an electronic device carrier. The coaxial via structure comprises a central...
7360307 Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors  
A circuit board module has an IC device, discrete components, and a circuit board structure in electrical communication with the IC device and the discrete component. The circuit board structure...
7356923 Rigid flex interconnect via  
A rigid-flexible printed wire assembly which employs a blind via for interconnection is disclosed. Preferably, the assembly includes a rigid section having a through hole formed therethrough and a...
7353600 Circuit board fabrication method and circuit board  
A circuit board fabrication method including: forming first conductive interconnection 2 onto insulator substrate 1; applying resin film 41, which is to be interlevel insulator layer 42 for...
7353590 Method of forming printed circuit card  
A method of forming a printed circuit card with a metal power plane layer between two photoimageable dielectric layers is provided. Photoformed metal filled vias and plated through holes are in the...
7350298 Method for fabricating circuit board with conductive structure  
A method for fabricating a circuit board having a conductive structure is disclosed. The method includes: forming first and second insulating protective layers respectively on first and second...
7350297 Method of manufacturing a wiring substrate  
A first plating foundation layer is formed by printing on a front face of a sheet-shaped insulating substrate. By inserting a punch into the sheet-shaped insulating substrate having the first...
7350296 Method of fabricating a printed circuit board including an embedded passive component  
Disclosed is a method of fabricating a PCB including an embedded passive component and a method of fabricating the same and a method of fabricating the same. The PCB includes at least two circuit...
7350294 Method of electroplating a plurality of conductive fingers  
A method of electroplating may include placing a pair of conductive fingers in proximity to an edge of a circuit board, where the pair are coupled to be electrically isolated, and where the pair...
7350293 Low profile ball-grid array package for high power  
A low-profile, high power ball grid array, or land grid array, device including a plastic tape having first and second surfaces, a portion of the first surface covered with an adhesive layer. First...
7346982 Method of fabricating printed circuit board having thin core layer  
A method is directed towards fabricating a printed circuit board (PCB) having a thin core layer. In the method, a substrate, where a copper foil is formed on a release film and a prepreg, is...
7343674 Method of making circuitized substrate assembly  
A method of making a circuitized substrate assembly wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, and a cover is...
7340829 Method for fabricating electrical connection structure of circuit board  
A method for fabricating an electrical connection structure of a circuit board is proposed. The circuit board is provided with a plurality of pads on a surface thereof and with a plurality of...
7337537 Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board  
A method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board are described herein. In the preferred embodiment, the printed circuit...
7337535 Hole plugging method for printed circuit boards, and hole plugging device  
A hole plugging method for a printed circuit board, a hole plugging device in accordance therewith and a manufacturing method in accordance therewith where a mask for selectively exposing a via...
7334326 Method for making an integrated circuit substrate having embedded passive components  
A method for making an integrated circuit substrate having embedded passive components provides a reduced cost and compact package for a die and one or more passive components. An insulating layer...
7334325 Apparatus and method for improving coupling across plane discontinuities on circuit boards  
The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout,...
7334323 Method of making mutilayered circuitized substrate assembly having sintered paste connections  
A method of making a circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder...
7328506 Method for forming a plated microvia interconnect  
A method for forming a plated microvia interconnect. An external dielectric layer (EDL) is mounted on a surface of the substrate and is in direct mechanical contact with a conductive element...
7328504 Method for manufacturing circuit board with built-in electronic components  
Disclosed is a method for manufacturing a circuit board, comprising step for preparing an insulating member and an electronic component having position-setting means on the lower surface thereof (S...
7325301 Method of manufacturing a wiring board  
A wiring board according to the present invention includes a wiring part formed of one or more layers, a first terminal area disposed on one side of the wiring part in a projecting manner, and a...
7325300 Method of manufacturing printed wiring boards  
In a heat and press stage of manufacturing printed wiring boards, a functional surface layer having release property is provided on a surface of a cushion, and a blocking layer is prepared between...
7325299 Method of making a circuitized substrate  
A method of making a circuitized substrate. A conductive layer having a substantially planar upper surface is formed on and in direct mechanical contact with an upper surface of a substrate. A...
7320174 Methods for creating ground paths for ILS  
Methods for creating a ground path between a stainless steel suspension and a copper trace layer in an integrated lead assembly of a disk drive suspension. The invention prevents electrostatic...
7316063 Methods of fabricating substrates including at least one conductive via  
A method of fabricating a substrate is disclosed. Apertures are formed in a substrate blank. A conductive layer is formed on opposing surfaces of the substrate, as well as inside the apertures....
7313858 Method for manufacturing a magnetic head coil structure and/or pole tip structure  
A Damascene process is provided for manufacturing a coil structure for a magnetic head. During the manufacturing process, an insulating layer is initially deposited after which a photoresist layer...
7312402 Method and apparatus for providing improved loop inductance of decoupling capacitors  
A method and apparatus that provides improved loop inductance of decoupling capacitors. Vias are moved close to the pads and close to each other. Instead of placing power and ground vias on...
7308749 Production method for dielectric resonator device  
A method of forming a dielectric resonator from an inner-conductor-formed hole that has a substantially rectangular or substantially elliptical cross section in a direction perpendicular to the...
7307020 Membrane 3D IC fabrication  
General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and...
7302757 Micro-bumps to enhance LGA interconnections  
An improved Land Grid Array interconnect structure is provided with the use of small metal bumps on the substrate electrical contact pad. The bumps interlock with segments of the fuzz button...
7302756 Bond finger on via substrate, process of making same, package made thereby, and method of assembling same  
A wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the in the wire-bonding substrate. A package includes a die that...
7297563 Method of making contact pin card system  
A compliant contact pin contactor card method for making is provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly...
7296346 Plating buss and a method of use thereof  
The present invention relates generally to a plating buss design and method for minimizing short circuit problems in PCB panel singulation. More particularly, the invention encompasses a serpentine...
7293356 Method of fabricating printed circuit board having embedded multi-layer passive devices  
The present invention relates to a method of fabricating a printed circuit board having embedded multi-layer passive devices, and particularly, to a method of fabricating a printed circuit board...
7293355 Apparatus and method for making circuitized substrates in a continuous manner  
Apparatus and method for making circuitized substrates using a continuous roll format in which layers of conductor and dielectric are fed into the apparatus, bonded, and passed on to other nearby...
7293353 Method of fabricating rigid flexible printed circuit board  
Disclosed is a method of fabricating rigid flexible PCBs. In the method, a self-detachable adhesive tape is used to separate a wafer and a substrate from each other in the course of conventionally...
Matches 1 - 50 out of 1053 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >