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7617598 |
Method of making a thermally isolated via structure
This document discusses, among other things, a method including providing a laminate having a first conductive layer, a second conductive layer and an insulator between the first and second...
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7615709 |
Circuit board through-hole impedance tuning using clearance size variations
A circuit board comprises signaling through-holes that pass through a plurality of layers, including signal trace and digital ground plane layers, and power reference plane layers. Clearances are...
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7614147 |
Method of creating contour structures to highlight inspection region
An integrated circuit has a wiring layer below an insulator layer. A pad comprises a conductive material that is on the insulator layer. The pad has a wirebond connection region and a probe pad...
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7614146 |
Method for fabricating circuit board structure
The present invention provides a circuit board structure and a method of fabricating circuit board structure the same, the circuit board structure consisting of a carrier board having a first...
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7612296 |
Visually inspectable surface mount device pad
A printed circuit board having one or more vias disposed in the surface area of a pad. The pad may serve as a connection point between the printed circuit board and another circuit board and is...
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7605075 |
Multilayer circuit board and method of manufacturing the same
A multilayer circuit board is provided that includes at least two insulating layers each sandwiched by circuit layers, thus having at least one internal circuit layer sandwiched by the at least two...
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7603772 |
Methods of fabricating substrates including one or more conductive vias
Substrate precursor structures include a substrate blank having at least one aperture extending substantially through the substrate blank. At least a portion of at least one conductive layer covers...
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7603771 |
Method of manufacturing a combined multilayer circuit board having embedded chips
A method of providing at least two multilayer circuit boards, combining the at least two multilayer circuit boards to form a combined multilayer circuit board, and forming multiple outer conductive...
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7600315 |
Method of manufacturing printed circuit board
This invention relates to a method of manufacturing a printed circuit board, in which a dummy metal frame enclosing the outer periphery of a product part is formed, thus simultaneously assuring the...
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7600313 |
Part cartridge for mounter device
A part cartridge for a mounter device used in a mounting process for mounting electronic parts on a substrate by heating the substrate to a predetermined temperature after the electronic parts are...
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7596864 |
Stacked module connector
A method for soldering a soft wire to a printed circuit board conveniently includes the following step: providing a bracket having a through hole and an enameled wire; fastening the enameled wire...
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7596863 |
Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein
A method of making a printed circuit board in which at least three substrates are aligned and bonded together (e.g., using lamination). Two of the substrates have openings formed therein, with each...
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7596862 |
Method of making a circuitized substrate
A method of making the circuitized substrate. The circuitized substrate includes a substrate having a substantially planar upper surface and a conductive layer positioned on the substantially...
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7594322 |
Methods of fabricating substrates including at least one conductive via
A method of fabricating a substrate is disclosed. Apertures are formed in a substrate blank. A conductive layer is formed on opposing surfaces of the substrate, as well as inside the apertures....
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7594321 |
Substrate-imprinting methods
A package includes at least one electronic component mounted on a substrate formed through imprinting. In an embodiment, the substrate may comprise conductive traces, vias, and patterns of lands on...
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7594320 |
Method of manufacturing printed wiring board
A solder resist comprising a thermosetting resin is printed on a surface of an insulating board ( 7 ) having a conductor circuit ( 6 ). The solder resist is then heat-cured to form an insulating...
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7594316 |
Method of manufacturing composite electronic component
A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block...
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7594105 |
Multilayer print circuit board
This invention effectively prevents potential fluctuation in the power supply terminal of a semiconductor device, that is, noise from flowing out to a main power supply wiring. A multilayer print...
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7591937 |
Method of fixing macro-objects to an electricity conducting- or semi-conducting surface by means of electrografting, surfaces thus obtained and applications thereof
The invention relates to a method of fixing macro-objects to an electricity conducting- or semi-conducting surface by means of electrografting. The invention also relates to the electricity...
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7591067 |
Thermally enhanced coreless thin substrate with embedded chip and method for manufacturing the same
A thermally enhanced coreless thin substrate with embedded chips, which mainly includes a patterned carrier metal layer, at least one chip, at least one dielectric layer and at least one wiring...
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7587816 |
Method of improving the stability of a circuit board
A printed circuit board includes a mounting hole for receiving a connector pin of either of a first SMC and a second SMC, and a signal line. The signal line is electrically connected to the...
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7587815 |
Resin-coated metal plate and method of drilling printed wiring board using the metal plate
A resin-coated metal plate used as a protective plate in drilling a printed wiring board has a metal plate and a resin film including a thermoplastic resin coated on at least one surface of the...
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7585419 |
Substrate structure and the fabrication method thereof
A substrate structure and the fabrication method thereof are provided herein. The present invention utilizes a laminate as the support of the package process and then removes the laminate after the...
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7584535 |
Method of manufacturing multi-layer wiring board
A method of manufacturing a multi-layer circuit wiring board, including simultaneously laminating a second flexible resin film on one surface of a first flexible resin film having a first wiring...
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7581314 |
Method of forming noble metal contacts
A semiconductor micro-electromechanical system (MEMS) switch provided with noble metal contacts that act as an oxygen barrier to copper electrodes is described. The MEMS switch is fully integrated...
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7581312 |
Method for manufacturing multilayer flexible printed circuit board
A method for manufacturing a multilayer FPCB includes the steps of: providing a first copper clad laminate, a second copper clad laminate and a binder layer; defining an opening on the binder...
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7574793 |
Process of forming a laminate ceramic circuit board
A circuit board assembly that makes use of a low-temperature co-fired ceramic (LTCC) substrate, and a process for producing the assembly. The substrate contains at least first and second regions...
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7571540 |
Production method of suspension board with circuit
A method of producing a suspension board with circuit, wherein after an insulating base layer is formed on a metal supporting board, a conductive pattern including a ground wiring pattern and a...
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7571536 |
Method of making capacitive/resistive devices
A method of making capacitive/resistive devices provides both resistive and capacitive functions. The capacitive/resistive devices may be embedded within a layer of a printed wiring board....
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7568278 |
Method of manufacturing inductor
A method for manufacturing an inductor using a system-in-package (SIP) includes forming a first penetration electrode in a silicon substrate; depositing an insulating film on a first surface of the...
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7565739 |
Method of making zinc-aluminum alloy connection
A conductor is at least partially exposed on the surface of a body. A wiring is formed for connection to the conductor. The conductor is made of a Zn—Al alloy. Heat is then applied to the...
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7565738 |
Method for manufacturing circuit device
A method for manufacturing a circuit device, which is suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, is provided. In a method for...
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7565725 |
Method for forming a variable capacitor
A method for forming a variable capacitor including a conductive strip covering the inside of a cavity, and a flexible conductive membrane placed above the cavity, the cavity being formed according...
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7562447 |
Method of manufacturing printed circuit board for fine circuit formation
Disclosed is a method of manufacturing a printed circuit board for fine circuit formation, in which an unnecessary metal layer formed on the upper portion of a circuit pattern is removed through...
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7552531 |
Method of manufacturing a printed wiring board having a previously formed opening hole in an innerlayer conductor circuit
A method of producing a printed wiring board comprising innerlayer conductor circuits among insulating layers and blind via-holes formed by irradiating laser beams from the outermost surface of the...
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7552530 |
Method of manufacturing a PCB having improved cooling
An improved cooling of an electronic component loaded to a printed circuit board, wherein the PCB comprises at its upper side at least one electronic component, and at least one heat conducting...
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7549222 |
Method of producing wiring board
A wiring base board and a method of producing thereof relate to a wiring base board of a multilayer structure, and make it possible to perform various kinds of transmission modes such as...
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7543376 |
Manufacturing method of flexible printed wiring board
Provided is an FPC, which comprises an insulating layer 2 , wiring layers 3 and 4 laminated above and under the insulating layer 2 , and a layer connection for connecting the wiring layers 3...
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7543375 |
Process for filling via hole in a substrate
A process for producing an electronic component The electronic component includes a base material equipped with a core material and having a conductor layer on at least one surface thereof; a via...
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7540082 |
Method for manufacturing printed wiring board
A printed wiring board having a through hole conductor formed on the surface of a through hole formed in a copper-clad laminate board, and on the surface of the copper-clad laminate board 1 in...
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7536780 |
Method of manufacturing wiring substrate to which semiconductor chip is mounted
The present invention discloses a method of manufacturing a wiring substrate to which a semiconductor chip mounted. The method includes the steps of forming a base, forming a peeling layer on the...
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7530167 |
Method of making a printed circuit board with low cross-talk noise
A method of making a printed circuit board in which the board includes a common power plane having dielectric layers on opposing sides thereof and a signal layer on each of said dielectric layers,...
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7530163 |
Electronic parts packaging structure and method of manufacturing the same
There is provided a electronic parts packaging structure that includes a mounted body on which an electronic parts is mounted, the electronic parts having a connection pad, which has an etching...
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7523550 |
Process to open connection vias on a planarized surface
A method for forming a via in an alumina protective layer on a structure such as a magnetic write head for use in perpendicular magnetic recording. A structure such as a magnetic pole, and or...
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7523546 |
Method for manufacturing a composite layer for an electronic device
A method is provided for manufacturing an electronically functional structural component adapted to integrate a plurality of electronic functions into a laminate cover, layer, and/or laminate...
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7523545 |
Methods of manufacturing printed circuit boards with stacked micro vias
Methods of manufacturing printed circuit boards having circuit layers laminated with stacked (or staggered) micro via(s). Aspects of embodiments of the present invention are directed to a method of...
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7521779 |
Roughened printed circuit board
A multi-layer structure including a base insulating layer and a thin metal film layer (seed layer) is prepared. A plating resist layer is formed to have a prescribed pattern on the upper surface of...
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7520054 |
Process of manufacturing high frequency device packages
A high frequency device packaging method is described wherein an insulating material, attached to a fiat surface, is selectively etched and the etched insulating material is plated with a...
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7517730 |
Coreless substrate and manufacturing method thereof
The present invention discloses a method for manufacturing a coreless substrate. The method comprises the steps of (a) forming an insulating layer on one side of a metal sheet; (b) forming a via...
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7516545 |
Method of manufacturing printed circuit board having landless via hole
Disclosed is a method of manufacturing a printed circuit board having a landless via hole. Specifically, this invention provides a method of manufacturing a printed circuit board having a landless...
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