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9038266 Multilayer printed wiring board and method for manufacturing multilayer printed wiring board  
A multilayer printed wiring board including a first interlayer resin insulation layer, a first conductive circuit formed on the first interlayer resin insulation layer, a second interlayer resin...
9032615 Method for forming an electrical connection between metal layers  
A method forms an electrical connection between a first metal layer and a second metal layer. The second metal layer is above the first metal layer. A first via is formed between the first metal...
9029712 Printed circuit board and method of manufacturing the same  
Read wiring traces and write wiring traces are formed on an insulating layer that is formed on a support substrate. Connection terminals that are electrically connectable to external circuits are...
9030199 Magnetoresistance sensor and fabricating method thereof  
An apparatus of a magnetoresistance sensor consisting of a substrate, a conductive unit on the substrate, and a magnetoresistance structure on the conductive unit is provided. The conductive unit...
9027240 Method for producing a flexible circuit configuration  
For the production of a flexible circuit configuration, which contains a layer sequence and a film connected thereto, for the creation of through contacts through the film up to terminal surfaces...
9027238 Multilayered printed circuit board and method for manufacturing the same  
A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a...
9021692 Method for manufacturing a printed wiring board  
A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a...
9021693 Method of manufacturing printed circuit board with metal bump  
A method of manufacturing a printed circuit board, including: applying a dry film on a carrier and then patterning the dry film to form holes for forming metal bumps; forming an upper circuit...
9015936 Method for manufacturing IC substrate  
A method for manufacturing an IC substrate includes following steps: providing a roll of double-sided flexible copper clad laminate; converting the roll of double sided flexible copper clad...
9012785 Flexible multilayer substrate  
A flexible multilayer substrate includes a multilayer body including a plurality of laminated resin layers. The multilayer body includes an innermost surface, which is a surface on an inner side...
9003654 Method for metalizing blind vias  
A method for metalizing at least one blind via formed in at least one substrate, including: a) arranging at least one solid portion of electrically conductive material in the blind via, b)...
9003652 Method of fabricating a circuit board  
The characteristic impedance of a surface pad is manipulated by reticulating the pad and filling the spaces with a dielectric material, providing an inductive element in the coupling of the...
8997343 Method for manufacturing multilayer printed circuit board  
A method for manufacturing multilayer printed circuit board includes step below. A metal substrate is provide, the metal substrate includes a number of substrate unit. A first insulating layer is...
8997344 Method for manufacturing interposer  
A method for manufacturing an interposer including forming a first insulating layer comprising an inorganic material on a supporting substrate, forming a first wire in the first insulating layer,...
8997341 Substrate for mounting semiconductor chip and method for producing same  
It is an object of the invention to provide a method for producing a substrate for mounting a semiconductor chip, that can reduce bridging and allows excellent wire bondability and solder...
9000307 Structure, circuit board, and circuit board manufacturing method  
The disclosed structure (10) is provided with: at least three conductors (111, 131, 151) which face one-another; a through-via (101) which passes through each of the conductors (111, 131, 151);...
8991039 Method for manufacturing flexible multilayer electrical articles with improved layer adhesion  
A process for manufacturing a multilayer article, the article comprising two crosslinked semiconductive layers separated by and bonded to an insulation layer, the semiconductive layers formed from...
8991042 Method for fabricating semiconductor device  
A method for fabricating a semiconductor device includes (a) depositing an insulating film on a semiconductor substrate; (b) forming a recess in the insulating film; (c) depositing a conductive...
8991043 Manufacturing method of a circuit board structure  
A circuit board structure includes a core circuit structure, a first and a second dielectric layers, a first and a second conductive blind via structures, a third and a fourth patterned circuit...
8978216 Method for forming an acoustical stack for an ultrasound probe  
A method for forming an acoustical stack for an ultrasound probe comprises partly dicing a single crystal piezoelectric material to form single crystal pieces that are partly separated by a...
8978247 TSV fabrication using a removable handling structure  
A method for forming an interconnection element having metalized structures includes forming metalized structures in an in-process unit that has a support material layer with first and second...
8970242 Method for manufacturing probe card, probe card, method for manufacturing semiconductor device, and method for forming probe  
Provided is a method for manufacturing a probe card which inspects electrical characteristics of a plurality of semiconductor devices in batch. The method includes: a step of forming a plurality...
8966746 Method of fabricating cavity capacitor embedded in printed circuit board  
A method of fabricating a cavity capacitor embedded in a printed circuit board including two conductive layers to be used as a power layer and a ground layer, respectively, and a first dielectric...
8966750 Method of manufacturing a multilayered printed wiring board  
A method of manufacturing a multilayered printed wiring board including forming a multilayered core substrate including insulation layers and one or more stacked via structures formed through the...
8959760 Printed wiring board and method for manufacturing same  
A method for manufacturing a printed wiring board, including providing a support board having a metal foil secured to the support board, forming a resin insulation layer on the metal foil, forming...
8959733 Method of manufacturing liquid transporting apparatus  
There is provided a method of manufacturing liquid transporting apparatus including: providing a channel unit; providing a piezoelectric actuator having a first and second active portion...
8957325 Optimized via cutouts with ground references  
The present disclosure relates to a method of optimizing via cutouts, including selecting a geometry of a via cutout on a first ground reference layer adjacent to a first differential trace, the...
8955215 High performance surface mount electrical interconnect  
A method of forming an interconnect assembly including forming a substrate with a plurality of through holes extending from a first major surface to a second major surface. A plurality of recesses...
8955218 Method for fabricating package substrate  
A package substrate includes a core layer, a first dielectric layer, a second circuit pattern, a first solder mask and an insulating layer. A first circuit pattern is disposed on a first surface...
8950063 Methods of manufacturing printed circuit boards with stacked micro vias  
A method of manufacturing at least a portion of a printed circuit board. The method includes: applying a lamination adhesive on a first plural-layer substrate that includes a plurality of circuit...
8952260 Circuit boards defining regions for controlling a dielectric constant of a dielectric material  
In some embodiments, a printed circuit board, configured to be coupled to electronic components, includes a first material portion and any number of second material portions. Each second material...
8935851 Method for manufacturing a circuit board  
A method of manufacturing a circuit board includes: forming a first through hole in a core material; forming a first conductive film on an inner wall of the first through hole; forming an...
8935850 Method of manufacturing printed wiring board  
A method for manufacturing a printed wiring board includes forming a removable layer on a support substrate, forming an interlayer resin insulation layer on the removable layer, forming a...
8931169 Methods of fabricating components for microelectronic devices  
Methods of fabricating components for microelectronic devices are described herein. For example, one embodiment is directed toward a method of fabricating a memory cell on a workpiece having a...
8931168 Method for manufacturing multilayer printed wiring board  
A method for manufacturing a printed wiring board includes preparing a core substrate having a first surface and a second surface on the opposite side of the first surface, forming on the...
8929090 Functional element built-in substrate and wiring substrate  
An object of the present invention is to propose a functional element built-in substrate which enables an electrode terminal of a functional element to be well connected to the back surface on the...
8925192 Printed wiring board and method for manufacturing the same  
A method for manufacturing printed wiring board includes irradiating laser on first surface of substrate such that first opening portion having first opening on the first surface and inner...
8925194 Flex-rigid wiring board and method of manufacturing the same  
A method of manufacturing a flex-rigid wiring board includes disposing a non-flexible substrate and a flexible board side by side in the horizontal direction of the substrate and board such that...
8925193 Methods for fabricating circuit boards  
A method, and apparatus resulting from the method, for fabricating a circuit board suitable for mounting electronic components. The method includes drilling a plurality of through-holes in a...
8918990 Method of forming a solderless printed wiring board  
A method of forming solder-less printed wiring boards includes attaching a electronic components to a workpiece using an adhesive material. A mold material is added to partially cover the...
8918991 Process for providing electrical connections with reduced via capacitance on circuit boards  
The present invention relates to circuit boards and, more specifically, a process for providing electrical connections with reduced via capacitance on circuit boards. In one embodiment, the...
8918992 Circuit layer manufacturing method  
A circuit layer manufacturing method is applied to a portable computer. The portable computer includes a front bezel, a display module, and a back cover. The front bezel is connected to the back...
8910376 Systems and methods for forming an end of an elongated member of an electrical stimulation system  
A method for forming a lead or lead extension having an arrangement of elongated conductors disposed in a body of a lead or lead extension includes ablating a plurality of spaced-apart channels in...
8904632 Method to make a multilayer circuit board with intermetallic compound and related circuit boards  
A method is for making a multilayer circuit board from circuit board layers, each including a dielectric layer and conductive traces thereon including a first metal. The method includes forming a...
8904631 Method of fabricating an interconnect device  
An interconnect device and a method for fabricating same. An embodiment of the invention includes sequential steps of providing a flexible substrate, forming vias through the flexible substrate,...
8898895 Method for producing multilayer substrate and desmearing method  
A method for producing a multilayer substrate involves: a base-material pretreatment step in which a hole forming step and a metal adhesion step are performed in no particular order, the hole...
8898891 Method for fabricating a printed circuit board having differential trace profile  
Circuit boards and methods for their manufacture are disclosed. The circuit boards carry high-speed signals using conductors formed to include lengthwise channels. The channels increase the...
8898896 Method of making a connection component with hollow inserts  
The invention relates to a method for making a connection component that comprises a set of conducting inserts to be electrically connected with another component, said inserts being hollow.
8893380 Method of manufacturing a chip embedded printed circuit board  
The present invention relates to a chip embedded printed circuit board and a manufacturing method thereof and provides a chip embedded printed circuit board including: an insulating layer having...
8881381 Method of manufacturing printed circuit board  
Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier...