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6817093 |
Electronic component and manufacturing method therefor
A plurality of surface-mounting components are mounted on a mother printed-circuit board provided with component-connecting electrodes, engagement holes, and case-fixing electrodes provided inside...
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6813829 |
Method for removing punched fragments and a method for producing an article by punching
In a method for removing punched fragments in a workpiece formed using a punch and a die, the workpiece, which is tightly attached to a stripper, is lifted without extracting the punch from the...
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6807716 |
Method of manufacturing a composite vibrator
The present invention provides a composite vibrator that can maintain high sensitivity even when miniaturized. The composite vibrator includes tuning bar vibrators having the same length and...
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6807730 |
Pad structure of semiconductor package
A pad structure for a semiconductor package is provided by forming solder lands at predetermined locations on a printed circuit board. First circular pad portions are formed protruding laterally...
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6807729 |
Method of manufacturing metal foil
The present invention provides a method of manufacturing a metal foil laminated product including the steps of forming a bonding layer containing a thermosetting resin on a lower wiring layer, a...
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6803528 |
Multi-layer double-sided wiring board and method of fabricating the same
Disclosed herein are multi-layer double-sided wiring boards having an insulating layer with an opening, conductive layers on both surfaces of the insulating layer and on the inside of the opening,...
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6802120 |
Method of manufacturing a printed wiring board having a non-through mounting hole
A method of manufacturing a printed wiring board, enabling insertion components to be mounted on both sides thereof, including: a) providing first and second copper-clad laminates, including plated...
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6799369 |
Printed circuit board and method for producing the same
A printed circuit board of the present invention is formed of an electrical insulating base material with through holes that are formed in a thickness direction of the electrical insulating base...
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6800211 |
Method for removing voids in a ceramic substrate
A method for removing voids in a ceramic substrate includes steps of preparing a ceramic substrate and defining holes of different dimensions in the ceramic substrate, sputtering a titanium/copper...
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6800232 |
PCB support plate method for PCB via fill
Methods for improved electronic substrate via and thru-hole filling, particularly through the use of drilled stand-offs formed by control-depth drilling oversized non-thru-holes and the use of...
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6798665 |
Module and method of manufacturing the module
A high-frequency module has a signal electrode provided on a cut side thereof, and is arranged to produce no burrs. The module includes a substantially four-sided substrate, a recess at a cut side...
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6796028 |
Method of Interconnecting substrates for electrical coupling of microelectronic components
Interconnecting substrates used in the manufacturing of microelectronic devices and printed circuit assemblies, packaged microelectronic devices having interconnecting substrates, and methods of...
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6791035 |
Interposer to couple a microelectronic device package to a circuit board
An interposer to couple a microelectronic device package to a motherboard is formed from a PCB substrate. Multiple via holes are drilled through a copper-clad PCB substrate and then coated inside...
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6789298 |
Finishing method for producing thin-laminate panels
Provided are thin-laminate panels (i.e., thin-laminate panels having dielectric layers of about 0.006 inches or less and conductive layers on either side of the dielectric layer), wherein the edges...
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6787443 |
PCB design and method for providing vented blind vias
An apparatus and method for providing a vented blind via in pad of a printed circuit board (PCB). A vent in the blind via in pad to allow gases formed during reflow soldering to escape from the...
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6782610 |
Method for fabricating a wiring substrate by electroplating a wiring film on a metal base
The present invention relates to a method for fabricating a wiring substrate by forming an insulating film on a metal base having openings on the metal base at positions corresponding to metal...
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6779262 |
Method for manufacturing a multilayer printed circuit board
A method for manufacturing a multilayer printed circuit board includes providing a core board, a composite foil including a carrier foil, a functional copper foil and a non-reinforced thermosetting...
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6779263 |
Method for molding a polymer surface that reduces particle generation and surface adhesion forces while maintaining a high heat transfer coefficient
The invention provides a system and apparatus by which a workpiece pad is supplied to support workpieces being implanted in a rotating or spinning batch implanter process disk. The workpiece pad...
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6775907 |
Process for manufacturing a printed wiring board
The present invention teaches a simplified process for fabricating high density printed wiring boards using a semi-additive process. Steps required to achieve this objective include adhering an...
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6776691 |
Polishing/cleaning method as well as method of making a wiring section using a polishing apparatus
A polishing apparatus that can effectively and efficiently remove potassium and other alkaline metals comprises integrally a polishing unit for polishing an object by means of a polishing agent and...
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6772515 |
Method of producing multilayer printed wiring board
To provide a method of producing a multilayer printed wiring board that can be intended to have low-profile, light-weight and high-density wiring of a printed wiring board, and a multilayer printed...
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6774316 |
Wiring board and production method thereof
The present invention aims to provide a wiring substrate highly reliable in insulation and connection and a method for manufacturing the wiring substrate. A wiring substrate having two or more...
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6766576 |
Method for producing a double-sided wiring board
The method for producing a printed wiring board comprising the steps of preparing a conductive substrate, forming an insulating layer on one surface of the said substrate, forming at least one via...
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6763581 |
Method for manufacturing spiral contactor
A spiral contactor for establishing an electric connection with a semiconductor device or an electronic part including a solder ball includes a spiral probe having a spiral shape, as viewed from...
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6763575 |
Printed circuit boards having integrated inductor cores
A process for forming printed circuit boards having integral inductor cores. According to the invention, a thin nickel layer is formed on a copper foil. The copper foil structure is then laminated...
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6757968 |
Chip scale packaging on CTE matched printed wiring boards
A circuit assembly has a heat sink assembly and a chip scale package assembly. The chip scale package assembly has an integrated circuit die coupled to a first printed wiring board. The heat sink...
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6757947 |
Method for manufacturing piezoelectric actuators and a piezoelectric actuator
A method for a parallel manufacturing of a plurality of piezoelectric actuators and a corresponding piezoelectric actuator utilize a plurality of thin foils composed of an unfired piezoelectric...
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6757967 |
Method of forming a chip assembly
A chip mounting assembly is provided which includes a dielectric substrate having at least one integrated circuit (I/C) chip mounted thereon. An electrically conductive cover plate is in contact...
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6754952 |
Process for manufacturing multiple layer wiring substrate onto which thin film capacitor is incorporated
A process facilitates manufacturing a multiple layer wiring board having therein a thin-film capacitor The process includes: forming a metallic film layer having a barrier metal layer and a metal...
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6754951 |
Method of drilling a circuit substrate
A method of drilling a circuit substrate. A circuit substrate including at least a core layer and a metal layer covering one or both surfaces of the core layer is provided. A half-etching process...
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6748652 |
Circuit board and method of manufacturing the same
Through holes formed in an electrical insulating substrate having adhesive layers on its both surfaces are filled with a conductor. Then, supporting bases having wiring layers with a predetermined...
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6745464 |
Removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit board
Removable mask films 303 are formed on the both sides of the substrate having the adhesive layer 302 by applying and drying a resin varnish 304 including a ultraviolet-absorbing agent, and...
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6745463 |
Manufacturing method of rigid flexible printed circuit board
The present invention relates to a manufacturing method of rigid flexible printed circuit board. Inner layer circuit are etched on two side of a flexible basefilm and a flat cable for connecting...
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6742247 |
Process for manufacturing laminated high layer count printed circuit boards
The present invention provides a number of techniques for laminating and interconnecting multiple high-layer-count (HLC) substrates to form a multilayer package or other circuit component. A solder...
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6739048 |
Process of fabricating a circuitized structure
A process of fabricating a circuitized structure is provided. The process includes the steps of providing an organic substrate having circuitry thereon; applying a dielectric film on the organic...
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6739041 |
Circuit board and a method for making the same
A method 10, 90 for making a multi-layer electronic circuit board 82, 168 including the steps of forming at least one protuberance 15, 100 upon an electrically conductive member 12, 92 and...
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6739028 |
Molded high impedance surface and a method of making same
A high impedance surface and a method of making same. The surface includes a molded structure having a repeating pattern of holes therein and a repeating pattern of sidewall surfaces, the holes...
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6735857 |
Method of mounting a BGA
Solder paste is applied beforehand onto through-hole upper lands (or solder) of a printed circuit board and attachment is effected by inserting solder joined to the BGA-side pads into the holes of...
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6732428 |
Method for increasing electronic component density on an electronic circuit board
A technique for increasing electronic component density on circuitry boards is disclosed. In one embodiment, the technique is realized as a method for increasing electronic component density on an...
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6729001 |
Method for making a sonoprobe
A process for the fabrication of a multielement acoustic probe. A flexible circuit having conducting tracks on at least one of its sides is used. This circuit is joined to a plate of piezoelectric...
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6722031 |
Method for making printed circuit board having low coefficient of thermal expansion power/ground plane
Conductive materials that have low coefficients of thermal expansion (CTEs) and that are used for power and ground planes are disclosed. Fibrous materials (such as carbon, graphite, glass, quartz,...
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6718631 |
Process for producing a flexible wiring board
Process for producing a flexible wiring board by etching a metal foil halfway to form a thick film part and a thin film part, etching the thin film part in order to form a first wiring film having...
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6715204 |
Printed wiring board and method for producing the same
A printed circuit board and a method for manufacturing the same that facilitates the formation of an upper surface pattern and prevents a lower surface metal foil from being damaged when forming a...
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6711813 |
Method for fabricating a thin film build-up structure on a sequentially laminated printed circuit board base
Method and apparatus of fabricating a core laminate Printed Circuit Board structure with highly planar external surfaces is provided. A pre-formed flat material including a first resinous...
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6711802 |
Method of manufacturing multi-core ferrule
A method of manufacturing a multi-core ferrule, in which method a plurality of flat-surface metal sheets 2 containing a plurality of apertures 1 of the same size are laminated and fixed...
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6711812 |
Method of making metal core substrate printed circuit wiring board enabling thermally enhanced ball grid array (BGA) packages
A method of making a thermally enhanced BGA substrate in which a metal (copper) core, has dielectric layers applied to each side thereof and conductive through-core build-up vias are provided....
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6711807 |
Method of manufacturing composite array structure
The present invention provides a method of manufacturing a composite array structure that comprises a plurality of elements of an electrically conductive composite material interconnected by at...
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6711814 |
Method of making printed circuit board having inductive vias
A method for increasing the impedance of a via for providing a conductive path through a printed circuit board is disclosed. The method comprises the steps of forming a conductive pad on the...
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6708405 |
Method for producing an electrically conducting connection
A method is described for producing a conducting connection through insulating layers by way of a contact hole and conducting materials with which the contact hole is filled. The method permits the...
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6709803 |
Process for producing printed wiring board
After forming first catalyst cores on the surfaces of adhesive layers of an insulating substrate, a plating resist is patterned. The insulating substrate is treated with an aqueous solution...
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