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7157364 |
Method for forming metal contacts on a substrate
Metal traces and solder bump pads are formed on a semiconductor substrate by way of a semiconductor template that has been micromachined to receive solder paste material. The solder paste material...
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7155815 |
Electrical contacting method
A method for contacting printed conductors terminating at the edge of a circuit board with printed conductors of a MID component includes: on a panel which includes the circuit board, producing the...
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7155820 |
Method for manufacturing printed circuit board
The present invention provides a method of manufacturing a printed circuit board, which includes preparing a dielectric substrate, coating surfaces of the dielectric substrate, filling a via hole...
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7155821 |
Techniques for manufacturing a circuit board having a countersunk via
A technique for manufacturing a circuit board involves obtaining a plane-shaped structure having layers of circuit board material integrated together, and carving a hole within the plane-shaped...
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7152312 |
Method for transmitting current through a substrate
A method for transmitting high-frequency current through a substrate is provided. The method comprises receiving the high-frequency current at a via passing through at least one conductive plane...
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7152318 |
Method for manufacturing built-up printed circuit board with stacked type via-holes
A built-up printed circuit board includes stacked micro via-holes, each of which is provided for interconnection between layers in the printed circuit board, and in each of which a filling...
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7152319 |
Method of making high speed circuit board
A multilayered PCB including two multilayered portions, one of these able to electrically connect electronic components mounted on the PCB to assure high frequency connections therebetween. The PCB...
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7146719 |
Multilayer circuit component and method for manufacturing the same
A multilayer circuit component and a method for manufacturing the same, in which the difference of the amounts of baking shrinkages between each of the glass-containing layers is small, and the...
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7143509 |
Circuit board and processing method thereof
A circuit board essentially comprises a first laminated structure, at least a first plated through hole, at least a second laminated structure, a middle dielectric layer and at least a second...
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7141742 |
Alternating voided areas of anti-pads
A printed circuit board includes a first conductive plane and a second conductive plane substantially parallel to the first conductive plane. The printed circuit board includes a via signal barrel...
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7140103 |
Process for the production of high-density printed wiring board
Process for producing a high-density printed wiring board, comprising:
providing an ultrathin-copper-foil-clad board having a hole and outermost copper foil thickness of 5 μm or less,...
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7140104 |
Method of producing circuit component built-in module with embedded circuit component
A circuit component built-in module can be produced by filling a conducting material in through holes of a sheet-like member, stacking the sheet-like member and a metal foil on a circuit component...
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7131195 |
Method for forming metal contacts on a substrate
Solder bump pads are formed on a semiconductor substrate by way of a semiconductor template that has been micromachined to receive solder paste material. The solder paste material is then formed...
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7127812 |
Process for producing a multi-layer printed wiring board
A board 20 is provided with a Cu film 30 as a conformal mask, in which are formed a register mark 30 b and an opening 3 a through which a via hole is formed. A camera senses this register...
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7124503 |
Method for forming multilayer circuit board
A method for forming connections within a multi-layer electronic circuit board 10 which allows for the selective, efficient, and reliable interconnection between at least one conductive layer and...
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7121000 |
Method for manufacturing multilayer wiring board
A method of manufacturing a multilayer wiring board according to the present invention comprises the step of heating and pressurizing a stacked product to be integrated in a state in which a...
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7117587 |
Method for fabricating a substrate, including a plurality of chip package substrates
A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on...
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7119030 |
Process for lining a surface using an organic film
The present invention relates to a method for cladding a simple or complex surface, electrically conducting or semiconducting, by means of an organic film from at least one precursor of said...
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7114251 |
Method of producing of circuit board; for semiconductor device
A method of production of a circuit board able to prevent peeling of a conductive layer during polishing of the conductive layer including the steps of forming at least holes in one surface of a...
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7114252 |
Large scale simultaneous circuit encapsulating apparatus
A plurality of individual circuits are formed on a substrate. Each of the individual circuits is formed with electrical contacts. A spacer is sealed onto the substrate, the spacer peripherally...
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7107666 |
Method of manufacturing an ultra-miniature magnetic device
An ultra-miniature magnetic device generally comprises a conductive winding and a magnetic core. The conductive winding includes an upper conductor and a lower conductor. The magnetic core is of an...
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7103971 |
Process for manufacturing a circuit board
A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the...
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7100275 |
Method of producing a multi-layered wiring board
Method of producing a multi-layered wiring board comprising the steps of subjecting the photosensitive resin to exposure- and development-treatment to form the holes having a predetermined size and...
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7102217 |
Interposer substrates with reinforced interconnect slots, and semiconductor die packages including same
A board-on-chip (BOC) semiconductor package includes a multisegmented, longitudinally slotted interposer substrate through which an elongate row of die bond pads is accessed for electrical...
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7100277 |
Methods of forming printed circuit boards having embedded thick film capacitors
A method of forming printed wiring boards having embedded thick-film capacitors includes covering capacitor layers with a protective coating prior to etching to prevent etching solutions from...
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7096548 |
Manufacturing method of integrated capacitor
Disclosed is a manufacturing method of an integrated capacitor including: forming a hole in a semiconductor substrate; depositing a dielectric film on an inner face of the formed hole;...
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7096555 |
Closed loop backdrilling system
A multilayer circuit board is provided with at least one signal layer, at least one feedback layer, and at least one dielectric layer positioned between the signal layer and the feedback layer. The...
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7098132 |
Method of manufacturing flexible wiring board
In the present invention, a reference conductive layer and a first surface conductive layer are respectively provided on a surface and a back face of a first base film. The first base film includes...
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7093358 |
Method for fabricating an interposer
An interposer including a fence that receives and aligns a semiconductor device, such as a flip-chip type semiconductor device, with an interposer substrate. The fence may include edges that are...
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7093356 |
Method for producing wiring substrate
A wiring substrate with bumps protruding from a surface of the substrate covers one side of a metallic base with an electrical insulating film thereon, having open holes exposing the base, etching...
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7089660 |
Method of fabricating a circuit board
A circuit board with an asymmetrical structure and a method for fabricating the same are proposed. A core circuit board is provided, with a build-up structure being formed on a side of the core...
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7087991 |
Integrated circuit package and method of manufacture
An integrated circuit package and a method of manufacturing the package. A silicon chip is attached to the surface of a substrate or attached to the bottom surface of a cavity in the substrate so...
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7088003 |
Structures and methods for integration of ultralow-k dielectrics with improved reliability
An improved back end of the line (BEOL) interconnect structure comprising an ultralow k (ULK) dielectric is provided. The structure may be of the single or dual damascene type and comprises a dense...
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7083901 |
Joining member for Z-interconnect in electronic devices without conductive paste
A layer for use in a modular assemblage for supporting ICES is formed with metal contacts for assembly by making a sandwich of metal interconnect members between two layers of dielectric; drilling...
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7085146 |
Flanged terminal pins for DC/DC converters
A dc/dc converter is mounted to a printed circuit board with rigid terminal pins which extend into a converter substrate to provide electrical connection to circuitry on the substrate. A terminal...
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7080448 |
PCB with inlaid outer-layer circuits and production methods thereof
Method for fabricating printed circuit board employing optical engraving and metallization techniques to form a pre-designated circuit pattern on a transfer plate, wherein the pattern is...
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7080446 |
Wiring board sheet and its manufacturing method, multilayer board and its manufacturing method
A wiring board sheet which enables the miniaturization of a wiring board by mounting electric components ( 10 ) in an insulation layer ( 4 ) to increase the quantity of mounting electric...
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7077656 |
Rotating electronic part and method of manufacturing the same
A rotating electronic part has a board; a case composed of insulating resin; a supporting projection made of resin integrally structured with the case; and a rotating member. The board is provided...
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7076870 |
Manufacturing process for a surface-mount metal-cavity package for an oscillator crystal blank
A surface-mount package for an oscillator crystal blank is made from a metal sheet substrate. Half-etched cavities are formed on one side of the sheet. The half-etched cavities are filled in with...
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7076869 |
Solid via layer to layer interconnect
The present invention relates to a method for providing an interconnect between layers of a multilayer circuit board. A first via extending through a total thickness of a first layer is formed. The...
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7073253 |
Interconnect for electrically connecting a multichip module to a circuit substrate and processes for making and using same
An interconnect for attaching a module such as a PCB or a multi-chip module to a circuit substrate comprises a member elongated in a longitudinal direction. The member has at least a first...
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7069646 |
Techniques for reducing the number of layers in a multilayer signal routing device
Techniques for reducing the number of layers in a multilayer signal routing device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method wherein the...
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7069638 |
Air socket for testing integrated circuits
An electrical component testing device comprising a housing having at least one recess covered by a flexible membrane so as to form a chamber. A fluid passage extends through a portion of the...
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7069652 |
Method for producing laminated smart cards
A smart card is laminated from at least two layers of paper or film as a mounting material. A first of the layers is fitted with a semiconductor chip and a second layer has connecting contacts as...
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7069650 |
Method for reducing the number of layers in a multilayer signal routing device
A technique for reducing the number of layers in a multilayer signal routing device is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for reducing the...
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7062845 |
Conveyorized blind microvia laser drilling system
A laser drilling system for drilling blind vias in printed circuit board panels, multichip modules and chipscale packages with top and bottom surfaces and which include multiple dielectric polymer...
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7062849 |
Method for producing circuitry using molten metal droplets
A method for producing a circuitry includes steps of providing first coordinate data of at least one of positions, shapes and intervals of patterns of a first circuit, and jetting droplets of...
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7062850 |
Method of forming electrical interconnects having electromigration-inhibiting segments to a critical length
A method of forming an electrical conductor, comprising forming electrically conductive segments incorporating electromigration-inhibiting plugs. A row of windows is formed in a planar surface and...
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7059039 |
Method for producing printed wiring boards
A method for producing printed wiring boards comprises the steps of perforating through holes at predetermined positions in an adhesive insulator sheet, filling the through holes with a conductive...
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7059049 |
Electronic package with optimized lamination process
An electronic package and method of formation. A thermally conductive layer having first and second opposing surfaces is provided. A first dielectric layer is laminated under pressurization to the...
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