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7281305 |
Method of attaching a capacitor to a feedthrough assembly of a medical device
A method for attaching a capacitor to the feedthrough assembly of a medical device having a terminal pin comprises threading a first washer over the terminal pin, and placing a body of epoxy in...
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7281328 |
Method of fabricating rigid-flexible printed circuit board
The present invention is related to a method of fabricating a rigid-flexible printed circuit board. Specifically, this invention relates to a method of fabricating a rigid-flexible printed circuit...
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7278205 |
Multilayer printed wiring board and production method therefor
A multilayer printed wiring board (PWB) including via holes with satisfactory quality without defective shapes like swelling or recession on the end faces is provided. The multilayer PWB includes a...
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7278207 |
Method of making an electronic package
An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of...
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7275316 |
Method of embedding passive component within via
A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of...
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7269898 |
Method for making an edge intensive antifuse
An antifuse including a bottom plate having a plurality of longitudinal members arranged substantially parallel to a first axis, a dielectric layer formed on the bottom plate, and a top plate...
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7269891 |
High density, zero-height, free floating interconnect system
A system provides a zero interconnection height in a board-to-board interconnect while maintaining efficient space allocation for multiple axis connections by providing a floating connection in one...
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7263769 |
Multi-layered flexible print circuit board and manufacturing method thereof
A multi-layered flexible print circuit board comprising an insulating layer, a circuit layer formed on the front and back surfaces of the insulating layer and a hole connecting between the circuit...
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7263773 |
Method of manufacturing a bubble-jet type ink-jet printhead
A method of manufacturing a bubble-jet type ink jet printhead. The method includes forming resistive heater elements on a substrate, forming a patterned electrode layer on the resultant structure,...
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7257893 |
Efficient wafer processing technology
Consistent excess conductive material is provided for plated conductors in integrated circuit metallization, regardless of the size and depth of trenches/vias into which the conductive material is...
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7249411 |
Methods for mounting surface-mounted electrical components
Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component...
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7246434 |
Method of making a surface mountable PCB module
A printed-circuit board (PCB) module has co-planar solder pads on a bottom surface. The solder pads can be surface-mounted to pads on a main board, allowing the PCB module to be surface mounted...
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7243425 |
Printed wiring board and method of manufacturing the same
The present invention provides a printed wiring board in which there is no positional deviation between a blind via hole and a land and which enables high-density wiring design to be easily...
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7243424 |
Production method for a multilayer ceramic substrate
An object of the invention is to connect different dielectrics electrically to each other in the direction of main surface of a sheet in a multilayer ceramic substrate and to increase the degree of...
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7240429 |
Manufacturing method for a printed circuit board
A conductor pattern is formed on a resin film which is made of a thermoplastic resin. Each single-sided conductor pattern film has via-holes filled with an electrically conductive paste. A printed...
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7240430 |
Manufacturing methods for printed circuit boards
A method of forming a plurality of solid conductive bumps for interconnecting two conductive layers of a circuit board with substantially coplanar upper surfaces. The method comprises the steps of...
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7240425 |
Method of making an electrical connection to a conductor on an inner layer of a multi-layer printed circuit board
What is provided is a multi-layer PCB having a plurality of stacked dielectric layers, a conductor disposed on at least one of the plurality of dielectric layers, and a non-conductive via extending...
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7240431 |
Method for producing multilayer printed wiring board, multilayer printed wiring board, and electronic device
A plating resist film 2 is formed on a wiring board substrate 1 as a core material of a multilayer printed wiring board, then a through-hole 3 is formed, and through-hole conductor 4 is...
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7237334 |
Method of providing a printed circuit board using laser assisted metallization and patterning of a microelectronic substrate
A method of providing a printed circuit board, a printed circuit board formed according to the method, and a system comprising the printed circuit board. The method comprises: providing a...
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7231712 |
Method of manufacturing a module
A module includes a ceramic substrate, first and second electrodes provided on the ceramic substrate, a component having third and fourth electrodes connected to the first and second electrodes,...
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7228623 |
Process for fabricating a multi layer circuit assembly
Processes for fabricating a multi-layer circuit assembly and a multi-layer circuit assembly fabricated by such processes are provided. The process includes (a) providing a substrate at least one...
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7226807 |
Method of production of circuit board utilizing electroplating
A method of production of a circuit board utilizing electroplating which prevents signal reflection and noise due to unnecessary parts in the circuit patterns when electroplating to form circuit...
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7225540 |
Method for manufacturing an ink jet head
The step of forming an electrode for external connection applies a conductive resin ( 10 ) to one end portion of each of a plurality of ink chambers ( 26 ) within each of the ink chambers ( 26 )...
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7222420 |
Method for making a front and back conductive substrate
A front-and-back electrically conductive substrate includes a plurality of posts composed of a material that can be anisotropically etched and having an electrically conductive portion that has at...
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7223316 |
Method for manufacturing electronic component
A method for manufacturing an electronic component includes the steps of inserting tabs of a cover into through holes formed in a circuit board having mounting elements on the front surface...
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7222419 |
Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package
A method of fabricating a thermal conductive plug of a ceramic substrate of a multi-chip package. A plurality of conductive openings and thermal conductive openings are formed on green tapes. A...
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7220287 |
Method for tuning an embedded capacitor in a multilayer circuit board
Exemplary techniques for tuning the effective capacitance provided by an embedded capacitor are disclosed. The techniques may be realized by modifying one or more conductive features of one or more...
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7216422 |
Method of forming a capacitor assembly in a circuit board
A circuit board includes an assembly having first and second power reference plane layers, and an insulator layer between the first and second power reference plane layers. Discrete decoupling...
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7216424 |
Method for fabricating electrical connections of circuit board
A method for fabricating electrical connections of a circuit board is provided. The circuit board has a plurality of electrical connection pads thereon. A protective layer is applied on the circuit...
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7213334 |
Method for manufacturing double-sided flexible printed board
A double-sided flexible printed board is manufactured by: (a) forming a polyimide precursor layer on a metal layer; (b) forming an upper circuit layer on the polyimide precursor layer by a...
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7213335 |
Method for manufacturing printed circuit boards
The amount of time required to manufacture double-sided printed circuit boards that contain conductor bridges can be reduced. A method is provided which includes the steps of forming holes which...
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7213336 |
Hyperbga buildup laminate
A method and structure for forming an electronic structure that comprises a redistribution structure on a circuitized substrate. The redistribution structure includes N dielectric layers (N≧2)...
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7210224 |
Method for forming an antifuse
An antifuse including a bottom plate having a plurality of longitudinal members arranged substantially parallel to a first axis, a dielectric layer formed on the bottom plate, and a top plate...
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7197800 |
Method of making a high impedance surface
A high impedance surface and a method of making same. The surface includes a molded structure having a repeating pattern of holes therein and a repeating pattern of sidewall surfaces, the holes...
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7188413 |
Method of making a microelectronic package
A microelectronic element is formed from a structure including metal layers on top and bottom sides of a dielectric. Apertures are formed in the top metal layer, and vias are formed in the...
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7188410 |
Insertion of electrical component within a via of a printed circuit board
A printed circuit board and method for reducing the impedance within the reference path and/or saving space within the printed circuit board. In one embodiment of the present invention, a printed...
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7188411 |
Process for forming portions of a compound material inside a cavity
A process for forming portions of a compound material within an electronic circuit includes the formation of a cavity having at least one opening facing onto an access surface. The cavity...
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7188412 |
Method for manufacturing printed wiring board
Conductive paste containing tin particles and silver particles is packed in a substantially cylindrical via hole formed in a thermoplastic resin film that interposes between conductor patterns and...
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7185429 |
Manufacture method of a flexible multilayer wiring board
A flexible multilayer wiring board manufactured by laminating a metal foil via an insulating layer to cover the first layer circuit wiring formed on a conductive substrate, and a resist layer is...
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7181839 |
Method for producing a circuit board
After disposing metallic foils on either surface of a prepreg sheet of low compressibility having conducting holes filled with conductive paste, the prepreg sheet is compressed in a state of being...
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7178234 |
Method of manufacturing multi-layer printed circuit board
Through holes 36 are formed to penetrate a core substrate 30 and lower interlayer resin insulating layers 50 , and via holes 66 are formed right on the through holes 36 , respectively. Due...
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7178233 |
Process for producing a collapsed filled via hole
A process for producing a printed wiring board-forming sheet comprising a resin sheet having a through hole in the thickness direction and a metal chip inserted in the through hole. The sheet is...
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7174630 |
Method for fabricating connection terminal of circuit board
A method for fabricating connection terminals of a circuit board is proposed. The method involves providing a circuit board with connection pads thereon, forming an insulating layer with first...
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7174632 |
Method of manufacturing a double-sided circuit board
A circuit board including a desired number of electrically insulating layers and wiring layers laminated alternately, and an inner via hole for securing an electrical connection between the wiring...
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7168164 |
Methods for forming via shielding
Methods to shield conductive layer from via. A protective coating of insulating material is formed around a clearance hole in a conductive layer of a printed circuit board, so that the conductive...
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7169313 |
Plating method for circuitized substrates
A method of plating a circuit pattern on a substrate to produce a circuitized substrate (e.g., a printed circuit board) in which a dual step metallurgy application process is used in combination...
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7165321 |
Method for manufacturing printed wiring board with embedded electric device
A manufacturing method of a printed wiring board having an embedded electric device is as follows. A first resin film having an opening or a sheet member having a recess is piled with a plurality...
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7165322 |
Process of forming socket contacts
A socket contact formation process comprises forming a contact head from a conductive material, forming a contact body from a semiconductive material configured to be electrically conductive; and...
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7162796 |
Method of making an interposer with contact structures
A method of making an interposer having an array of contact structures for making temporary electrical contact with the leads of a chip package. The contact structures may make contact with the...
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7162794 |
Manufacturing method for multilayer ceramic elements
A multilayer integrated substrate includes breaking grooves arranged in a grid pattern so as to section the main surface of the substrate into a plurality of blocks, and also includes...
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