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5659951 |
Method for making printed circuit board with flush surface lands
A method for making a printed circuit board with a flush surface land begins by forming a multi-layer printed circuit board with a recess in a surface dielectric layer. Then, a hole is drilled into...
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5644107 |
Method of manufacturing a multilayer electronic component
In order to provide a multilayer electronic component which can reduce arrangement pitches for external electrodes, via holes filled up with conductive materials are provided in a mother laminate,...
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5640761 |
Method of making multi-layer circuit
Multilayer circuit assemblies are made by stacking circuit panels having contacts on their top surfaces, through conductors extending between top and bottom surfaces and terminals connected to the...
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5638598 |
Process for producing a printed wiring board
A process for producing a wiring board involves laminating a metal foil on both sides of an insulating substrate not completely cured, followed by pressing with heating; drilling holes in the...
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5634268 |
Method for making direct chip attach circuit card
A structure and a method is disclosed for making a laminated circuit carrier card for the purpose of making a Direct Chip Attached Module (DCAM) with low cost and high reliability. The carrier is...
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5630947 |
Method of making a multichip module comprising at least one thin film probe
The present invention relates to the preparation of a multichip module comprising one or more thin film probes. The thin film probes are useful in in situ probe testing of IC chips. An assembly...
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5630272 |
Method of forming contacts through bores in multi-layer circuit boards
A method and apparatus for creating through-connections in holes (5) in multi-layer printed circuit boards (2), in which the circuit board (2) is laid on a supporting frame (3) which leaves the...
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5619791 |
Method for fabricating highly conductive vias
The thickness uniformity of a plated metal layer inside a via hole can be enhanced by intersecting a conductive via with an insulating aperture before plating. The new via configuration improves...
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5621193 |
Ceramic edge connect process
A method for electrically connecting a surface conductor to an edge conductor on an intersecting side of a non-conductive substrate, includes the steps of forming a through-hole in the substrate,...
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5613296 |
Method for concurrent formation of contact and via holes
In order to facilitate the fabrication of wiring layers in integrated circuit devices, the conductive path interconnections between areas of conduction on three layers, the three layers being...
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5613858 |
Compact circuit board switching apparatus and associated methods
A circuit board structure is provided with a compact switching system for selectively connecting and disconnecting a pair of electrically conductive lead portions thereof. The switching system...
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5600884 |
Method of manufacturing electrical connecting member
An electrical connecting member, one surface of which is connected to a connecting section of a first electrical circuit member and another surface of which is connected to a connecting section of...
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5601678 |
Method for providing electrical interconnections between adjacent circuit board layers of a multi-layer circuit board
A method of forming a multi-layer circuit board which includes electrical interconnections between adjacent circuit board layers of the multi-layer board. A via hole is provided through a circuit...
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5600101 |
Multilayer electronic component and method of manufacturing the same
A multilayer electronic component has a substrate having a major surface with an area which can be utilized for mounting another electronic component thereon, and external electrodes arranged with...
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5588207 |
Method of manufacturing two-sided and multi-layered printed circuit boards
A two-sided printed circuit board including a base having a first surface, a second surface substantially parallel to the first surface, and a plurality of through-holes formed in the base; a first...
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5584956 |
Method for producing conductive or insulating feedthroughs in a substrate
A method for producing feedthroughs in a substrate having a front and back surface, wherein the substrate either has a hole or absorbs radiation at a given wavelength. The method includes selecting...
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5585602 |
Structure for providing conductive paths
A method for forming one or more conductive paths by providing a first pattern of pre-formed conductive elements and a second pattern of preformed conductive elements in a substrate and forming, at...
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5581877 |
Method of fabrication of a circuit board adapted to receive a single in-line module
A mounting for a single in-line package (SIP) module includes an elongated slot aperture for receiving an edge of the module. The module may be a circuit board or other electrical device and...
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5570504 |
Multi-Layer circuit construction method and structure
Multilayer circuit assemblies are made by stacking circuit panels having contacts on their top surfaces, through conductors extending between top and bottom surfaces and terminals connected to the...
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5570505 |
Method of manufacturing a circuit module
A direct chip attach module (DCAM) 10, comprises of one or more electronic components 30, electrically bonded to a printed circuit 40, on a substrate 20. The DCAM 10, is bonded to an electronic...
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5568682 |
Orthogonal grid circuit interconnect method
Methods for making low cost, high density circuits for multichip modules using a two-layer interconnect pattern. The circuit is comprised of parallel line segments on each side of the dielectric...
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5566448 |
Method of construction for multi-tiered cavities used in laminate carriers
A method of forming an I/C chip mounting module, and for mounting an I/C chip thereon, is disclosed. A rigid cap and substrate are provided. A bottomed cavity is routed in the cap, and the...
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5558928 |
Multi-layer circuit structures, methods of making same and components for use therein
A multi-layer circuit panel assembly is formed by laminating circuit panels with interposers incorporating flowable conductive material at interconnect locations and a flowable dielectric materials...
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5546654 |
Vacuum fixture and method for fabricating electronic assemblies
A method for fabricating an electronic assembly comprises attaching an insulative film to a frame and positioning at least one electronic component having a face with connections pads face down on...
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5546655 |
Method of applying flex tape protective coating onto a flex product
A flex or TAB product suitable for chip carrier applications wherein the flex reliability problems caused by copper dendrite growth and lead bending during power and thermal cycling are reduced by...
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5537740 |
Method of making printed circuit board
A blind hole extending from upper or surface wiring of a printed circuit board to inner or lower wiring, and having an opening larger than the bottom, is formed on a substrate, and a conductor...
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5531021 |
Method of making solder shape array package
A surface mount package for an electronic device has an array of solder shapes or structures projecting from the bottom surface of the package. The solder structures are cast in place on the...
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5526564 |
Method of manufacturing a multilayered printed wiring board
A multilayered printed wiring board includes a plurality of inner layer circuits, ground layers, first insulating layers, a second insulating layer, a surface layer circuit, and a parts mounting...
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5517758 |
Plating method and method for producing a multi-layered printed wiring board using the same
A dry sandblasting treatment for spraying abrasives onto a surface of an insulating resin layer, a chemical etching for chemically etching the surface, and a plating process for plating a...
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5511306 |
Masking of circuit board vias to reduce heat-induced board and chip carrier package warp during wavesolder process
A technique for minimizing heat-induced chipside solder joint fractures involving BGA (Ball Grid Array) components mounted on a multilayer printed circuit board when the board is passed through a...
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5509203 |
Method for manufacturing a sheet formed connector for inspection of an integrated circuit
It is the object of the invention to provide a method for manufacturing a sheet formed connector for inspecting an integrated circuit at the state of flip-chip bonding and at low pressure...
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5509200 |
Method of making laminar stackable circuit board structure
Method and apparatus for fabricating fine pitch pattern multilayer printed circuit boards involving laminar stackable board layers providing power distribution, signal distribution and capacitive...
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5502893 |
Method of making a printing wiring board
A metal cored printed wiring board and a manufacturing method therefor, in which an organic non-conductive layer will not separate from the metal core even in an environment of high temperature and...
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5499447 |
Method for manufacturing a printed circuit board having electrodes on end surface of substrate
The method for manufacturing a printed circuit board having an electrode on an end surface of a substrate has the steps of forming a hole at a predetermined position of a laminate board whose two...
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5499445 |
Method of making a multi-layer to package
A multi-layered package is disclosed that employs novel shielding techniques to improve high frequency performance of the package. Shield vias are placed near conductive vias to create a two-wire...
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5490325 |
Guarded printed circuit board islands
Low dielectric absorption component connection points are created on a printed circuit board by cutting apertures in the board surrounding the points, leaving only narrow stems still connecting the...
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5487218 |
Method for making printed circuit boards with selectivity filled plated through holes
Disclosed is a printed circuit board and a method of preparing the printed circuit board. The printed circuit board has two types of plated through holes. The first type of plated through holes...
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5481795 |
Method of manufacturing organic substrate used for printed circuits
A method of manufacturing an organic substrate used for printed circuits, which includes the steps of forming through-holes in a porous raw material provided with cover films and having compressive...
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5479703 |
Method of making a printed circuit board or card
A multi-layer printed circuit board or card including a plurality of circuitized power cores, the circuitized power cores include a layer of an electrically conductive material having a layer of...
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5478700 |
Method for applying bonding agents to pad and/or interconnection sites in the manufacture of electrical circuits using a bonding agent injection head
A method of applying bonding agents, such as solder pastes and conductive adhesives, to pad sites in the manufacture of electronic circuits uses a bonding agent injection head which includes a...
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5473813 |
Methods of forming electronic multi-layer printed circuit boards and/or cards and electronic packages including said boards or cards
A method of forming a multi-layer circuit board or card. The method includes the step of forming a plurality of conductive planes. The conductive planes include ground, signal, or power planes. At...
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5457881 |
Method for the through plating of conductor foils
Electrical connections in multilayer printed circuit boards made from conductor foils are preworked by producing preworked electrical connections on the conductor foils to be subsequently processed...
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5454161 |
Through hole interconnect substrate fabrication process
A high density through-hole interconnect with high aspect ratio vias is formed by sequentially forming layers of dielectric material on a previous dielectric layer. After each layer is formed, a...
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5451722 |
Printed circuit board with metallized grooves
A new and improved printed circuit board tool and method of making and using it, to produce three dimensional printed circuit boards having grooves with strongly bonded or laminated metallic pads...
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5443786 |
Composition for the formation of ceramic vias
A composition for the formation of vias on a ceramic substrate, the composition including (a) at least one powder containing copper, gold, silver, tungsten, molybdenum, nickel, palladium, platinum,...
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5440805 |
Method of manufacturing a multilayer circuit
In accordance with the present invention, a circuit assembly is manufactured in an additive process using at least one layer of a fluoropolymer composite material and a conductive material. The...
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5433000 |
Manufacturing method for a multilayer wiring board
A multilayer wiring board is constructed of insulating substrates and circuit patterns formed thereon. A manufacturing method produces the multilayer wiring board by forming a mask on one surface...
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5421083 |
Method of manufacturing a circuit carrying substrate having coaxial via holes
A method of manufacturing a circuit carrying substrate having one or more coaxial via holes. The center core or inner layer (330) of the circuit carrying substrate is a dielectric material that has...
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5419038 |
Method for fabricating thin-film interconnector
A three dimensional thin-film interconnector is fabricated by depositing a dielectric layer onto the surface of a substrate, depositing a layer of conductive material onto the dielectric layer to...
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5407864 |
Process for mounting a semiconductor chip and depositing contacts into through holes of a circuit board and of an insulating interposer and onto the chip
A process of manufacturing a semiconductor chip that has a connecting pad and is connected to a front side of a circuit board that has a conductive trace connected to a through-hole. An insulating...
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