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5832600 |
Method of mounting electronic parts
A method for manufacturing a leadless package type electronic part, the cost and the size of which can be reduced and which exhibits excellent reliability. The electronic part of a leadless package...
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5832599 |
Method of interfacing detector array layers
An alignment board for interfacing arrays of infrared detectors to a multi-layer module concerns an insulating board having a multiplicity of conductive vias with insulating sealing plugs and...
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5832598 |
Method of making microwave circuit package
A low cost microwave circuit package having high performance characteristics is disclosed. The package operates in the frequency range up to 90 GHz while requiring less space on the printed circuit...
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5832596 |
Method of making multiple-bond shelf plastic package
A method for forming a package for an integrated circuit in which a plurality of conduction paths are formed on a first board and on a second board. Holes are formed in the first board and the...
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5826330 |
Method of manufacturing multilayer printed wiring board
In a method of manufacturing a multilayer printed wiring board including an internal wiring circuit formed on a board, an insulating resin layer formed on the internal wiring circuit, a blind hole...
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5822856 |
Manufacturing circuit board assemblies having filled vias
Circuit boards are manufactured by forming a substrate with a dielectric surface, laminating a metal foil and a peelable film to the substrate, and forming holes in the substrate through the...
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5819401 |
Metal constrained circuit board side to side interconnection technique
A method of constructing a printed circuit board module and the module which comprises providing a substrate core having a first aperture extending therethrough and a pair of printed circuit...
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5802714 |
Method of finishing a printed wiring board with a soft etching solution and a preserving treatment or a solder-leveling treatment
The invention presents a method of finishing a printed circuit board by using a soluble chloride added to a soft etching solution, the soluble chloride provides a source of chloride ions that...
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5802713 |
Circuit board manufacturing method
A circuit board manufacturing method for manufacturing a printed circuit board with improved characteristics for machine soldering. The circuit board manufacturing method includes the addition of a...
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5802702 |
Method of making a device including a metallized magnetic substrate
The method of making a metallized magnetic substrate for devices including a magnetic component involves providing an unfired ceramic body. In one exemplary embodiment, the method further involves...
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5799393 |
Method for producing a plated-through hole on a printed-circuit board
A method for producing a plated-through hole on a printed-circuit board, whereby the printed-circuit board is initially bored, catalyzed, and patterned. The plated-through hole is then fashioned in...
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5784782 |
Method for fabricating printed circuit boards with cavities
A method for making a printed circuit with a cavity is disclosed. The method comprises the step of laying a sticker sheet on a first, metallized dielectric layer and laying a second, metallized...
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5784781 |
Manufacturing process for organic chip carrier
A manufacturing process for an organic chip carrier is disclosed which permits one to form a substantially bowl-shaped via hole in the substrate of the chip carrier, which makes it easy to deposit...
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5778529 |
Method of making a multichip module substrate
A multichip module substrate for use in a three-dimensional multichip module, and methods of making the same, are disclosed. The substrate comprises a thin film structure, for routing signals to...
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5776275 |
Fabrication of compact magnetic circulator components in microwave packages using high density interconnections
A magnetic circulator is incorporated into a multi-chip module using a microwave high density interconnect (HDI) structure. A prepackaged circulator can be inserted into a ready-made high density...
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5770821 |
Submount
A submount including: an insulating substrate having therein a throughhole filled with a sintered metal powder, and an electroconductive layer formed on each of the two opposing surfaces of...
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5768776 |
Method for forming a controlled impedance flex circuit
A system and method for providing a controlled impedance flex circuit includes providing an insulative flexible substrate having opposed first and second surfaces and having through holes extending...
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5761803 |
Method of forming plugs in vias of a circuit board by utilizing a porous membrane
A conductive plug is formed in drilled-through vias of a printed circuit board of a polymer ink composition by a method of flooding the vias of a printed circuit board having parchment paper...
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5761802 |
Multi-layer electrical interconnection method
A method for electrically interconnecting a first electrical conductor to a second electrical conductor through a via formed in an insulating layer disposed between the conductors. A refractory...
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5758413 |
Method of manufacturing a multiple layer circuit board die carrier with fine dimension stacked vias
A method of manufacturing a multiple layer circuit board with stacked vias of fine dimension and pitch. A base laminate with conductive pattern is coated with a dielectric which is...
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5758412 |
Method of making a printed circuit board
A method of making a plate through hole printed circuit board, comprises the steps of: a) forming conductive circuit elements on two opposed faces of a non-conductive substrate; b) coating the...
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5747098 |
Process for the manufacture of printed circuit boards
The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates a novel processing sequence for this manufacturing process which method is...
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5745990 |
Titanium boride and titanium silicide contact barrier formation for integrated circuits
Titanium is deposited using a low-pressure chemical-vapor deposition to provide good step coverage over an underlying integrated circuit structure. A rapid thermal anneal is performed using an...
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5745984 |
Method for making an electronic module
A multi-chip module is provided which utilizes benzocyclobutene as a laminate adhesive for bonding the upper dielectric films in a high density interconnect structure. The benzocyclobutene...
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5743004 |
Method of forming electronic multilayer printed circuit boards or cards
A multi-layer printed circuit board or card including at least one passage in at least one of the layers of the circuit board or card for preventing the diffusion of heat throughout the circuit...
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5740603 |
Method for manufacturing low dielectric constant multiple layer ceramic circuit board
A method for manufacturing multiple circuit board for mounting LIS elements and general electronic elements, and which is direcdted to provide a method for manufacturing a porous multiple layer...
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5739055 |
Method for preparing a substrate for a semiconductor package
A method for making a substrate for a semiconductor package comprising forming a conductive layer having a desired circuit pattern on the substrate; curing the conductive layer; and coining the...
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5737837 |
Manufacturing method for magnetic head junction board
A method of manufacturing a magnetic head junction board wherein a laminated plate having a springy metal layer and a conductive layer is prepared. A circuit wiring pattern is formed on the...
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5729897 |
Method of manufacturing multilayer foil printed circuit boards
Multilayer printed circuit boards, foil printed circuit boards and metal-clad laminates for foil circuit boards and a process for the manufacture thereof, with interfacial connections structured in...
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5729894 |
Method of assembling ball bump grid array semiconductor packages
A ball bump grid array package includes dies on one surface of a printed wiring board (PWB) and an array of ball bumps on the other surface of the PWB. The die is interconnected with the ball bumps...
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5729893 |
Process for producing a multilayer ceramic circuit substrate
A method for producing a multilayer ceramic circuit substrate having therein internal conductor patterns comprising W and/or Mo as a main component and surface conductor patterns comprising Cu as a...
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5722162 |
Fabrication procedure for a stable post
An interconnecting post for mounting a microelectronic device such as an integral circuit chip is fabricated with generally uniform cross-section, by forming a first layer of positive photoresist...
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5715595 |
Method of forming a pinned module
An electrical connection pin blank having at least one compliant section is affixed to a first circuit board by compressive deformation in such a way that the compliant section of the pin blank...
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5713127 |
Non-annular lands
The present invention increases real estate by providing non-annular lands which do not completely encircle the through holes. The non-annular lands are non-annular, that is they do not extend...
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5707749 |
Method for producing thin film multilayer wiring board
A thin film multilayer wiring material excellent in reliability, yield, productivity, and higher positioning accuracy includes an insulation organic film having a wiring pattern on one surface and...
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5701667 |
Method of manufacture of an interconnect stress test coupon
This disclosure describes an Interconnect Stress Testing (IST) system and a printed wiring board test coupon which is used with the IST system. The system includes a computer device and a cabinet...
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5699613 |
Fine dimension stacked vias for a multiple layer circuit board structure
A method of manufacturing a multiple layer circuit board with stacked vias of fine dimension and pitch. A base laminate with conductive pattern is coated with a dielectric which is...
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5699610 |
Process for connecting electronic devices
In a first step, a first substrate is prepared. The first substrate has a first surface, a second surface, and a through-hole therebetween. In a second step, a second substrate is prepared. The...
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5698299 |
Thin laminated microstructure with precisely aligned openings
A multilayer laminated body has a determinate system of hollow passages and is formed by an assembly of flat layers of polymeric materials having major dimensions in orthogonal X and Y directions...
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5693364 |
Method for the manufacture of printed circuit boards
The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates a novel processing sequence for this manufacturing process which method is...
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5689091 |
Multi-layer substrate structure
A multi-layer substrate structure and a method for fabricating the same are provided. Thin metal foils are laminated on the top and bottom sides of a non-conductive layer so as to form a laminated...
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5685070 |
Method of making printed circuit board
A printed circuit board or card for direct chip attachment that includes at least one power core, at least one signal plane that is adjacent to the power core, and plated through holes for...
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5683758 |
Method of forming vias
A method of forming a via hole in a substrate includes forming an opening in a substrate thereby forming a slag and then heating the substrate to recombine the slag with the substrate.
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5680701 |
Fabrication process for circuit boards
A process with several variants is presented which permits the layer thickness of the conductive layers on a circuit board to be independent of the layer thickness of the conductive layers in the...
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5669136 |
Method of making high input/output density MLC flat pack
A high density I/O flat pack electronic component is provided comprising a multilayer ceramic substrate having internal electrical conductors for electrically connecting I/O pads on the periphery...
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5669127 |
Method of manufacturing an electro-mechanical energy conversion device for vibration driven actuator
In an electro-mechanical energy conversion device which is disclosed, green sheets on which whole surface electrodes for grounding have been printed and green sheets on which 2-divided electrodes...
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5666722 |
Method of manufacturing printed circuit boards
A printed circuit board is made by producing recesses and/or holes in an electric insulating substrate by laser ablation. The recesses correspond to a desired pattern of conductor structures and/or...
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5659951 |
Method for making printed circuit board with flush surface lands
A method for making a printed circuit board with a flush surface land begins by forming a multi-layer printed circuit board with a recess in a surface dielectric layer. Then, a hole is drilled into...
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5653841 |
Fabrication of compact magnetic circulator components in microwave packages using high density interconnections
A magnetic circulator is incorporated into a multi-chip module using a microwave high density interconnect (HDI) structure. A prepackaged circulator can be inserted into a ready-made high density...
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5644107 |
Method of manufacturing a multilayer electronic component
In order to provide a multilayer electronic component which can reduce arrangement pitches for external electrodes, via holes filled up with conductive materials are provided in a mother laminate,...
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