|
Match
|
Document |
Document Title |
|
|
6098283 |
Method for filling vias in organic, multi-layer packages
A via for an electronic assembly. The assembly includes a substrate which has a via hole. The via hole is filled with a conductive material that extends across a diameter of the hole. The via hole...
|
|
|
6098282 |
Laminar stackable circuit board structure with capacitor
Method and apparatus for fabricating fine pitch pattern multilayer printed circuit boards involving laminar stackable board layers providing power distribution, signal distribution and capacitive...
|
|
|
6094812 |
Dishing avoidance in wide soft metal wires
A method of manufacturing semiconductor circuits or electronic packages is provided. The step of splitting up wide metal areas into metal stripes is included into the physical design step of such...
|
|
|
6092281 |
Electromagnetic interference shield driver and method
A package for a device includes a substrate having a common voltage plane and a mounting region. The device is mounted to the mounting region. An electrically conductive dam structure is disposed...
|
|
|
6088230 |
Procedure for producing a chip mounting board and chip-mounting board thus produced
Procedure for producing a transponder unit (55) provided with at least one chip (16) and one coil (18), and in particular a chip card/chip-mounting board (17) wherein the chip and the coil are...
|
|
|
6085415 |
Methods to produce insulated conductive through-features in core materials for electric packaging
Methods for the production of insulated, conductive through-features in conductive core materials for electronics packaging are disclosed. Invention methods employ protective mask technology in...
|
|
|
6084781 |
Assembly aid for mounting packaged integrated circuit devices to printed circuit boards
An apparatus and method for surface-mounting ball grid array integrated circuit (IC) devices to printed circuit boards. A thin single- or multi-layer sheet of nonconductive material having a...
|
|
|
6083340 |
Process for manufacturing a multi-layer circuit board
A multi-layer circuit board capable of reducing an electrical resistance between circuit patterns positioned inside the circuit board and a through-hole connection conductor. A plurality of circuit...
|
|
|
6073344 |
Laser segmentation of plated through-hole sidewalls to form multiple conductors
A method for generating multiple conductor segments within a plated through hole of a printed circuit board. The method utilizes laser light to define the segmented surfaces bounding a hole in a...
|
|
|
6055723 |
Process of fabricating high frequency connections to high temperature superconductor circuits
The invention relates to a method for producing an electrical connection to a high temperature superconductor (HTS) circuit, where a polymer material is applied to the HTS surface covering the...
|
|
|
6047469 |
Method of connecting a unit under test in a wireless test fixture
A multilayer printed circuit board has prefabricated inner signal layers and unfinished top and bottom layers for customizing the board for a particular test installation. Each signal layer has a...
|
|
|
6041496 |
Method of making ceramic substrate
The present invention relates to multi-layer ceramic packaging of hybrid micro-electronic devices, including those for implantable medical devices. The invention permits size reduction and design...
|
|
|
6037547 |
Via configuration with decreased pitch and/or increased routing space
A number of non-circular vias are defined in a printed wiring board layer. The vias are preferably elliptical, with their long dimensions oriented at an angle to the primary axes of the via or grid...
|
|
|
6035527 |
Method for the production of printed circuit boards
A method for the production of printed circuit boards comprises the steps of producing recesses (2, 3, 4, 5) and/or through holes (2a) in a substrate (1) made from insulating material, in...
|
|
|
6026564 |
Method of making a high density multilayer wiring board
A process of making a multilayer printed wiring board assembly. The process includes the steps of providing a first and a second substrate made of a dielectric material; depositing a first wiring...
|
|
|
6021564 |
Method for reducing via inductance in an electronic assembly and article
A method of making a low inductance conductive via in a laminated substrate by providing a first conductive layer. A first dielectric layer is formed on the first conductive layer. A second...
|
|
|
6014805 |
Method of fabricating a hybrid printed circuit board
A method of fabricating a hybrid printed circuit board on a dielectric substrate is disclosed. The method comprises the step of masking a first pattern on a first side of the dielectric substrate,...
|
|
|
6009620 |
Method of making a printed circuit board having filled holes
A method of making a circuitized substrate wherein fill material is forced into the substrate's holes to thus provide additional support for conductive circuitry or the like thereon, thus...
|
|
|
6006424 |
Method for fabricating inner leads of a fine pitch leadframe
A method of fabricating the inner leads of a fine pitch leadframe having a small interval between leads. The inner leads of the fine pitch leadframe are fabricated by combining a new stamping tool...
|
|
|
6004619 |
Process for manufacturing printed circuit boards
Process for manufacturing circuit boards in which a masking layer (2) is applied to a carrier substrate (1) of insulating material and after producing openings for soldering pads, conductor traces,...
|
|
|
6003225 |
Fabrication of aluminum-backed printed wiring boards with plated holes therein
A printed wiring board has an aluminum backing, a dielectric layer overlying the aluminum backing, and a copper layer overlying the dielectric layer. Holes are drilled through the copper and the...
|
|
|
6000130 |
Process for making planar redistribution structure
A self-supporting redistribution structure for directly mounting a semi-conductor chip to a multilayer electronic substrate is separately fabricated and then laminated to the multilayer substrate....
|
|
|
6000129 |
Process for manufacturing a circuit with filled holes
Circuit boards are manufactured by forming a substrate with a dielectric surface, laminating a metal foil to the substrate, and forming holes in the substrate through the foil. A filler material...
|
|
|
RE36446 |
Method for producing displays and modular components
Processing techniques for various modular components provide various surface mount structures for single device components (10) and multiple device components (FIGS. 6 and 7) suitable as character...
|
|
|
5992012 |
Method for making electrical interconnections between layers of an IC package
In the manufacture of Printed Circuit (PC) boards, conductors are placed in a base layer of glass cloth. The conductors penetrate the thickness of the cloth and can be arranged to form a matrix or...
|
|
|
5987732 |
Method of making compact integrated microwave assembly system
The invention relates to a method for producing low cost integrated microwave assemblies, where a photoresist layer is deposited onto a substrate, a portion of the photoresist is selectively...
|
|
|
5987744 |
Method for supporting one or more electronic components
A structure includes a support layer formed of a conductive material, such as a sheet of copper. The support layer has a number of conductive islands isolated from other portions of the support...
|
|
|
5979044 |
Fabrication method of multilayer printed wiring board
A fabrication method of a multilayer PWB is provided, which realizes a satisfactorily-high adhesion strength between a mounting pad and a cured resin of a prepreg layer located in a surface via...
|
|
|
5973923 |
Packaging power converters
A package for power converters in which a multilayers circuits board holds the components. The winding of the magnetic elements are incorporated in the multilayers circuit board. The top and some...
|
|
|
5966803 |
Ball grid array having no through holes or via interconnections
An electronic device package in the form of a ball grid array package is formed adding a single layer of conductive material including circuitry having trace lines, wire bond pads, and solder ball...
|
|
|
5966052 |
Voltage-controlled oscillator with input and output on opposite corners of substrate
Four generally quadrant-like indentations are formed at the corners of a substrate. A conductive member is applied to the inner surfaces of the indentations to form input and output terminals,...
|
|
|
5956843 |
Multilayer printed wiring board and method of making same
A multilayered printed wiring board includes two or more layers each having a via hole therein, these holes aligned vertically above one another to minimize board real estate while assuring an...
|
|
|
5953816 |
Process of making interposers for land grip arrays
An interposer is formed by forming a laminate comprising a first sheet of electrically insulating material and a second sheet of conductive material. The first sheet has a first plurality of...
|
|
|
5950306 |
Circuit board
A circuit board includes a wiring board which includes an insulative board having a wiring pattern on one surface thereof, a connection hole being formed in the insulative board such that the...
|
|
|
5946799 |
Multilevel interconnect method of manufacturing
In a multilevel interconnect structure for use in a semiconductor device including a lower metal wiring having an aluminum or aluminum alloy film and a high melting point metal or high melting...
|
|
|
5949030 |
Vias and method for making the same in organic board and chip carriers
Multiple vias are produced coaxially or in axis parallel alignment in a first or primary through-hole in a printed circuit board, chip carrier or like electrical device by producing a primary...
|
|
|
5930890 |
Structure and fabrication procedure for a stable post
An interconnecting post for mounting a microelectronic device such as an integral circuit chip is fabricated with generally uniform cross-section, by forming a first layer of positive photoresist...
|
|
|
5925206 |
Practical method to make blind vias in circuit boards and other substrates
A new method of preparing blind vias in printed circuit boards and other substrates allows for the drilling of holes for connection between conductive layers, in insulating layers prior to...
|
|
|
5915757 |
Electrostatic protective device and method for fabricating same
Provided is an electrostatic protective device which is highly effective in protecting relatively vulnerable devices such as IC's and LSI's from electrostatic damages, and a method for fabricating...
|
|
|
5915756 |
Method to fill via holes between two conductive layers
A method of filling via holes between a lower conductive layer and an upper conductive layer whereby the hole is filled by the lower conductive layer. By optimizing conditions such as compressive...
|
|
|
5906043 |
Programmable/reprogrammable structure using fuses and antifuses
In one embodiment, the steps for forming an electrical conductor between conductive layers of a printed circuit board include the following steps: (1) applying a first dielectric material on a...
|
|
|
5906042 |
Method and structure to interconnect traces of two conductive layers in a printed circuit board
A micro filled material includes a binding material and optionally includes a number of particles. The binding material and the particles can be formed of any conductive or nonconductive material....
|
|
|
5896650 |
Method of making ceramic multilayer
The present invention provides a multilayer ceramic substrate and a method of producing the same which can prevent occurrence of cracks when laminating different ceramic substrates or due to...
|
|
|
5891528 |
Printed circuit board process using plasma spraying of conductive metal
A printed circuit board is formed by selectively conditioning at least one surface of a substrate with a pattern including selected areas conditioned to receiving metal, and non-selected areas to...
|
|
|
5888627 |
Printed circuit board and method for the manufacture of same
It is an object of the present invention to provide a highly reliable printed circuit board subject to little bowing or twisting of the substrate, wherein the substrate and metal wiring are...
|
|
|
5887345 |
Method for applying curable fill compositon to apertures in a substrate
The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an...
|
|
|
5884397 |
Method for fabricating chip carriers and printed circuit boards
A method for fabricating a chip carrier and attaching the chip carrier to a printed circuit board is disclosed. A plated through hole (PTH) is formed through a chip carrier substrate. The PTH has...
|
|
|
5881455 |
Method of fabricating through-holed wiring board
A method of fabricating a through-holed wiring board comprising a step of forming a through hole in a ceramic wiring board with a laser beam, and a step of removing an alteration layer, defined on...
|
|
|
5878487 |
Method of supporting an electrical circuit on an electrically insulative base substrate
A method of supporting an electrical circuit on an electrically insulative base substrate comprises embossing a first circuit pattern on the substrate, and plating or etching a second circuit...
|
|
|
5870822 |
Flip chip attachment
A flip chip is soldered to an array of flexible pillars of compliant dielectric material on a circuit board. Each pillar has an electrically conductive core electrically coupled to the circuit...
|