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6591490 |
Method of constructing a multilayer electric apparatus
A method of constructing a multilayer electric apparatus. The method includes forming a set of conductive features and a plurality of fiducial markings on a first dielectric layer in mutual...
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6591495 |
Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic plating
An opening is formed in resin by a laser beam so that a via hole is formed. Copper foil, the thickness of which is reduced to 3 μm by etching to lower the thermal conductivity, is used as a...
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6589593 |
Method for metal coating of substrates
A process for coating substrates having polymer surfaces with metals in the manufacturing of printed circuit boards, in particular in the manufacturing of printed circuit boards having microscopic...
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6589594 |
Method for filling a wafer through-via with a conductive material
A method for filling a via formed through a silicon wafer is disclosed. The method entails mounting the silicon wafer on a mounting substrate and depositing either molten or solid balls of a...
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6584682 |
Method for making circuit board
A method 10 for making multi-layer electronic circuit boards 148, 248 having aperture 146, 246 which may be selectively connected to an electrical ground potential.
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6581280 |
Method for filling high aspect ratio via holes in electronic substrates
High aspect ratio (5:1-30:1) and small (5 μm-125 μm) diameter holes in a dielectric substrate are provided, which are filled with a solidified conductive material, as well as a method of filling...
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6574861 |
System and method for solder ball rework
A system and method have been provided for removing high lead content solder balls from the surface of a circuit package for the purpose of rework. The invention is applicable to ball grid array...
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6574863 |
Thin core substrate for fabricating a build-up circuit board
Disclosed is a method of preparing a thin core substrate for fabricating a build-up multilayer circuit board. The method involves the use of an insulating layer which is covered with the...
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6571469 |
Method for manufacturing modular board
A blanking plate is attached to the bottom surfaces of a split board and a remaining board, which are separated from one bare board. After depositing solder paste on a back electrode of the split...
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6571467 |
Method for producing a doublesided wiring board
The method for producing a printed wiring board comprising the steps of preparing a conductive substrate, forming an insulating layer on one surface of the said substrate, forming at least one via...
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6564452 |
Method for creating printed circuit board substrates having solder mask-free edges
A substrate for a plurality of electronic assemblies includes a strip of printed circuit board (PCB) material including a surface and a plurality of segments. Each segment is adapted to receive at...
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6564448 |
Resin structure in which manufacturing cost is cheap and sufficient adhesive strength can be obtained and method of manufacturing it
A resin structure includes a resin layer and a metal layer. The resin layer is formed of a single material. The metal layer is laminated directly on the resin layer without intervention of an...
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6564454 |
Method of making and stacking a semiconductor package
Semiconductor packages and methods of making packages are disclosed. An exemplary method includes providing a printed circuit board having a first surface with circuit traces thereon, first...
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6564451 |
Hole filling method for a printed wiring board
On carrying out a hole filling method for a printed wiring board having an interlayer connection hole, first and second printed wiring boards ( 1 and 2 ) are prepared, each of which has the...
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6560860 |
Low temperature co-fired ceramic with improved registration
A low temperature co-fired ceramic assembly (LTCC) with a constraining core to minimize shrinkage of outer ceramic layers during firing. The outer ceramic layers have high density circuit features....
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6560833 |
Method of manufacturing ink jet head
A method of manufacture an ink jet head in which an ink is jetted from a nozzle hole by applying an electric voltage to an electrode so as to deform ink chambers divided by a partition wall. The...
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6560864 |
Process for manufacturing a flat coil
A process for manufacturing a flat coil for use as the write head in a magnetic disk system is disclosed. The process starts with a blanket seed layer which is coated with a photoresist frame that...
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6557250 |
Multilayer board compound and method for the manufacture thereof
A multilayer printed board compound comprises at least two planely superposed printed boards, each of which having an electrically insulating mother board, electrically conductive circuit paths,...
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6555761 |
Printed circuit board with solder-filled via
A plated-through hole via is substantially filled with solder rather than with traditional polymer to reduce printed circuit board failure due to outgassing from improperly cured polymer via fill....
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6546623 |
Structure equipped with electrical contacts formed through the substrate of this structure and process for obtaining such a structure
A process for manufacturing a structure equipped with at least one electrical contact, including forming on a substrate a first layer, forming on a front side of the first layer the structure...
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6546607 |
Method of manufacturing a crater-style capacitor for high-voltage radio-frequency applications
A method for forming a crater-style sampling capacitor. The capacitor includes a dielectric having a smooth crater shaped input electrode on a first surface and output and guard electrodes on a...
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6546624 |
Removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit board
Removable mask films 303 are formed on the both sides of the substrate having the adhesive layer 302 by applying and drying a resin varnish 304 including a ultraviolet-absorbing agent, and...
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6545890 |
Flanged terminal pins for dc/dc converters
A dc/dc converter is mounted to a printed circuit board with rigid terminal pins which extend into a converter substrate to provide electrical connection to circuitry on the substrate. A terminal...
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6543130 |
Rotative cutting method and device for printed circuit boards and electric conductors
The invention relates to a method and device for producing printed circuit boards and electric conductors. The inventive device comprises a station where a conductive layer is fixed to a support...
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6539625 |
Chromium adhesion layer for copper vias in low-k technology
In integrated circuits having copper interconnect and low-k interlayer dielectrics, a problem of open circuits after heat treatment was discovered and solved by the use of a first liner layer of...
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6538310 |
LSI package with internal wire patterns to connect and mount bare chip to substrate
The present invention is provides an LSI package without employing steps for forming solder bumps on a bare chip and soldering to an interposer. In the present invention, a bare chip is mounted on...
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6534726 |
Module substrate and method of producing the same
End-face through holes each comprising a concave-curved end-face opening groove and an end-face electrode covering the inner wall of the groove are formed in the end-faces of a substrate....
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6531022 |
Mounting method of semiconductor element
A mounting method of a semiconductor element capable of joining an electrode of a semiconductor element and a circuit board at high reliability. The method includes a step of forming an external...
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6523257 |
Method for forming fine through hole conduction portion of circuit board
In order to realize through hole conduction of an internal layer wiring pattern 4 and respective external layer conduction layers 2 and 5 on both sides, a through hole partially blocked is...
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6523256 |
Method of manufacturing a wiring board
A resin structure includes a resin layer and a metal layer. The resin layer is formed of a single material. The metal layer is laminated directly on the resin layer without intervention of an...
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6518516 |
Multilayered laminate
A multilayered laminate, substructures and associated methods of fabrication are presented. The multilayered laminate includes in sequential order: (a) a first intermediate layer having microvias...
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6515237 |
Through-hole wiring board
A through-hole wiring board comprising through-holes passing through a substrate and filled with an electroconductive material; copper toil lands and copper foil circuits formed on surfaces of the...
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6507118 |
Multi-metal layer circuit
A printed circuit assembly includes an interposer circuit having a flexible dielectric core with an array of contact members attached thereto. Each contact member includes a first interconnect...
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6501031 |
Electrical circuit board and a method for making the same
A multi-layer electronic circuit board design 10 having a core member 12, a pair of dielectric layers 14, 16 disposed thereon, and a first circuit portion 20 which is coupled to the...
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6500011 |
Flexure blank and method of manufacturing the same
An opening portion is provided in a connecting portion of a flexure blank, an opening end portion of an insulating base layer is coated with a conductive member without exposing the opening end...
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6499214 |
Method of making a circuit board
A method 10, 110 for making multi-layer circuit boards having metallized apertures 38, 40, 130, 132 which may be selectively and electrically grounded and having at least one formed air-bridge ...
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6493935 |
Interleaving a bondwire between two bondwires coupled to a same terminal
An integrated circuit device package. A substrate includes a first terminal coupled to the substrate. First and second conductive traces are formed on the substrate and are electrically coupled to...
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6486394 |
Process for producing connecting conductors
A method for the manufacture of screened or shielded interconnecting conductors ( 1 ) begins with semifinished foil products (H 1, H 2, H 3 ), a first semifinished foil product (H 1 ) having at...
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6479765 |
Vialess printed circuit board
A method is disclosed for establishing signal contacts on a multilayer printed circuit board having alternating ground and signal layers in a stack-up configuration. The signal layers have signal...
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6473963 |
Method of making electrical circuit board
A multi-layer circuit board with heat pipes and a method for forming a multi-layer circuit board with heat pipes is disclosed. The method includes forming channels in a first and second pre-circuit...
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6467161 |
Method for making a circuit board
A method 10, 110 for making multi-layer electronic circuit boards 82, 148 having metallized apertures 18, 20, 118, 120 which may be selectively and electrically connected to a source of...
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6467160 |
Fine pitch circuitization with unfilled plated through holes
A method of making a circuitized substrate having plated through holes free of filler material is provided. The method includes the steps of providing a dielectric substrate having first and second...
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6460247 |
Wiring board constructions and methods of making same
A wiring board construction includes at least one microvia disposed in a base substrate and includes a deep imprinted cup shaped in the top surface thereof. A conductor material is disposed within...
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6457234 |
Process for manufacturing self-aligned corrosion stop for copper C4 and wirebond
A self-aligned (i.e., spatially selective) process for fabricating a corrosion-resistant conductive pad on a substrate, and an associated structure that includes an interconnect to allow a terminal...
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6453542 |
Method for fabricating balanced shield connections for noise reduction in MR/GMR read heads
A method for fabricating balanced shield connections for noise reduction MR/GMR read heads and an MR/MGR read head so fabricated. The present invention teaches a method for forming a balanced...
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6449821 |
Method of constructing segmented connections for multiple elevation transducers
A method for constructing a connection assembly for use in a multiple aperture ultrasonic tranducer including an array of elements for transmitting or receiving signals, wherein each element is...
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RE37840 |
Method of preparing a printed circuit board
Disclosed is a printed circuit board and a method of preparing the printed circuit board. The printed circuit board has two types of plated through holes. The first type of plated through holes...
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6449840 |
Column grid array for flip-chip devices
A method for providing C4-type bumps which are higher than conventional C4 bumps. A dielectric substrate is copper cladded on both sides. At each prospective bump location, a via is laser ablated...
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6441319 |
Inserted components for via connection of signal tracks to achieve continuous impedance matching in multi-layer substrate
A technique for connecting signal tracks within a multi-layer substrate is disclosed. In one embodiment, the technique is realized by providing an opening in a substrate and fitting an inserted...
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6438830 |
Process of producing plastic pin grid array
A pinning process including the steps of gold-plating through-holes in a laminate carrier and crimping old or gold-plated pin located in the through-holes to form a pin head on the top and a pin...
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