Matches 1 - 50 out of 181 1 2 3 4 >
Match Document Document Title
7430800 Apparatus and method for far end noise reduction using capacitive cancellation by offset wiring  
A mechanism for reducing the vertical cross-talk interference experienced in signal lines due to the inductive affects from signal lines in other signal planes of a multi-layer ceramic package is...
7386934 Double layer patterning and technique for milling patterns for a servo recording head  
Double photolithography is used to produce an under-layer of protective and filtering photoresist over a substrate that will have channels milled with a FIB. Secondary layers are applied with...
7383621 Method of producing a piezoelectric ceramic  
A piezoelectric contains comprises a plurality of piezoelectric particles made from a piezoelectric material such as lead titanate zirconate and a dielectric made from a dielectric material, such...
7356917 Method for manufacturing multi-layer printed circuit board  
A multi-layer printed circuit board includes an insulation substrate; a surface conductive pattern disposed on a surface of the insulation substrate; and an inner conductive pattern embedded in the...
7356911 Method for producing an insulated wire  
A method for producing an insulated wire having a cross section of a desired shape, in which a conductor having a cross section of a desired shape is coated with an insulating film, which method...
7346982 Method of fabricating printed circuit board having thin core layer  
A method is directed towards fabricating a printed circuit board (PCB) having a thin core layer. In the method, a substrate, where a copper foil is formed on a release film and a prepreg, is...
7340823 Methods for forming head suspension assemblies  
Embodiments include a method for forming a head suspension assembly. A spacer layer is formed in or on a silicon wafer. A transfer film including an opening defining the shape of a slider support...
7334325 Apparatus and method for improving coupling across plane discontinuities on circuit boards  
The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout,...
7334323 Method of making mutilayered circuitized substrate assembly having sintered paste connections  
A method of making a circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder...
7328505 Method for manufacturing multilayer circuit board  
A multilayer circuit board that has electrodes only on one surface is manufactured as follows. A plurality of conductor layers are formed on a resin film made of thermoplastic resin to form a...
7316063 Methods of fabricating substrates including at least one conductive via  
A method of fabricating a substrate is disclosed. Apertures are formed in a substrate blank. A conductive layer is formed on opposing surfaces of the substrate, as well as inside the apertures....
7287321 Multi-layer board manufacturing method  
Two types of resin films are prepared for manufacturing a multi-layer board containing a chip component. A fist type has a via hole for the chip component to be inserted into, while a second type...
7275309 Method of manufacturing electrical resistance heating element  
A method of manufacturing an electrical-resistance heating element includes forming sintered ceramics or calcined ceramics, forming an electrode on the sintered ceramics or the calcined ceramics,...
7243424 Production method for a multilayer ceramic substrate  
An object of the invention is to connect different dielectrics electrically to each other in the direction of main surface of a sheet in a multilayer ceramic substrate and to increase the degree of...
7237335 Method to service telecommunication box  
A method and apparatus are provided for servicing a telecommunication junction box. The method enables a reduced number of tools to be utilized to service a telecommunication junction box.
7231712 Method of manufacturing a module  
A module includes a ceramic substrate, first and second electrodes provided on the ceramic substrate, a component having third and fourth electrodes connected to the first and second electrodes,...
7200927 Method for producing a wiring transfer sheet  
A wiring transfer sheet including a carrier base and a wiring layer formed thereon is produced so that an exposed area of a surface of the carrier base on which the wiring layer is formed has a...
7174632 Method of manufacturing a double-sided circuit board  
A circuit board including a desired number of electrically insulating layers and wiring layers laminated alternately, and an inner via hole for securing an electrical connection between the wiring...
7171746 Process for applying conductor tracks to the surface of plastics moldings  
A process is described in which surfaces of foamed plastics are provided with electrical conductor tracks, with the aid of selectively ablating processes. The process permits low-cost production...
7162794 Manufacturing method for multilayer ceramic elements  
A multilayer integrated substrate includes breaking grooves arranged in a grid pattern so as to section the main surface of the substrate into a plurality of blocks, and also includes...
7159309 Method of mounting electronic component on substrate without generation of voids in bonding material  
When an electronic component is mounted on a substrate, the electronic component is first placed on the substrate with a solid support interposed between the electronic component and the substrate....
7127809 Method of forming one or more base structures on an LTCC cofired module  
An LTCC module includes a base on one or more surfaces for receiving one or more external components to be attached to the module. A base is formed of a plurality of layers of metallization in a...
7127799 Head gimbal assembly method  
The present invention provides a method for assembling a head gimbal assembly useful in a hard disk drive and for testing such an assembly. In a method in accord with the present invention a...
7124502 Method of fabricating a high-layer-count backplane  
The disclosed board fabrication techniques and design features enable the construction of a reliable, high-layer-count, and economical backplane for routers and the like that require a large number...
7082669 Method of manufacturing a substrate of a rotary encoder  
A two-phase rotary encoder is provided which includes a substrate for the encoder which is double-faced and has a copper-foil-bonded substrate etched thereon, a first ring-shaped electrode pattern...
7065846 Insulation for piezoceramic multilayer actuators  
The invention relates to a method for the manufacture of piezoelectric multilayer actuator in which thin layers of a piezoceramic material, called “green leaves” on which at least one internal...
7059028 Method of making certain flexible piezoelectric films  
Methods of making certain piezoelectric films are disclosed. For example, a certain method of making piezoelectric films consistent with certain embodiments of the invention can include the steps...
7022251 Methods for forming a conductor on a dielectric  
Disclosed is a method for forming a conductor on a dielectric. The method commences with the deposition of a conductive thickfilm on the dielectric, followed by a “subsintering” of the...
7018494 Method of producing a composite sheet and method of producing a laminate by using the composite sheet  
A method of producing a composite sheet in which a through hole formed in a predetermined portion of the first ceramic sheet is buried with a different kind of sheet having substantially the same...
7004984 Method of producing ceramic multilayer substrate  
After a resistor and/or a capacitor are simultaneously fired on a fired ceramic core substrate to be fired, the fired resistor and/or the fired capacitor is trimmed so that the resistance and the...
6954971 Method for simultaneously making a plurality of acoustic signal sensor elements  
A fetal heart monitoring system preferably comprising a backing plate having a generally concave front surface and a generally convex back surface, and at least one sensor element attached to the...
6941625 Method of producing a piezoelectric/electrostrictive device  
A method of producing a piezoelectric/electrostrictive device in which a piezoelectric/electrostrictive element including a substantially trapezoidal laminate having narrower and wider surfaces...
6938336 Methods of manufacturing board having throughholes filled with resin and multi-layered printed wiring board using the board  
A resin filled board is manufactured by forming roughened surfaces on a conductive layer in a throughhole before it is filled with a resin, forming smooth surfaces on conductive layers on the top...
6938332 Method for manufacturing multilayer ceramic substrates  
A method for manufacturing multilayer ceramic substrates in accordance with a multiple formation method using a non-shrinkage process allows the multilayer ceramic substrates to be smoothly formed...
6925703 Method for producing an insulated wire  
A method for producing an insulated wire having a cross section of a desired shape, in which a conductor having a cross section of a desired shape is coated with an insulating film, which method...
6889426 Method for manufacturing wired circuit board  
A method for manufacturing wired circuit board that enables a wired circuit board of high quality to be manufactured without changing in dimension of the wired circuit board substantially. In this...
6880244 Circuit board having simultaneously and unitarily formed wiring patterns and protrusions  
Method of manufacturing a circuit board and semiconductor device wherein the circuit board has a plurality of wiring patterns and protrusions located on the wiring patterns, the method including...
6871400 Method of producing a liquid jetting head  
A liquid jetting head of the invention includes a flowing-path plate through which a flowing-path space is formed as a flowing-path for a liquid. A nozzle plate is provided on one side surface of...
6871388 Method of forming an electronic component located on a surface of a package member with a space therebetween  
A method of forming an electronic component includes laminating ceramic green sheets on a support film to obtain a ceramic green sheet laminate, forming through holes through the ceramic green...
6860006 Method for manufacturing a monolithic ceramic electronic component  
A monolithic electronic component includes a composite body having a plurality of stacked ceramic layers. The ceramic layers include interconnecting conductors provided in each of the ceramic...
6857172 Method of manufacturing ferroelectric capacitor  
According to the present invention, a method of manufacturing a ferroelectric capacitor using a ferroelectric thin film, includes steps of: forming a lower conductive layer on a semiconductor...
6839955 Method of making a multilayer inductor  
In the multilayer inductor, the substrate thereof is composed of a constituent belonging to spinel ferrite, and is furnished with internal conductors of a main constituent being silver at the...
6823585 Method of selective plating on a substrate  
A method and structure to form surface plating metallization on a substrate. Two layers of tape are applied to the surface of the substrate. A first path is cut through both layers of tape exposing...
6823584 Process for manufacturing a membrane electrode assembly  
A process for manufacturing a membrane electrode assembly for an electrochemical cell comprises: feeding a sheet of ion exchange membrane material through a double belt press; feeding at least one...
6817092 Method for assembling a circuit board apparatus with pin connectors  
A method allowing for the inexpensive automated construction of interconnections between circuit boards is provided. According to the present invention, printed circuit pins are inserted in a...
6813815 Method of producing a piezoelectric/electrostrictive element  
A piezoelectric/electrostrictive element including a substantially trapezoidal laminate having narrower and wider surfaces lying substantially in parallel to each other and first and second...
6810577 Method of manufacturing a dielectric waveguide  
The present invention provides a method of efficiently manufacturing a dielectric waveguide with high reliability and precision. In the method, a resist material is formed on the outer surface of a...
6807729 Method of manufacturing metal foil  
The present invention provides a method of manufacturing a metal foil laminated product including the steps of forming a bonding layer containing a thermosetting resin on a lower wiring layer, a...
6772512 Method of fabricating a flip-chip ball-grid-array package without causing mold flash  
A method of fabricating a FCBGA (Flip-Chip Ball-Grid-Array) package without causing mold flash is proposed, which is characterized by the forming of a dummy pad over the back surface of the...
6757963 Method of joining components using a silver-based composition  
A surface of a first ceramic component is joined to a surface of a second ceramic component using a silver-based composition. The silver-based composition is a mixture of silver metal and a metal...
Matches 1 - 50 out of 181 1 2 3 4 >