Matches 1 - 50 out of 269 1 2 3 4 5 6 >
Match Document Document Title
7404250 Method for fabricating a printed circuit board having a coaxial via  
A method of fabricating a printed circuit board having a coaxial via, includes. The method includes assembling a plurality of layers configured in a stack so that the plurality of layers has a top...
7377033 Method of making circuitized substrate with split conductive layer and information handling system utilizing same  
A method of making circuitized substrate which includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate...
7370406 Method of manufacturing a thin film structure  
A thin film magnetic head is described, the magnetic head having an insulating layer and a protrusion which has an upper portion and a base portion, and the upper portion has an extended portion....
7353600 Circuit board fabrication method and circuit board  
A circuit board fabrication method including: forming first conductive interconnection 2 onto insulator substrate 1; applying resin film 41, which is to be interlevel insulator layer 42 for...
7353597 Method of forming a conductive gasket material  
A method of forming a conductive gasket material by layering at least one conductive web layer having a blended mixture of conductive fibers and low melting point nonconductive fibers onto a foam...
7307020 Membrane 3D IC fabrication  
General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and...
7302756 Bond finger on via substrate, process of making same, package made thereby, and method of assembling same  
A wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the in the wire-bonding substrate. A package includes a die that...
7266877 Tooling for manufacturing large-section rigid harnesses  
The invention relates to tooling for preparing a large-section harness comprising at least one cable. The tooling includes an output module ( 19 ) for receiving the terminal end of the cable. The...
7257884 Method for fabricating semiconductor component with adjustment circuitry for electrical characteristics or input/output configuration  
A semiconductor component includes adjustment circuitry configured to adjust selected physical and electrical characteristics of the component or elements thereof, and an input/output configuration...
7257883 Method and apparatus for manufacturing an electric heater  
In the manufacture of an electric heater, means ( 24, 26 ) is provided for feeding and guiding a ribbon heating element ( 14 ) progressively into overlying edgewise relationship with a base ( 2 )....
7243424 Production method for a multilayer ceramic substrate  
An object of the invention is to connect different dielectrics electrically to each other in the direction of main surface of a sheet in a multilayer ceramic substrate and to increase the degree of...
7240429 Manufacturing method for a printed circuit board  
A conductor pattern is formed on a resin film which is made of a thermoplastic resin. Each single-sided conductor pattern film has via-holes filled with an electrically conductive paste. A printed...
7237317 Process for producing a superconducting cable  
A process is provided for the production of a superconducting cable having a single cable core that contains at least one elongated superconducting element and a flexible tube that which surrounds...
7223111 Electrical connector  
An electrical connector that has an array of conductors each having a contact point to make contact with a mating conductive surface. Upon engaging the contact points in a sliding manner with the...
7216424 Method for fabricating electrical connections of circuit board  
A method for fabricating electrical connections of a circuit board is provided. The circuit board has a plurality of electrical connection pads thereon. A protective layer is applied on the circuit...
7213333 Method for manufacturing mounting substrate and method for manufacturing circuit device  
Provided are a method for manufacturing a mounting substrate and a method for manufacturing a circuit device, both of which include the step of electroplating a number of electrodes. The method for...
7188415 Cable harness breakout assembly method  
A cable assembly comprises a plurality of electrical or fiber-optic cables, a spacer, and a collar. The cables are arranged lengthwise in a bundle, which includes a segment having a cross-sectional...
7188414 Method of assembling a flat electrical cable  
A flat electrical cable and a modular rotary anvil for assembling a flat electrical cable wherein the flat cable includes an upper and lower layer. The upper layer has ribs protruding along its...
7185427 Method for making electrical connections to an element on printed circuit board  
The present invention is directed to a method for an electrically conductive structure on a printed circuit board for connecting an element on the printed circuit board with other elements. The...
7181836 Method for making an electrode structure  
An electronic device such as a sensor or a NEMS. The electronic device comprises at least one substrate; a plurality of electrodes disposed on the substrate; and at least one nano-wire growing from...
7178235 Method of manufacturing an optoelectronic package  
A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic...
7174629 Integrated circuit contactor, and method and apparatus for production of integrated circuit contactor  
An integrated circuit contactor includes a base of an insulating material, the base being elastically deformable. A plurality of pads of a first conductive material are bonded to the base at...
7143487 Method of manufacturing the matrix type ultrasonic probe  
A matrix type ultrasonic probe is disclosed, which has a backing material, and a plurality of piezoelectric elements having upper and lower face electrodes, respectively, and arrayed in...
7131194 Method of manufacturing a device  
Wirings 2 B 1 are formed by application of heat treatment after an ink jet system is used to discharge a conductive liquid L onto a provisional substrate 5 having a predetermined repellent...
7086148 Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit  
An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated...
7077662 Contact woven connectors  
A contact connector is provided that has at least one loading fiber and a plurality of conductors. Each conductor may have at least one contact point. Each conductor may contact a single loading...
7076858 Method for controlling resonant tag frequency  
A method of making a resonant frequency tag having a predetermined frequency comprises forming a first conductive pattern comprising an inductive element and a first land having a first end...
7056139 Electrical connector  
An electrical connector that has an array of conductors each having a contact point to make contact with a mating conductive surface. Upon engaging the contact points in a sliding manner with the...
7040013 System and method for printed circuit board net routing  
A method, system, and product for routing nets along a printed circuit board through an obstacle field and a circuit board having traces produced in accordance with the routed nets is disclosed....
7036225 Process for treating coil end upon winding of coil  
A process for treating a coil end is provided, by which upon automatic winding of the coil, an electric connection between a portion of a wire at the front or rear end of the coil and a terminal of...
7036224 Method of making fluid sensor probe  
A fluid sensor probe such as a temperature probe uses heat shrink tubing to seal and provide strain relief at a proximal end of the probe. The heat shrink tubing uses a layer of hot melt adhesive...
7036218 Method for producing a wafer interposer for use in a wafer interposer assembly  
A method for producing a wafer interposer ( 210 ) for use in a wafer interposer assembly is disclosed. The wafer interposer ( 210 ) is produced by attaching solder bumps ( 140 ) to a lower surface...
7007375 Method for fabricating a semiconductor component  
A semiconductor component includes adjustment circuitry configured to adjust selected physical and electrical characteristics of the component or elements thereof, and an input/output configuration...
7004984 Method of producing ceramic multilayer substrate  
After a resistor and/or a capacitor are simultaneously fired on a fired ceramic core substrate to be fired, the fired resistor and/or the fired capacitor is trimmed so that the resistance and the...
7000314 Method for providing flexible circuit using discrete wiring  
A method for providing electrical signal transmission and a secure mechanical attachment in a flexible circuit assembly. The inventive mechanism combines the electrical features of discrete wiring...
6973703 Method for manufacturing an ink-jet head  
A method for manufacturing an ink-jet head, including forming a mark for indicating the positions of pressure chambers on a surface of a passage unit; preparing a member containing a piezoelectric...
6959488 Method for retaining a first part against a second part  
A system and method are disclosed which utilize a retaining mechanism to retain a first part against a second part in a manner that supplements or supplants use of adhesive. A retaining mechanism...
6946604 Template for preparing a wire harness  
A template for preparing a wiring harness allows for quick and accurate preparation of the harness for subsequent installation within a vehicle. The template has a base member with one or more...
6941649 Method of fabricating a high-layer-count backplane  
The disclosed board fabrication techniques and design features enable the construction of a reliable, high-layer-count, and economical backplane for routers and the like that require a large number...
6938336 Methods of manufacturing board having throughholes filled with resin and multi-layered printed wiring board using the board  
A resin filled board is manufactured by forming roughened surfaces on a conductive layer in a throughhole before it is filled with a resin, forming smooth surfaces on conductive layers on the top...
6927982 Method of connecting a device to a support, and pad for establishing a connection between a device and a support  
In a method of connecting a device to a support, in which method the device comprises at least a first terminal region, and in which method the support comprises at least a second terminal region,...
6925704 Method for making high power resistor having improved operating temperature range  
A high power resistor includes a resistance element with first and second leads extending out from the opposite ends thereof. A heat sink of dielectric material is in heat conducting relation to...
6925701 Method of making a series of resonant frequency tags  
A method of making a resonant frequency tag which resonates at a predetermined frequency. The method involves providing a first conductive pattern having an inductive element and a first land and a...
6920684 Assembling method for producing a magnetic sensor with high output accuracy  
The fixed layers of all magnetoresistive elements that are formed on the same substrate are magnetized in the same direction. Chips including magnetoresistive elements are cut out individually from...
6900540 Simulating diagonal wiring directions using Manhattan directional wires  
An integrated circuit has a metal layer that includes conductors to provide interconnectivity for components of the integrated circuit chip. The metal layer is divided into at least two sections,...
6881291 Process for bonding conductor tracks to plastics surfaces  
In the process described, the surfaces of plastics are provided with electrical conductor tracks with the aid of laser beams. The process permits the production of moldings made from plastic with...
6871388 Method of forming an electronic component located on a surface of a package member with a space therebetween  
A method of forming an electronic component includes laminating ceramic green sheets on a support film to obtain a ceramic green sheet laminate, forming through holes through the ceramic green...
6860007 Method of producing an LED rope light  
A method of producing a light-emitting-diode (LED) rope light includes the steps of preparing a plurality of light seats defining a recess therein and a plurality of metal wires having two...
6799370 Manufacturing technique for optical fiber array  
An improved manufacturing technique for optical fiber arrays employs optical feedback in a partially assembled unit using an inspection camera. This allows immediate reworking of a problematic...
6762117 Method of fabricating metal redistribution layer having solderable pads and wire bondable pads  
A redistribution metallization scheme combines solder bumps and wire bond pads in addition to existing bond pads to enhance the connectivity of a semiconductor device, especially in flip-chip...
Matches 1 - 50 out of 269 1 2 3 4 5 6 >