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7621043 |
Device for making an in-mold circuit
A poly sheet continuously moving in a machine direction is heated to a temperature just below its glass thermal temperature to make the poly malleable. A circuit (e.g., RFID chip, EAS chip,...
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7603770 |
Method of overmolding an electronic assembly having an insert-molded vertical mount connector header
An electronic assembly including a vertical mount connector header is overmolded to form an encapsulated module. Conductor pins retained in the connector header are coupled to a circuit board to...
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7596857 |
Method for manufacturing a keyboard
A method manufactures a keyboard with injecting keys and an inmold metal sheet. The bottoms of grooves of the keys are combined with an elastic material layer to form a keyboard. The metal layer is...
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7549222 |
Method of producing wiring board
A wiring base board and a method of producing thereof relate to a wiring base board of a multilayer structure, and make it possible to perform various kinds of transmission modes such as...
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7549207 |
Method of manufacturing an actuator
A manufacturing method for an actuator including a casing and a housing. The method includes setting a metallic ring in a molding die; injection molding a first flange portion of the casing using...
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7530164 |
Wafer-level underfill process making use of sacrificial contact pad protective material
A method for connecting electronic components, such as, an integrated circuit die and a package substrate, is described. According to one aspect of the invention, a contact pad protective material...
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7523542 |
Method of manufacturing a magnetic element
There are provided a magnetic element capable of enhancing magnetic permeability of a magnetic member, improving a direct current superposition characteristic, and improving production efficiency...
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7509733 |
Method for producing means of connecting and/or soldering a component
A method for producing a plurality of stamped shapes to serve as a mechanism for connecting and/or soldering or sealing a component, on a substrate, including the steps of depositing a layer made...
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7503114 |
Method for producing ink jet head
A method for producing an ink jet head including, on a substrate, a piezoelectric element for discharging an ink from a discharge port, and an ink flow path communicating with the discharge port so...
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7466023 |
Semiconductor light emitting device and plant cultivating system
Guard electrodes 2 which are electrically connected with a conductive portion of a cooling water passage 23 through connection lines 3 are respectively provided in the middle of a water inlet...
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7461451 |
Method for manufacturing liquid discharge head
The present invention fixes a nozzle sheet on a substrate with a predetermined material ( 5,6 ), which has an excellent chemical resistance and sufficient adhesiveness, or more specifically, fixes...
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7458146 |
Method for manufacturing image display unit
The present invention discloses a method for reinforcing the connection between a wire formed on a substrate and a flat cable member with a reinforcing material. The method includes the step of...
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7448119 |
Method of producing a surface acoustic wave device
A method of producing a surface acoustic wave device includes a sacrificial-layer forming step of forming a sacrificial layer on a piezoelectric substrate so as to cover comb electrodes and...
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7421781 |
Method of forming a module component having a plurality of penetration holes
According to the invention, the method of manufacturing a module component comprises an inserting step of inserting a chip component in a first molding die; a primary molding step of filling the...
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7383630 |
Method for making a circuit plate
A method for making a circuit plate includes: forming first holes in an insulating layer; forming a conductive layer on the insulating layer such that a portion of the conductive layer fills the...
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7380338 |
Circuit board and manufacturing method thereof
A circuit board includes a substrate, an insulating layer, at least one protrusion, and a first circuit layer. The insulating layer is disposed on the substrate and has at least one...
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7367120 |
Method for producing a solid-state imaging device
A method of manufacturing a solid-state imaging device. An end portion on the aperture side of each of the plurality of wirings forms an internal terminal portion and an end portion on the outer...
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7343675 |
Method of constructing a structural circuit
A method relating to a multi-functional, structural circuit, referred to as a structural circuit, is disclosed. The method can include thermoforming a liquid crystal polymer (LCP) circuit with a...
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7334324 |
Method of manufacturing multilayer wiring board
A method of manufacturing a, in order to accommodate the words range and to clarify the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating...
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7308752 |
Method for making an optical pickup apparatus having a movable unit supported by springs attached to a fixed unit
An optical pickup apparatus is described which includes a movable unit with an objective lens, a focus servo coil for moving the moveable unit containing the objective lens in the optical-axis...
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7275309 |
Method of manufacturing electrical resistance heating element
A method of manufacturing an electrical-resistance heating element includes forming sintered ceramics or calcined ceramics, forming an electrode on the sintered ceramics or the calcined ceramics,...
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7260890 |
Methods for fabricating three-dimensional all organic interconnect structures
The present invention includes methods for making liquid crystalline polymer (LCP) interconnect structures using a high temperature and low temperature single sided liquid crystalline polymer LCP...
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7257883 |
Method and apparatus for manufacturing an electric heater
In the manufacture of an electric heater, means ( 24, 26 ) is provided for feeding and guiding a ribbon heating element ( 14 ) progressively into overlying edgewise relationship with a base ( 2 )....
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7246421 |
Method for manufacturing surface acoustic wave device
A surface acoustic wave device which occupies a small mounting area and has a low profile, yet having an improved reliability, and can be made available at low cost. The surface acoustic wave...
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7228623 |
Process for fabricating a multi layer circuit assembly
Processes for fabricating a multi-layer circuit assembly and a multi-layer circuit assembly fabricated by such processes are provided. The process includes (a) providing a substrate at least one...
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7225536 |
Precasting multi-layer PCB process
A pre-casting multi-layer PCB process has steel plate mold engraved with circuitry and the epoxy coated on the mold for the epoxy to cover up a fiber glass substrate; conductive material coated on...
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7219416 |
Method of manufacturing a magnetic element
The present invention provides a composite magnetic body containing metallic magnetic powder and thermosetting resin and having a packing ratio of the metallic magnetic powder of 65 vol % to 90 vol...
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7207105 |
Method for producing an integral ceramic circuit board
A substrate for mounting an electronic component, includes a baseplate having a main surface formed with or without a recess. A ceramic substrate is provided on the main surface of the baseplate...
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7178235 |
Method of manufacturing an optoelectronic package
A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic...
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7174631 |
Method of fabricating electrical connection terminal of embedded chip
An electrical connection terminal of an embedded chip and a method for fabricating the same are disclosed. An insulating layer is provided on a circuit board integrated with a chip and has a...
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7171746 |
Process for applying conductor tracks to the surface of plastics moldings
A process is described in which surfaces of foamed plastics are provided with electrical conductor tracks, with the aid of selectively ablating processes. The process permits low-cost production...
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7140091 |
Manufacturing process for an inductive component
A process for manufacturing an inductive component intended to be installed on a printed circuit involves initially winding an electrically conductive wire to form a winding without using a former...
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7134197 |
Plastic lead frames utilizing reel-to-reel processing
Reel-to-reel manufacturing methods and systems are disclosed herein. In general, one or more plastic parts (e.g., plastic substrate) can be transported on a carrier for manufacturing of a final...
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7134194 |
Method of developing an electronic module
An electronic module and method that enable circuitry required by one form of the module (e.g., a developmental unit) to be omitted in a second form of the module (e.g., a production unit), without...
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7117597 |
Method of manufacturing liquid discharge head
A method of manufacturing a liquid discharge head provided with a liquid flow path communicating with a liquid discharge port on a substrate has a step of forming a first electrically conductive...
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7103971 |
Process for manufacturing a circuit board
A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the...
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7075023 |
Pushbutton mechanical limiter switch including movable contact located in housing passage way
A mechanical limiter switch device, having: a housing with a slot passing at least partially therearound, the slot forming a plurality of teeth in a side of the housing; a plunger movable within...
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7072735 |
Control system for utilizing active material elements in a molding system
Method and apparatus for controlling an injection molding machine having a first surface and a second surface includes a piezo-ceramic sensor configured to be disposed between the first surface and...
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7059042 |
Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink
A sheet-like thermally conductive resin composition containing 70 to 95 wt. % inorganic filler and 5 to 30 wt. % thermosetting resin composition, a lead frame as a wiring pattern, and an...
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7059028 |
Method of making certain flexible piezoelectric films
Methods of making certain piezoelectric films are disclosed. For example, a certain method of making piezoelectric films consistent with certain embodiments of the invention can include the steps...
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7051430 |
Method of manufacturing a printed board assembly
Methods of manufacturing a printed board assembly. In one embodiment, a substrate is coated with an electrically conducting material; electrical components are mounted on some areas of the...
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7051429 |
Method for forming a medium having data storage and communication capabilities
A method for forming a medium having a substrate is formed have a patterned surface with a channel pattern and a transponder having a memory is provided in the channel pattern. A conductive...
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7036221 |
Method of manufacturing a semiconductor element-mounting board
A method of manufacturing a semiconductor mounting board includes providing a base member and linear conductive members formed of metallic wires. The conductive members are constructed so that they...
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7020540 |
Temperature control
A method and apparatus are disclosed for controlling temperature of a plant comprising plural temperature control zones, wherein an effective control parameter for a first zone for which a signal...
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6981316 |
Method of manufacturing vehicle electric power distribution system
A method of assembling a power distribution apparatus including a plurality of conductive circuit plates, each conductive plate including a plurality of contact pads that are interconnected by...
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6971171 |
Method for manufacturing an ink jet recording head
The present invention provides a method for manufacturing an ink jet recording head utilizing ink bubbling by heating of an exothermic resistor to thereby eject ink and a method manufacturing the...
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6971166 |
Method of manufacturing a nonreciprocal device
A method of manufacturing a non-reciprocal component including a casing having an input/output terminal and a ground terminal formed therein, a ferrite plate, a line conductor, and a magnet...
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6938336 |
Methods of manufacturing board having throughholes filled with resin and multi-layered printed wiring board using the board
A resin filled board is manufactured by forming roughened surfaces on a conductive layer in a throughhole before it is filled with a resin, forming smooth surfaces on conductive layers on the top...
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6915567 |
Method of wiring for motorcycles
An housing of a meter unit is inserted from above into a meter unit support hole which is provided in the rear handle cover. Engagement claws of the housing are engaged with claw receiving portions...
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6898850 |
Method of manufacturing circuit board and communication appliance
A method of manufacturing a circuit board by forming a circuit pattern in a short process and capable of performing pattern transfer with stability. The manufacturing method includes a step of...
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