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7631423 |
Method and process for embedding electrically conductive elements in a dielectric layer
A method is provided for fabricating a multilayer printed circuit board, including embedded electrically conductive elements formed as part of the fabrication of the layers of the printed circuit...
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7624500 |
Printing of multi-layer circuits
The disclosure relates to circuits and methods for the manufacture of circuits, such as those which avoid the formation of undesirable short circuit paths. One such method maintains a layout area...
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7621041 |
Methods for forming multilayer structures
The present invention relates to methods of forming multilayer structures and the structures themselves. In one embodiment, a method of forming a multilayer structure comprises: providing a...
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7614145 |
Method for manufacturing multilayer circuit board and resin base material
A curable resin composition layer ( 3 ) containing an insulating resin and a curing agent is formed on the surface of an inner layer board having an electrical insulating layer ( 1 ) with a...
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7614146 |
Method for fabricating circuit board structure
The present invention provides a circuit board structure and a method of fabricating circuit board structure the same, the circuit board structure consisting of a carrier board having a first...
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7600303 |
BAW resonator bi-layer top electrode with zero etch undercut
A method of fabricating a BAW piezoelectric resonator, the method comprising the steps of providing a bottom electrode and a piezoelectric layer coupled to the bottom electrode. A bottom metal...
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7596840 |
Method for manufacturing piezoelectric thin film resonator
To provide a method for manufacturing a piezoelectric thin film resonator with excellent characteristics. A method for manufacturing a piezoelectric thin film resonator in accordance with the...
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7596862 |
Method of making a circuitized substrate
A method of making the circuitized substrate. The circuitized substrate includes a substrate having a substantially planar upper surface and a conductive layer positioned on the substantially...
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7594307 |
Method for manufacturing piezoelectric resonator
A method of manufacturing a piezoelectric resonator includes forming first electrodes larger than vibrating electrodes in an area D 1 including the vibrating electrodes on obverse and reverse...
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7587815 |
Resin-coated metal plate and method of drilling printed wiring board using the metal plate
A resin-coated metal plate used as a protective plate in drilling a printed wiring board has a metal plate and a resin film including a thermoplastic resin coated on at least one surface of the...
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7582848 |
Energy-efficient, laser-based method and system for processing target material
An energy-efficient method and system for processing target material such as microstructures in a microscopic region without causing undesirable changes in electrical and/or physical...
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7581314 |
Method of forming noble metal contacts
A semiconductor micro-electromechanical system (MEMS) switch provided with noble metal contacts that act as an oxygen barrier to copper electrodes is described. The MEMS switch is fully integrated...
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7568278 |
Method of manufacturing inductor
A method for manufacturing an inductor using a system-in-package (SIP) includes forming a first penetration electrode in a silicon substrate; depositing an insulating film on a first surface of the...
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7565738 |
Method for manufacturing circuit device
A method for manufacturing a circuit device, which is suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, is provided. In a method for...
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7562436 |
Deposition defined trackwidth for very narrow trackwidth CPP device
In one embodiment, a method of forming a CPP sensor comprises providing a sensor having a hard mask disposed on a left side thereof and a right side with a portion of the sensor material removed...
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7562447 |
Method of manufacturing printed circuit board for fine circuit formation
Disclosed is a method of manufacturing a printed circuit board for fine circuit formation, in which an unnecessary metal layer formed on the upper portion of a circuit pattern is removed through...
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7559137 |
Method for providing electrically conductive paths in polymer tubing
A method for forming electrically conductive patterns to provide an electrically conductive path on a polymer tube is provided. The method includes the steps of establishing a polymer tube and...
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7559139 |
Method for manufacturing a probe unit
A method for manufacturing a probe unit includes: (a) preparing a substrate; (b) forming a hollow part in the substrate; (c) forming a sacrificial layer that buries the hollow part on the...
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7530166 |
Method for making a radio frequency coupling structure
Method for making a coupling structure ( 10 ) comprises the steps of forming a body ( 12 B) of a polymeric material loaded with a conductive filler, providing a coupling area ( 12 C) of a...
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7526863 |
Method for manufacturing a microstructure
A method for manufacturing a microstructure comprises the steps of forming positive type resist layer (PMMA) on a base plate having heater formed thereon; forming positive type resist layer (PMIPK)...
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7523537 |
Method of manufacturing a tuning fork with reduced quadrature errror and symmetrical mass balancing
Tuning fork and method in which a pair of elongated tines having front and rear surfaces are disposed symmetrically about an axis, and balancing masses on the front surface of one tine and on the...
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7523544 |
Method for manufacturing keypad
In a method for manufacturing compact keypad, a first molding die with bottom surface of smooth face, matted face or patterned layer is prepared. Colloid is injected into the first molding die and...
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7523549 |
Dimensionally stabilized flexible circuit fabrication method and product
A method of fabricating a flexible circuit interconnect comprising a conductive pattern on a flexible substrate comprising layers of different components having different coefficients of thermal...
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7520053 |
Method for manufacturing a bump-attached wiring circuit board
An object of the present invention is to manufacture a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as...
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7520049 |
Method for manufacturing a planar resistance heating element
Disclosed herein is a manufacturing method of a planar resistance heating element and a planar resistance heating element made using the method. In the manufacturing method of a planar resistance...
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7516544 |
Spacers for reducing crosstalk and maintaining clearances
In one aspect of the invention is a method for reducing crosstalk and maintaining clearances between traces on a printed circuit board design. Crosstalk caused by placing traces a virtual printed...
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7518065 |
Printed wiring board for plasma display and process for producing the same
A printed wiring board for a plasma display, comprising: an insulating film having a folding slit(s) provided at its folding position; a wiring pattern provided on at least one surface of the...
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7513037 |
Method of embedding components in multi-layer circuit boards
A method for producing a circuit board having an integrated electronic component comprising providing a circuit board substrate having a first substrate surface and a second substrate surface,...
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7509715 |
Method of manufacturing ultrasound radiating members for a catheter
A method comprises providing a substantially planar slab of piezoelectric material having a top surface. The method further comprises drilling a plurality of holes through the top surface and into...
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7503111 |
Method for increasing wiring channels/density under dense via fields
A method for increasing the wiring channels/density under dense via fields of a circuit board are provided. With the method, the power/ground lines for the circuit board are designed to be provided...
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7493680 |
Method of fabricating airtight terminals
To provide an airtight terminal and a piezoelectric vibrator having a strong rigidity of a lead despite a small-sized constitution, and provide a method of fabricating an airtight terminal...
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7484280 |
Method for manufacturing a surface acoustic wave element having an interdigital transducer (IDT) electrode
A method for manufacturing a surface acoustic wave element having an interdigital transducer (IDT) electrode formed on a semiconductor substrate includes a) forming an insulation layer on a surface...
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7478474 |
Method of manufacturing shielded electronic circuit units
A metallic film and a grounding pattern are surely connected to each other so as to achieve electrical shield of an electronic circuit unit. In an electronic circuit unit, the metallic film is...
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7475461 |
Method and manufacturing a piezoelectric thin film element
The present invention provides a piezoelectric thin film element with superior piezoelectric properties in which the condition of the crystal of the piezoelectric thin film is appropriately...
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7469466 |
Method for providing a temporary, deep shunt on wafer structures for electrostatic discharge protection during processing
A method of temporarily protecting an electrically sensitive component from damage due to electrostatic discharge is disclosed. The method includes the steps of defining a first shield that forms a...
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7469941 |
Method of producing a wiring board
A wiring board comprises a substrate; a resin layer which is selectively formed on one main surface of the substrate and has fine metal particles contained or adhered to its surface; and a...
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7451540 |
Method for fabricating a printed circuit board
Fabricating ( 100, 1300 ) a printed circuit board includes fabricating patterned conductive traces ( 305, 310, 1410, 1415 ) onto a foil, laminating the patterned conductive traces to a printed...
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7441316 |
Method for manufacturing electronic apparatus
A method for manufacturing an electronic apparatus comprises forming a quartz crystal tuning fork resonator having a fundamental mode of vibration and a second overtone mode of vibration each...
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7437813 |
Probe repair methods
A method and apparatus for repairing a probe on a probe card is provided. A plurality of beams is formed on a beam panel. The plurality of beams includes a replacement beam. After identifying a...
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7434311 |
Printed wiring board manufacturing method
This printed wiring board manufacturing method comprises the steps of providing a large number of through holes (for a through-hole) in a substrate made of an insulating material of which both...
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7434310 |
Process to reform a plastic packaged integrated circuit die
A process for reforming a plastic packaged integrated circuit die ( 100 ) includes grinding away ( 305 ) a bottom side ( 210 ) of a plastic package ( 205 ) and portions of a set of leads ( 110 )...
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7428776 |
Method of manufacturing a magnetic head
A method of manufacturing a thin-film coil in which a first coil and a second coil each having a desired number of winding are electrically connected in series and the second coil is formed between...
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7421767 |
Method for manufacturing a piezoelectric vibration device
Manufacturing a piezoelectric vibration device, includes: forming a bonding electrode on a part of a piezoelectric substrate to which a cover makes contact; forming a part defining a through hole...
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7421779 |
Multilayer board manufacturing method
A base material ( 20 ) is arranged on top of at least one first internal layer base material ( 10 ), and a second internal base material ( 30 ) is arranged underneath the base material ( 10 ). And...
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7418779 |
Method for balancing power plane pin currents in a printed wiring board using collinear slots
A method and apparatus for balancing power plane pin currents in a printed wiring board (PWB) uses a set of collinear slots in the form of a dashed line to reduce pin counts required for power...
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7406761 |
Method of manufacturing vibrating micromechanical structures
A method for fabrication of single crystal silicon micromechanical resonators using a two-wafer process, including either a Silicon-on-insulator (SOI) or insulating base and resonator wafers,...
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7404251 |
Manufacture of printed circuit boards with stubless plated through-holes
A process of copper plating a through-hole in a printed circuit board, and the printed circuit board made from such process. The process comprises: providing a printed circuit board with at least...
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7401402 |
Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor
The invention relates to a method for high-frequency tuning a high-frequency plug connector, comprising a printed circuit board that has both contact points for high-frequency contacts as well as...
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7398588 |
SOI component comprising margins for separation
A method for producing a component is provided, in particular a deformation sensor, having a sensor element which includes at least one region that is sensitive with respect to expansion or...
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7399399 |
Method for manufacturing semiconductor package substrate
A method for manufacturing a semiconductor package is proposed. A circuit board with a circuit layer on at least one surface thereof is provided. The circuit board has at least one free area, and...
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