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7617601 |
Manufacturing process for smaller active areas in flat panel X-ray detectors
The present invention generally relates to a method for forming a flat panel for an X-ray detector device. The method comprises forming an active area of a first size on a substrate of a second...
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7617598 |
Method of making a thermally isolated via structure
This document discusses, among other things, a method including providing a laminate having a first conductive layer, a second conductive layer and an insulator between the first and second...
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7614147 |
Method of creating contour structures to highlight inspection region
An integrated circuit has a wiring layer below an insulator layer. A pad comprises a conductive material that is on the insulator layer. The pad has a wirebond connection region and a probe pad...
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7614145 |
Method for manufacturing multilayer circuit board and resin base material
A curable resin composition layer ( 3 ) containing an insulating resin and a curing agent is formed on the surface of an inner layer board having an electrical insulating layer ( 1 ) with a...
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7614141 |
Fabricating substrates having low inductance via arrangements
A low inductance via arrangement for multilayer ceramic (MLC) substrates is provided. With the MLC substrate and via arrangement of the illustrative embodiments, the via-field inductance for a...
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7607223 |
Electro-fluidic interconnect attachment
An electro-fluidic interconnection. The interconnection includes a body ( 200 ) formed of a ceramic material. The body ( 200 ) is provided with an aperture ( 206 ) having a profile suitable for...
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7603772 |
Methods of fabricating substrates including one or more conductive vias
Substrate precursor structures include a substrate blank having at least one aperture extending substantially through the substrate blank. At least a portion of at least one conductive layer covers...
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7603771 |
Method of manufacturing a combined multilayer circuit board having embedded chips
A method of providing at least two multilayer circuit boards, combining the at least two multilayer circuit boards to form a combined multilayer circuit board, and forming multiple outer conductive...
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7600315 |
Method of manufacturing printed circuit board
This invention relates to a method of manufacturing a printed circuit board, in which a dummy metal frame enclosing the outer periphery of a product part is formed, thus simultaneously assuring the...
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7596862 |
Method of making a circuitized substrate
A method of making the circuitized substrate. The circuitized substrate includes a substrate having a substantially planar upper surface and a conductive layer positioned on the substantially...
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7596842 |
Method of making multilayered construction for use in resistors and capacitors
The invention concerns a method of making multilayered constructions useful in forming capacitors and resistors, which may be used in the manufacture of printed circuit boards and microelectronic...
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7594322 |
Methods of fabricating substrates including at least one conductive via
A method of fabricating a substrate is disclosed. Apertures are formed in a substrate blank. A conductive layer is formed on opposing surfaces of the substrate, as well as inside the apertures....
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7594321 |
Substrate-imprinting methods
A package includes at least one electronic component mounted on a substrate formed through imprinting. In an embodiment, the substrate may comprise conductive traces, vias, and patterns of lands on...
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7594320 |
Method of manufacturing printed wiring board
A solder resist comprising a thermosetting resin is printed on a surface of an insulating board ( 7 ) having a conductor circuit ( 6 ). The solder resist is then heat-cured to form an insulating...
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7591071 |
Manufacturing Method of Semiconductive Element and Ink Jet Head Substrate
A semiconductor device includes a lateral end surface and a connection electrode for external electrical connection. The connection electrode is exposed at the side surface. A manufacturing method...
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7591067 |
Thermally enhanced coreless thin substrate with embedded chip and method for manufacturing the same
A thermally enhanced coreless thin substrate with embedded chips, which mainly includes a patterned carrier metal layer, at least one chip, at least one dielectric layer and at least one wiring...
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7589398 |
Embedded metal features structure
A method and structure for creating embedded metal features includes embedded trace substrates wherein bias and signal traces are embedded in a first surface of the embedded trace substrate and...
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7585419 |
Substrate structure and the fabrication method thereof
A substrate structure and the fabrication method thereof are provided herein. The present invention utilizes a laminate as the support of the package process and then removes the laminate after the...
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7584535 |
Method of manufacturing multi-layer wiring board
A method of manufacturing a multi-layer circuit wiring board, including simultaneously laminating a second flexible resin film on one surface of a first flexible resin film having a first wiring...
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7581297 |
Method of fabricating piezoelectric vibrator and electronic apparatus and radio wave timepiece having piezoelectric vibrator
A piezoelectric vibrator has an airtight terminal comprised of a lead terminal and a piezoelectric member. The lead terminal has an inner lead portion and an outer lead portion. The piezoelectric...
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7579857 |
Electrical contact device of probe card
An electrical contact device of a probe card includes a base and probes on the base. The base has a top side with a cavity thereon, and the cavity has sidewalls connected to the top side. Anchored...
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7578058 |
Production method of a multilayer ceramic substrate
A multilayer ceramic substrate having a cavity is formed by the steps of laminating a plurality of ceramic green sheets including ceramic green sheets having through holes corresponding to the...
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7578048 |
Patterns of conductive objects on a substrate coated with inorganic compounds and method of producing thereof
According to embodiments of the present invention, a method for manufacturing a pattern of conductive elements on a substrate is provided. The method includes depositing in a vacuum deposition...
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7574794 |
Method of manufacturing a touch screen
A method for manufacturing a touch screen that deposits a conductive layer or coating directly onto a surface of a sheet or ribbon or roll of thin glass material. The coated thin glass material may...
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7574787 |
Methods to make piezoelectric ceramic thick film array and single elements with a reusable single layer substrate structure
A method of producing at least one piezoelectric element includes depositing a piezoelectric ceramic material onto a surface of a first substrate to form at least one piezoelectric element...
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7571540 |
Production method of suspension board with circuit
A method of producing a suspension board with circuit, wherein after an insulating base layer is formed on a metal supporting board, a conductive pattern including a ground wiring pattern and a...
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7568285 |
Method of fabricating a self-aligned print head
An orifice array plate and a charge plate for a continuous ink jet printer print head are integrally fabricated by providing an electrically non-conductive substrate; forming, on one side of the...
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7565739 |
Method of making zinc-aluminum alloy connection
A conductor is at least partially exposed on the surface of a body. A wiring is formed for connection to the conductor. The conductor is made of a Zn—Al alloy. Heat is then applied to the...
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7565737 |
Manufacturing method of package substrate
A package substrate for carrying a chip with a plurality of bumps thereon is provided. The package substrate includes a first substrate, and an interposer. The first substrate has a first circuit...
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7565736 |
Process for manufacturing printed circuit boards and a machine for this purpose
Process and machine for manufacturing printed circuit boards wherein a press packet comprised of at least two press plates of metal material between which is arranged a printed circuit board...
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7565724 |
Method of manufacturing a piezoelectric element
A method for manufacturing a piezoelectric element includes the steps of forming a first electrode above a substrate, forming, above the first electrode, a piezoelectric layer composed of a...
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7562447 |
Method of manufacturing printed circuit board for fine circuit formation
Disclosed is a method of manufacturing a printed circuit board for fine circuit formation, in which an unnecessary metal layer formed on the upper portion of a circuit pattern is removed through...
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7562445 |
Method of manufacture of an identification wristband construction
A method of manufacture of a wristband includes the steps of providing a bottom substrate. First circuit elements are deposited on the bottom substrate. A dielectric material is deposited at...
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7559139 |
Method for manufacturing a probe unit
A method for manufacturing a probe unit includes: (a) preparing a substrate; (b) forming a hollow part in the substrate; (c) forming a sacrificial layer that buries the hollow part on the...
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7559137 |
Method for providing electrically conductive paths in polymer tubing
A method for forming electrically conductive patterns to provide an electrically conductive path on a polymer tube is provided. The method includes the steps of establishing a polymer tube and...
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7555836 |
Method of making lithographic contact elements
A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a...
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7555835 |
Fabricating a monolithic microwave integrated circuit
A method of fabricating a monolithic microwave integrated circuit (MMIC) with one or more coupling transmission structures protruding from the MMIC includes providing a support substrate, providing...
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7552534 |
Method of manufacturing an integrated orifice plate and electroformed charge plate
An integrated orifice array plate and a charge plate is fabricated for a continuous ink jet print head by providing an electrically non-conductive orifice plate substrate having first and second...
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7552531 |
Method of manufacturing a printed wiring board having a previously formed opening hole in an innerlayer conductor circuit
A method of producing a printed wiring board comprising innerlayer conductor circuits among insulating layers and blind via-holes formed by irradiating laser beams from the outermost surface of the...
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7552525 |
Method for the production of a circuit board element
A circuit board element ( 11 ) and production thereof are disclosed, whereby a noble metal ( 16 ) is applied to a structured conductor layer ( 13 ) on a circuit board substrate ( 12 ), comprising...
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7552522 |
Method of making a sensing apparatus
A method and apparatus for enhancing the integrity of an implantable sensor. Voids formed between an outer tubing and a sensor substrate or spacing element may be back-filled with a curable,...
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7549220 |
Method for making a multilayer circuit
A method for the manufacture of a multilayer circuit comprising a liquid crystalline polymer layer, the method comprising treating the multilayer circuit with an amount of heat effective to raise...
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7546681 |
Manufacturing method for wiring circuit substrate
A method of making a microelectronic element includes making a connection component by providing a metal layer having a top surface and a bottom surface, providing a dielectric layer over the top...
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7546677 |
Method for fabricating a micro-electromechanical system switch
A method includes forming a signal line on the substrate so as to have a predetermined opening portion; at least one supporting frame each formed on the substrate at both sides of the signal line;...
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7546106 |
Electronic circuit
An electronic circuit capable of carrying out communications by inductive coupling with minimum power consumption between substrates. Although the amplification factor of the amplifier 10 a is 1,...
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7543377 |
Perimeter matrix ball grid array circuit package with a populated center
A ball grid array (BGA) integrated circuit package which has an outer two-dimensional array of solder balls and a center two-dimensional array of solder balls located on a bottom surface of a...
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7543376 |
Manufacturing method of flexible printed wiring board
Provided is an FPC, which comprises an insulating layer 2 , wiring layers 3 and 4 laminated above and under the insulating layer 2 , and a layer connection for connecting the wiring layers 3...
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7543375 |
Process for filling via hole in a substrate
A process for producing an electronic component The electronic component includes a base material equipped with a core material and having a conductor layer on at least one surface thereof; a via...
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7543374 |
Method of manufacturing wiring substrate
In a method of manufacturing a wiring substrate according to the present invention, a metal foil is tentatively fixed onto a temporary substrate, which is made of a nonwoven fabric impregnated with...
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7543373 |
Gel package structural enhancement of compression system board connections
A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of...
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