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7402758 |
Telescoping blind via in three-layer core
A multilayer PCB including at least one carrier, wherein the at least one carrier comprises a pseudo three-layer core. Each three-layer core includes a first metal layer, a first dielectric layer,...
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7401403 |
Method for forming ceramic thick film element arrays with fine feature size, high-precision definition, and/or high aspect ratios
A method is provided that includes providing a mold on a temporary substrate, e.g., a sapphire substrate. Next, a material such as PZT paste is deposited into the mold. Then, the mold is removed to...
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7401402 |
Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor
The invention relates to a method for high-frequency tuning a high-frequency plug connector, comprising a printed circuit board that has both contact points for high-frequency contacts as well as...
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7400155 |
Membrane probing system
A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the...
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7399399 |
Method for manufacturing semiconductor package substrate
A method for manufacturing a semiconductor package is proposed. A circuit board with a circuit layer on at least one surface thereof is provided. The circuit board has at least one free area, and...
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7392584 |
Methods and apparatus for a flexible circuit interposer
Methods and apparatus for testing a semiconductor device are disclosed. A flexible circuit interposer includes a flexible circuit substrate which allows in-situ probing of an attached device...
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7390973 |
Memory module and signal line arrangement method thereof
The pesent invention discloses a memory module and a signal line arrangement method thereof. The memory module includes memory chips mounted on both sidees in a mirror form; and a printed circuit...
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7389581 |
Method of forming compliant contact structures
A compliant contact structure and contactor card for operably coupling with a semiconductor device to be tested includes a substantially planar substrate with a compliant contact formed therein....
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7389570 |
Surface acoustic wave device manufacturing method, surface acoustic wave device, and communications equipment
After electrode patterning on an electrode forming surface of a piezoelectric substrate 2 (FIG. 1 ( b )), a conductor layer is formed on an electrode non-forming surface of the piezoelectric...
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7389569 |
Method for manfacturing an acoustic matching member
A method for manufacturing an acoustic matching member, the acoustic matching member being incorporated into an ultrasonic transducer for transmitting and receiving ultrasonic waves, and including:...
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7386937 |
Method of making a biosensor
A method of making a biosensor is provided. The method includes providing an electrically conductive material on a base and partially removing the conductive material using laser ablation from the...
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7386936 |
Method for manufacturing in electrically conductive pattern
The present invention relates to a method for manufacturing an electrically conductive pattern by printing a layer comprising metal oxide on a carrier substrate ( 2 ) and reducing the metal oxide...
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7383630 |
Method for making a circuit plate
A method for making a circuit plate includes: forming first holes in an insulating layer; forming a conductive layer on the insulating layer such that a portion of the conductive layer fills the...
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7383629 |
Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof
A circuitized substrate in which two conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to an interim dielectric layer. Each of the two foil surfaces which physically...
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7380338 |
Circuit board and manufacturing method thereof
A circuit board includes a substrate, an insulating layer, at least one protrusion, and a first circuit layer. The insulating layer is disposed on the substrate and has at least one...
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7380331 |
Methods for forming a reed sensor
A method comprises depositing first and second lead layers in end regions which surround a central region; and forming a read sensor in the central region such that a first edge of the read sensor...
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7380318 |
Method of manufacturing liquid discharge head
In a method of manufacturing a liquid discharge head, liquid in a pressure generation chamber is pressurized by a piezoelectric driving force of a piezoelectric element, and is discharged from a...
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7377034 |
Method for flexible circuits
A flexible printed circuit improves data transfer rates by disposing ground wires in a ground plane proximate to signal wires disposed in a signal channel plane. One or more ground wires is...
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7377032 |
Process for producing a printed wiring board for mounting electronic components
A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via 4...
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7377030 |
Wiring board manufacturing method
The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is...
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7375288 |
Apparatuses and methods for improving ball-grid-array solder joint reliability
In some embodiments, apparatuses and methods for improving ball-grid-array solder joint reliability in printed circuit boards. Such apparatuses may comprise, in an exemplary embodiment, a stiffened...
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7375278 |
Mounting components to a hardware casing
Methods, systems, and media to mount one or more components to a hardware casing are disclosed. Embodiments include hardware and/or software for determining a pattern of interconnects to apply to...
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7373717 |
Method of manufacturing a self-sustaining center-anchor microelectromechanical switch
Provided is a manufacturing method of self-sustaining center-anchor microelectromechanical switch driven by an electrostatic force used for controlling a signal transmission in an electronic...
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7370412 |
Method for connecting electronic device
An electronic device connecting method according to a first aspect of the present invention includes: mounting an electronic device having at least one electrode portion on a sheet-like porous...
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7370410 |
Method of manufacturing a device, device, non-contact type card medium, and electronic equipment
Wirings 2 B 1 are formed by application of heat treatment after an ink jet system is used to discharge a conductive liquid L onto a provisional substrate 5 having a predetermined repellent...
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7370406 |
Method of manufacturing a thin film structure
A thin film magnetic head is described, the magnetic head having an insulating layer and a protrusion which has an upper portion and a base portion, and the upper portion has an extended portion....
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7367119 |
Method for forming a reinforced tip for a probe storage device
Systems and methods in accordance with the present invention can include a tip contactable with a media. In an embodiment, the tip comprises a substantially hollow structure formed of a metal. The...
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7367118 |
Method for forming metal wires by microdispensing pattern
A method of forming a metal wire by microdispensing a pattern is provided. In the method, a substrate has been treated by SAM is firstly provided. Then, a catalytic agent is microdispensed on the...
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7367095 |
Method of making an acoustically coupled transformer
Embodiments of an acoustically-coupled transformer have a first stacked bulk acoustic resonator (SBAR) and a second SBAR. Each of the SBARs has a lower film bulk acoustic resonator (FBAR) and an...
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7361845 |
Wiring line for high frequency
Wiring lines for use at a high frequency having reduced resistance and/or inductance are disclosed that may be readily manufactured in a semiconductor integrated circuit. Wiring lines can include...
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7360306 |
Process for producing a cover with a glass pane and electrical function elements
A process for producing a cover ( 11 ) with a glass pane ( 14 ) for a motor vehicle roof, in which, first, a combination film ( 10 ) with a shatter prevention film and electrical function elements...
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7356924 |
Manufacturing process for a power distribution assembly of an electrical system
A modular multi-component power distribution system is provided having a plurality of modular components which includes a bus-bar-like power distribution assembly (PDA), branching connectors, flex...
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7356923 |
Rigid flex interconnect via
A rigid-flexible printed wire assembly which employs a blind via for interconnection is disclosed. Preferably, the assembly includes a rigid section having a through hole formed therethrough and a...
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7356922 |
Method of fabricating a rate gyroscope and accelerometer multisensor
Three magnetic substrates are provided, the first substrate forms the rotor and the other two form the outer stator. A series of spaced concentric grooves and spaced spiral grooves are formed in...
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7356921 |
Method for forming a conductive layer pattern
A method for forming a conductive layer pattern by selectively depositing droplets containing conductive material onto a porous receiving layer. Much of the conductive material is left on the...
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7356917 |
Method for manufacturing multi-layer printed circuit board
A multi-layer printed circuit board includes an insulation substrate; a surface conductive pattern disposed on a surface of the insulation substrate; and an inner conductive pattern embedded in the...
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7356913 |
Process for manufacturing a microsystem
A process for making microswitches or microvalves, composed of a substrate and used for shifting between a first state of functioning and a second state of functioning by means of a bimetal-effect...
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7353600 |
Circuit board fabrication method and circuit board
A circuit board fabrication method including: forming first conductive interconnection 2 onto insulator substrate 1; applying resin film 41, which is to be interlevel insulator layer 42 for...
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7353599 |
Fiducial markings for quality verification of high density circuit board connectors
Methods for qualifying the accuracy of a circuit board may include providing a printing mask pattern for first and second sides of the circuit board with a first sequence of spaced indicia parallel...
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7353598 |
Assembly comprising functional devices and method of making same
Methods and apparatuses for an electronic assembly. A material is selectively printed on a web substrate at one or more selected areas. The web substrate includes a plurality of functional...
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7353595 |
Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon
A tape substrate includes IC lands electrically connected to pins of a driver IC (integrated circuit), circuit board terminal lands electrically connected to an external circuit board, test lands...
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7353592 |
Method of fabricating an RF substrate with selected electrical properties
Method for fabricating a textured dielectric substrate ( 400 ) for an RF circuit. The method can include the step ( 104 ) of selecting a plurality of dielectric substrate materials, each having a...
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7353590 |
Method of forming printed circuit card
A method of forming a printed circuit card with a metal power plane layer between two photoimageable dielectric layers is provided. Photoformed metal filled vias and plated through holes are in the...
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7350298 |
Method for fabricating circuit board with conductive structure
A method for fabricating a circuit board having a conductive structure is disclosed. The method includes: forming first and second insulating protective layers respectively on first and second...
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7350297 |
Method of manufacturing a wiring substrate
A first plating foundation layer is formed by printing on a front face of a sheet-shaped insulating substrate. By inserting a punch into the sheet-shaped insulating substrate having the first...
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7350296 |
Method of fabricating a printed circuit board including an embedded passive component
Disclosed is a method of fabricating a PCB including an embedded passive component and a method of fabricating the same and a method of fabricating the same. The PCB includes at least two circuit...
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7350295 |
Method of fabricating multi-layered printed circuit board for optical waveguides
A method of fabricating a multi-layered PCB, in which the optical waveguide component is inserted into the PCB in such a way that a prepreg adhesive does not block an optical signal entrance of the...
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7350294 |
Method of electroplating a plurality of conductive fingers
A method of electroplating may include placing a pair of conductive fingers in proximity to an edge of a circuit board, where the pair are coupled to be electrically isolated, and where the pair...
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7350292 |
Method for affecting impedance of an electrical apparatus
A method for affecting an impedance of a portion of an electrical circuit loop in an electrical circuit apparatus includes providing an electrical circuit apparatus having at least a portion of an...
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7350285 |
Method of manufacturing a switch panel to be disposed close to a magnetic sensor
A method of manufacturing a movable contact unit includes manufacturing a movable contact, sticking the movable contact to a base sheet made of insulating resin, and applying demagnetization to the...
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