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7200907 |
Method of manufacturing piezoelectric device
Exemplary embodiments of the present invention provide a method of manufacturing a piezoelectric device that includes a piezoelectric layer having high crystallinity in which crystal orientation is...
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7200927 |
Method for producing a wiring transfer sheet
A wiring transfer sheet including a carrier base and a wiring layer formed thereon is produced so that an exposed area of a surface of the carrier base on which the wiring layer is formed has a...
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7197818 |
Method and structures for implementing customizable dielectric printed circuit card traces
A method and structures are provided for implementing customizable dielectric printed circuit card traces. A void is defined near selected signal traces. The void is then filled with a dielectric...
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7197817 |
Method for forming contact bumps for circuit board
Disclosed is a method of forming bump electrodes on wired circuit boards. A high-concentration impurity Si template doped with boron and having a pit formed therein is prepared. A plated resist is...
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7194799 |
Process for fabricating a high density multi-layer microcoil
A high density multi-layer microcoil includes a substrate, a multi-layer coil winding, a magnetic core and a dry film photoresist structure. The multi-layer coil winding and the magnetic core are...
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7189598 |
Wiring board, method of manufacturing the same, semiconductor device, and electronic instrument
A receiving layer is formed from a thermosetting resin precursor. An interconnecting layer is formed on the receiving layer from a dispersion liquid containing conductive particles. Heat is applied...
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7188411 |
Process for forming portions of a compound material inside a cavity
A process for forming portions of a compound material within an electronic circuit includes the formation of a cavity having at least one opening facing onto an access surface. The cavity...
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7181836 |
Method for making an electrode structure
An electronic device such as a sensor or a NEMS. The electronic device comprises at least one substrate; a plurality of electrodes disposed on the substrate; and at least one nano-wire growing from...
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7181838 |
Method of fabricating identifiable flexible printed circuit board
A method of fabricating identifiable flexible printed circuit board (PCB) disposed to an inkjet cartridge includes, providing a flexible substrate having a first surface. A conductive layer is...
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7181839 |
Method for producing a circuit board
After disposing metallic foils on either surface of a prepreg sheet of low compressibility having conducting holes filled with conductive paste, the prepreg sheet is compressed in a state of being...
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7178234 |
Method of manufacturing multi-layer printed circuit board
Through holes 36 are formed to penetrate a core substrate 30 and lower interlayer resin insulating layers 50 , and via holes 66 are formed right on the through holes 36 , respectively. Due...
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7178235 |
Method of manufacturing an optoelectronic package
A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic...
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7178233 |
Process for producing a collapsed filled via hole
A process for producing a printed wiring board-forming sheet comprising a resin sheet having a through hole in the thickness direction and a metal chip inserted in the through hole. The sheet is...
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7178223 |
Method of manufacturing a movable contact unit to be disposed close to a magnetic sensor
A method of manufacturing a movable contact unit includes manufacturing a movable contact, sticking the movable contact to a base sheet made of insulating resin, and applying demagnetization to the...
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7174630 |
Method for fabricating connection terminal of circuit board
A method for fabricating connection terminals of a circuit board is proposed. The method involves providing a circuit board with connection pads thereon, forming an insulating layer with first...
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7174631 |
Method of fabricating electrical connection terminal of embedded chip
An electrical connection terminal of an embedded chip and a method for fabricating the same are disclosed. An insulating layer is provided on a circuit board integrated with a chip and has a...
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7174632 |
Method of manufacturing a double-sided circuit board
A circuit board including a desired number of electrically insulating layers and wiring layers laminated alternately, and an inner via hole for securing an electrical connection between the wiring...
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7172439 |
DVD integrated CRT television and connector fixing structure
The present invention makes it possible to fix connector pins at low cost. Connector pins penetrate both a holding substrate and a main substrate. The connecter pins can be restrained from an...
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7171746 |
Process for applying conductor tracks to the surface of plastics moldings
A process is described in which surfaces of foamed plastics are provided with electrical conductor tracks, with the aid of selectively ablating processes. The process permits low-cost production...
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7168163 |
Full wafer silicon probe card for burn-in and testing and test system including same
A full-wafer probe card is disclosed along with related methods and systems. The probe card includes test probes comprising cantilever elements configured and arranged with probe tips in a pattern...
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7168164 |
Methods for forming via shielding
Methods to shield conductive layer from via. A protective coating of insulating material is formed around a clearance hole in a conductive layer of a printed circuit board, so that the conductive...
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7168167 |
Nozzle and drive circuitry fabrication method
A method of fabricating an inkjet printhead comprises forming drive circuitry and a plurality of nozzles on a substrate using an integrated circuit fabrication technique. The drive circuitry...
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7165322 |
Process of forming socket contacts
A socket contact formation process comprises forming a contact head from a conductive material, forming a contact body from a semiconductive material configured to be electrically conductive; and...
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7165323 |
Method of manufacturing a touch screen
A method for manufacturing a touch screen that deposits a conductive layer or coating directly onto a surface of a sheet or ribbon or roll of thin glass material. The coated thin glass material may...
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7165298 |
Method of making a surface acoustic wave device
A surface acoustic wave die system and method are disclosed herein, including a surface acoustic wave sensor comprising one or more surface acoustic wave die disposed and hermetically sealed...
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7162796 |
Method of making an interposer with contact structures
A method of making an interposer having an array of contact structures for making temporary electrical contact with the leads of a chip package. The contact structures may make contact with the...
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7159313 |
Solderless electronics packaging and methods of manufacture
To decrease the thickness, or stack height, of an electronics package, the package includes a solderless compression connector between an integrated circuit (IC) package and a substrate such as a...
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7159303 |
Method for manufacturing magnetic head device
The magnetoresistance effect element is of a multilayered structure having at least magnetic layers and an intermediate layer of an insulating material, a semiconductor or an antiferromagnetic...
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7159308 |
Method of making a circuit board
Provided is a method of forming a circuit board including (a) providing a first conductive sheet; (b) selectively removing one or more portions of the first conductive sheet to form a first panel...
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7159309 |
Method of mounting electronic component on substrate without generation of voids in bonding material
When an electronic component is mounted on a substrate, the electronic component is first placed on the substrate with a solid support interposed between the electronic component and the substrate....
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7161088 |
System, method and apparatus for optimizing power delivery and signal routing in printed circuit board design
A system, method and apparatus for providing a printed circuit board having optimized power delivery planes and signal routing regions are disclosed. In one aspect, the present disclosure teaches a...
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7155823 |
Manufacturing inkjet printheads with large numbers of nozzles
A method of construction of an inkjet printhead having a large array of inkjet nozzle arrangements by defining a single inkjet nozzle arrangement for the ejection of ink from a single nozzle and...
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7155820 |
Method for manufacturing printed circuit board
The present invention provides a method of manufacturing a printed circuit board, which includes preparing a dielectric substrate, coating surfaces of the dielectric substrate, filling a via hole...
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7155816 |
Method for producing a multilayer ceramic substrate
A method for producing a multilayer ceramic substrate having a cavity formed therein includes punching a through opening corresponding to the cavity in green sheets constituting a laminate, and...
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7155812 |
Method for producing a tube
A method is described for producing tubular substrates having parallel spaced concentric rings of electrical conductors that can be used as the drift tube of an Ion Mobility Spectrometer (IMS). The...
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7152313 |
Package substrate for integrated circuit and method of making the substrate
In some embodiments, an article of manufacture includes a metal layer and a first dielectric layer in contact with a first face of the metal layer. The article of manufacture also includes a second...
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7152317 |
Circuit forming method
A system and method of forming a circuit. The system and method includes layering an impressionable material and a conductive material, defining adjacent charge paths on the conductive material,...
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7152312 |
Method for transmitting current through a substrate
A method for transmitting high-frequency current through a substrate is provided. The method comprises receiving the high-frequency current at a via passing through at least one conductive plane...
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7152315 |
Method of making a printed circuit board
A method 10, 80, 81 for making multi-layer electronic circuit boards 77, 137, 139 having metallized apertures 18, 20, 34, 40, 104, 106, 120.
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7152318 |
Method for manufacturing built-up printed circuit board with stacked type via-holes
A built-up printed circuit board includes stacked micro via-holes, each of which is provided for interconnection between layers in the printed circuit board, and in each of which a filling...
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7152289 |
Method for forming bulk resonators silicon <110> substrate
A method for forming a device on a substrate of <110> silicon includes forming a first conductive layer onto the substrate, and forming a piezoelectric layer on the first portion of a first...
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7146714 |
Manufacturing a magneto-optical write/read head
A method of manufacturing a digital magneto-optical signal write/read head including a thin-film in-plane magnetic coil disposed on an outwardly directed surface of a coil substrate. Coil lead in...
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7146720 |
Fabricating a carrier substrate by using a solder resist opening as a combination pin one indicator and fiducial
A method for forming a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions of prior art fiducials and pin one...
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7146722 |
Method of forming a bond pad structure
A bond pad structure comprising two bond pads, methods of forming the bond pad structure, an integrated circuit die incorporating the bond pad structure, and methods of using the bond pad structure...
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7143487 |
Method of manufacturing the matrix type ultrasonic probe
A matrix type ultrasonic probe is disclosed, which has a backing material, and a plurality of piezoelectric elements having upper and lower face electrodes, respectively, and arrayed in...
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7143509 |
Circuit board and processing method thereof
A circuit board essentially comprises a first laminated structure, at least a first plated through hole, at least a second laminated structure, a middle dielectric layer and at least a second...
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7143504 |
Method of manufacturing a display structure
A method of manufacturing a display structure includes the steps of arranging at least a display area, an extension area, and an IC mounting area on a display substrate, connecting a flexible tape...
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7140085 |
Process for manufacturing a capacitive vacuum measuring cell
A capacitive vacuum measuring cell includes first and second ceramic housing bodies ( 1, 4 ) joined by an edge seal ( 3 ). A thin ceramic membrane ( 2 ) is supported between first and second...
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7140084 |
Method of producing thin film bulk acoustic resonator
A method of producing a thin film bulk acoustic resonator having a piezoelectric layer, a first electrode joined to a first surface of the piezoelectric layer, and a second electrode joined to a...
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7140103 |
Process for the production of high-density printed wiring board
Process for producing a high-density printed wiring board, comprising:
providing an ultrathin-copper-foil-clad board having a hole and outermost copper foil thickness of 5 μm or less,...
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