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7375288 |
Apparatuses and methods for improving ball-grid-array solder joint reliability
In some embodiments, apparatuses and methods for improving ball-grid-array solder joint reliability in printed circuit boards. Such apparatuses may comprise, in an exemplary embodiment, a stiffened...
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7370406 |
Method of manufacturing a thin film structure
A thin film magnetic head is described, the magnetic head having an insulating layer and a protrusion which has an upper portion and a base portion, and the upper portion has an extended portion....
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7370410 |
Method of manufacturing a device, device, non-contact type card medium, and electronic equipment
Wirings 2 B 1 are formed by application of heat treatment after an ink jet system is used to discharge a conductive liquid L onto a provisional substrate 5 having a predetermined repellent...
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7370412 |
Method for connecting electronic device
An electronic device connecting method according to a first aspect of the present invention includes: mounting an electronic device having at least one electrode portion on a sheet-like porous...
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7367118 |
Method for forming metal wires by microdispensing pattern
A method of forming a metal wire by microdispensing a pattern is provided. In the method, a substrate has been treated by SAM is firstly provided. Then, a catalytic agent is microdispensed on the...
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7367095 |
Method of making an acoustically coupled transformer
Embodiments of an acoustically-coupled transformer have a first stacked bulk acoustic resonator (SBAR) and a second SBAR. Each of the SBARs has a lower film bulk acoustic resonator (FBAR) and an...
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7367119 |
Method for forming a reinforced tip for a probe storage device
Systems and methods in accordance with the present invention can include a tip contactable with a media. In an embodiment, the tip comprises a substantially hollow structure formed of a metal. The...
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7361845 |
Wiring line for high frequency
Wiring lines for use at a high frequency having reduced resistance and/or inductance are disclosed that may be readily manufactured in a semiconductor integrated circuit. Wiring lines can include...
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7360306 |
Process for producing a cover with a glass pane and electrical function elements
A process for producing a cover ( 11 ) with a glass pane ( 14 ) for a motor vehicle roof, in which, first, a combination film ( 10 ) with a shatter prevention film and electrical function elements...
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7356924 |
Manufacturing process for a power distribution assembly of an electrical system
A modular multi-component power distribution system is provided having a plurality of modular components which includes a bus-bar-like power distribution assembly (PDA), branching connectors, flex...
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7356923 |
Rigid flex interconnect via
A rigid-flexible printed wire assembly which employs a blind via for interconnection is disclosed. Preferably, the assembly includes a rigid section having a through hole formed therethrough and a...
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7356921 |
Method for forming a conductive layer pattern
A method for forming a conductive layer pattern by selectively depositing droplets containing conductive material onto a porous receiving layer. Much of the conductive material is left on the...
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7356913 |
Process for manufacturing a microsystem
A process for making microswitches or microvalves, composed of a substrate and used for shifting between a first state of functioning and a second state of functioning by means of a bimetal-effect...
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7356917 |
Method for manufacturing multi-layer printed circuit board
A multi-layer printed circuit board includes an insulation substrate; a surface conductive pattern disposed on a surface of the insulation substrate; and an inner conductive pattern embedded in the...
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7356922 |
Method of fabricating a rate gyroscope and accelerometer multisensor
Three magnetic substrates are provided, the first substrate forms the rotor and the other two form the outer stator. A series of spaced concentric grooves and spaced spiral grooves are formed in...
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7353590 |
Method of forming printed circuit card
A method of forming a printed circuit card with a metal power plane layer between two photoimageable dielectric layers is provided. Photoformed metal filled vias and plated through holes are in the...
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7353598 |
Assembly comprising functional devices and method of making same
Methods and apparatuses for an electronic assembly. A material is selectively printed on a web substrate at one or more selected areas. The web substrate includes a plurality of functional...
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7353600 |
Circuit board fabrication method and circuit board
A circuit board fabrication method including: forming first conductive interconnection 2 onto insulator substrate 1; applying resin film 41, which is to be interlevel insulator layer 42 for...
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7353599 |
Fiducial markings for quality verification of high density circuit board connectors
Methods for qualifying the accuracy of a circuit board may include providing a printing mask pattern for first and second sides of the circuit board with a first sequence of spaced indicia parallel...
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7353595 |
Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon
A tape substrate includes IC lands electrically connected to pins of a driver IC (integrated circuit), circuit board terminal lands electrically connected to an external circuit board, test lands...
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7350295 |
Method of fabricating multi-layered printed circuit board for optical waveguides
A method of fabricating a multi-layered PCB, in which the optical waveguide component is inserted into the PCB in such a way that a prepreg adhesive does not block an optical signal entrance of the...
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7350298 |
Method for fabricating circuit board with conductive structure
A method for fabricating a circuit board having a conductive structure is disclosed. The method includes: forming first and second insulating protective layers respectively on first and second...
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7350294 |
Method of electroplating a plurality of conductive fingers
A method of electroplating may include placing a pair of conductive fingers in proximity to an edge of a circuit board, where the pair are coupled to be electrically isolated, and where the pair...
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7350285 |
Method of manufacturing a switch panel to be disposed close to a magnetic sensor
A method of manufacturing a movable contact unit includes manufacturing a movable contact, sticking the movable contact to a base sheet made of insulating resin, and applying demagnetization to the...
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7350296 |
Method of fabricating a printed circuit board including an embedded passive component
Disclosed is a method of fabricating a PCB including an embedded passive component and a method of fabricating the same and a method of fabricating the same. The PCB includes at least two circuit...
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7350297 |
Method of manufacturing a wiring substrate
A first plating foundation layer is formed by printing on a front face of a sheet-shaped insulating substrate. By inserting a punch into the sheet-shaped insulating substrate having the first...
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7350292 |
Method for affecting impedance of an electrical apparatus
A method for affecting an impedance of a portion of an electrical circuit loop in an electrical circuit apparatus includes providing an electrical circuit apparatus having at least a portion of an...
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7346981 |
Method for fabricating microelectromechanical system (MEMS) devices
A process for fabricating a MEMS device comprises the steps of depositing and patterning on one side of a wafer a layer of material having a preselected electrical resistivity; bonding a substrate...
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7347950 |
Rigid flexible printed circuit board and method of fabricating same
A rigid flexible printed circuit board (PCB) and a method of fabricating the same. Since a polyimide copper clad laminate is not used during the fabrication of the rigid flexible PCB, an increase...
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7348498 |
Partially voided anti-pads
A printed circuit board comprises a conductive layer and a via transecting the conductive layer. The printed circuit board comprises a pattern of conductive material having a plurality of voids in...
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7343674 |
Method of making circuitized substrate assembly
A method of making a circuitized substrate assembly wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, and a cover is...
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7343654 |
Method of manufacturing a piezoelectric element and a liquid ink jet head
Provided are a piezoelectric element, a method of manufacturing the same, and a liquid jet head, which can improve, and homogenize, characteristics of a piezoelectric layer. Included are: a step of...
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7340828 |
Method for producing metal/ceramic bonding circuit board
There is provided a method for producing a metal/ceramic bonding circuit board, which can form a fine pattern even if a circuit forming metal plate is thick and which can shorten the time required...
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7340829 |
Method for fabricating electrical connection structure of circuit board
A method for fabricating an electrical connection structure of a circuit board is proposed. The circuit board is provided with a plurality of pads on a surface thereof and with a plurality of...
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7340826 |
Method for producing an electronic device connected to a printed circuit board
A configuration and also a method for the configuration in which, the configuration has at least one electronic device with associated contact connections and at least one printed circuit board...
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7337537 |
Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board
A method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board are described herein. In the preferred embodiment, the printed circuit...
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7337535 |
Hole plugging method for printed circuit boards, and hole plugging device
A hole plugging method for a printed circuit board, a hole plugging device in accordance therewith and a manufacturing method in accordance therewith where a mask for selectively exposing a via...
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RE40137 |
Methods for forming integrated circuits within substrates
The invention includes methods for forming integrated circuits within substrates, and embedded circuits. In one aspect, the invention includes a method of forming an integrated circuit within a...
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7334320 |
Method of making an electronic fuse with improved ESD tolerance
Tolerance to ESD is increased in an electronic fuse by providing at least one non-conductive region adjacent to a conductive region on the surface of an insulator. Such an arrangement reduces the...
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7334324 |
Method of manufacturing multilayer wiring board
A method of manufacturing a, in order to accommodate the words range and to clarify the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating...
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7334323 |
Method of making mutilayered circuitized substrate assembly having sintered paste connections
A method of making a circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder...
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7334325 |
Apparatus and method for improving coupling across plane discontinuities on circuit boards
The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout,...
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7331101 |
Method of fabricating a micro-electromechanical actuating mechanism
A method of fabricating a micro-electromechanical actuating mechanism on a wafer substrate includes the step of carrying out a CMOS fabrication process on the wafer to form transistor control and...
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7332922 |
Method for fabricating a structure for making contact with a device
Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A...
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7328505 |
Method for manufacturing multilayer circuit board
A multilayer circuit board that has electrodes only on one surface is manufactured as follows. A plurality of conductor layers are formed on a resin film made of thermoplastic resin to form a...
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7328506 |
Method for forming a plated microvia interconnect
A method for forming a plated microvia interconnect. An external dielectric layer (EDL) is mounted on a surface of the substrate and is in direct mechanical contact with a conductive element...
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7328490 |
Method for manufacturing a liquid jetting head
A method for manufacturing a liquid jetting head includes manufacturing a piezoelectric element having consistently high piezoelectric characteristics that obtains a degree of orientation that is...
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7325300 |
Method of manufacturing printed wiring boards
In a heat and press stage of manufacturing printed wiring boards, a functional surface layer having release property is provided on a surface of a cushion, and a blocking layer is prepared between...
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7325304 |
Method of connecting probe pin to circuit board and method of manufacturing probe card
There is provided a method of manufacturing a probe card that electrically connects a testing device and a device under test to transmit a signal between the testing device and the device under...
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7325294 |
Method of making electromagnetic wave shielded write and read wires on a support for a magnetic media drive
A method of making electromagnetic wave shielded read and write wires is provided. The method includes forming a bottom insulation layer on a bottom shield layer formed on a substrate. Then,...
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