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7487587 |
Methods of producing a composite substrate
Methods of producing a composite substrate and devices made by the methods are disclosed. One of the methods comprises providing a flexible sacrificial layer, producing one or more patterned...
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7489248 |
RFID tags and processes for producing RFID tags
A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit...
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7484280 |
Method for manufacturing a surface acoustic wave element having an interdigital transducer (IDT) electrode
A method for manufacturing a surface acoustic wave element having an interdigital transducer (IDT) electrode formed on a semiconductor substrate includes a) forming an insulation layer on a surface...
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7480994 |
Method of making a fluid ejection head for a fluid ejection device
A fluid ejection head of a fluid ejection device is provided, the fluid ejection head having a substrate, a fluid ejection die coupled with the substrate, an electromagnetic radiation-curable...
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7480990 |
Method of making conductor contacts having enhanced reliability
Methods for forming conductor contacts provide for etching through a capping layer located upon a conductor contact region within a substrate. A first pair of methods provide for etching through at...
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7478472 |
Method of making circuitized substrate with signal wire shielding
A method of making a circuitized substrate in which at least one signal line used therein is shielded by a pair of opposingly positioned ground lines which in turn are electrically coupled to a...
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7479852 |
Method for manufacturing surface acoustic wave device and surface acoustic wave device
A method for manufacturing a surface acoustic wave device includes the steps of forming an IDT electrode, a first wiring pattern, and a third wiring pattern on a piezoelectric substrate, forming an...
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7467458 |
Method for use in making a read head
Methods of making a read sensor with a selectively deposited lead layers are disclosed. In one illustrative example, the method includes the acts of forming a plurality of read sensor layers over a...
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7467447 |
Method of manufacturing a SAW device
In a SAW device comprising a piezoelectric single crystal substrate and electrodes on a surface thereof, the substrate is obtained by slicing a LiTaO 3 or LiNbO 3 material such that a plane...
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7464459 |
Method of forming a MEMS actuator and relay with vertical actuation
A method of forming an actuator and a relay using a micro-electromechanical (MEMS)-based process is disclosed. The method first forms the lower sections of a square copper coil, and then forms a...
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7464465 |
Method of forming low-stiction nozzle plate for an inkjet printhead
A method of forming a low-stiction nozzle plate for an inkjet printhead, said nozzle plate having a plurality of nozzle apertures defined therein, each nozzle aperture having a respective nozzle...
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7462500 |
Manufacturing method of ink jet recording head and ink jet recording head manufactured by manufacturing method
A manufacturing method of an ink jet recording head including a discharge port for discharging ink includes the step of forming the discharge port by performing dry etching of a discharge port...
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7458146 |
Method for manufacturing image display unit
The present invention discloses a method for reinforcing the connection between a wire formed on a substrate and a flat cable member with a reinforcing material. The method includes the step of...
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7458150 |
Method of producing circuit board
A method of producing a circuit board includes a step of providing a conductive paste including metal nano-particles at an insulating substrate, and a step of sintering the conductive paste so as...
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7458149 |
Printed circuit board and method of manufacturing the same
A wiring pattern can be formed with a high density on a substrate as a highly reliable printed circuit board. A method of manufacturing a printed circuit board includes a step of forming a...
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7454836 |
Method for manufacturing inkjet head, and inkjet head
A method for manufacturing an inkjet head having a pressure chamber that stores ink, a nozzle that is provided at the pressure chamber and ejects the ink, and an actuator that changes an internal...
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7456748 |
RFID antenna with pre-applied adhesives
A radio frequency identification (“RFID”) system antenna having adhesive pre-applied to one or more of its contact pads to allow for high speed attachment of the antenna to the RFID die or die...
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7454832 |
Method of forming metal plate pattern and circuit board
A method of forming a high aspect ratio metal plate pattern or circuit board by multi-stage etching with a metal mask is disclosed. A resist ( 12 ) is coated on one or two surfaces of a copper...
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7454831 |
Method for mounting an electronic element on a wiring board
An electronic element (a semiconductor chip) is joining on a wiring board with the active surface thereof facing up (die-bonding step). A slope linked from the surface of the wiring board to the...
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7451540 |
Method for fabricating a printed circuit board
Fabricating ( 100, 1300 ) a printed circuit board includes fabricating patterned conductive traces ( 305, 310, 1410, 1415 ) onto a foil, laminating the patterned conductive traces to a printed...
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7444727 |
Method for forming multi-layer embedded capacitors on a printed circuit board
A method for forming embedded capacitors on a printed circuit board is disclosed. The capacitor is formed on the printed circuit board by a depositing a first dielectric layer over one or more...
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7444735 |
Process for manufacturing an integrated circuit system
A system for manufacturing an integrated circuit system having a substrate with a integrated circuit device. A first pad is formed on the substrate and connected to the integrated circuit device. A...
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7445647 |
Method for making a single unit fuel cell
A method for making fuel cells is disclosed and includes placing catalyst strips on an anode side and a cathode side of a proton exchange membrane disposed between carbon bases. The method includes...
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7441330 |
Process for producing circuit board
A process for producing a circuit board includes the steps of etching the third metal layer of a three-layer metal laminate into a predetermined interconnection pattern by photolithography; forming...
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7441329 |
Fabrication process circuit board with embedded passive component
A process for fabricating a circuit board with embedded passive component is provided. A conductive layer including a first surface and a second surface opposing to the first surface is provided....
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7437813 |
Probe repair methods
A method and apparatus for repairing a probe on a probe card is provided. A plurality of beams is formed on a beam panel. The plurality of beams includes a replacement beam. After identifying a...
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7430800 |
Apparatus and method for far end noise reduction using capacitive cancellation by offset wiring
A mechanism for reducing the vertical cross-talk interference experienced in signal lines due to the inductive affects from signal lines in other signal planes of a multi-layer ceramic package is...
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7427718 |
Ground plane having opening and conductive bridge traversing the opening
Conductive bridges to traverse openings in ground planes, and methods of making the conductive bridges, are disclosed. In one aspect, an apparatus may include a ground plane, one or more openings...
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7421781 |
Method of forming a module component having a plurality of penetration holes
According to the invention, the method of manufacturing a module component comprises an inserting step of inserting a chip component in a first molding die; a primary molding step of filling the...
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7418780 |
Method for forming stacked via-holes in a multilayer printed circuit board
An exemplary method for forming stacked via-holes in a multilayer printed circuit board includes the steps of: providing a base circuit board; attaching a first copper-coated-substrate having a...
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7418772 |
Method for manufacturing a surface acoustic wave
In a manufacturing method for a SAW apparatus a first insulating layer is formed on the entire surface of a piezoelectric LiTaO 3 substrate. By using a resist pattern used for forming an IDT...
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7415761 |
Method of manufacturing multilayered circuit board
An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22 , the thickness of which is reduced (to 3 μm) by performing etching to lower the...
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7416759 |
Wiring pattern formation method, wiring pattern, and electronic device
In a method of forming a wiring pattern, a plurality of electrical wirings deposited to be multilayered are conductively connected to one another through a conducting post. The method has forming...
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7412765 |
Method of manufacturing a sticker type antenna
A method of manufacturing a sticker type antenna, in which a copper foil of 0.017 mm by thickness is stuck to a layer of releasable film in advance, in order that the copper foil can bear the...
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7406756 |
Method for manufacturing a piezoelectric resonator
A method for manufacturing a piezoelectric resonator is provided including: forming a resonator element having a plate-like base and a plurality of arms extending laterally from the base on a...
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7406761 |
Method of manufacturing vibrating micromechanical structures
A method for fabrication of single crystal silicon micromechanical resonators using a two-wafer process, including either a Silicon-on-insulator (SOI) or insulating base and resonator wafers,...
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7405362 |
Semiconductor devices having more than two-rows of pad structures and methods of fabricating the same
A semiconductor device is provided including a printed circuit board and first, second and third rows of power and/or signal pads on the printed circuit board. A plurality of input and output...
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7401403 |
Method for forming ceramic thick film element arrays with fine feature size, high-precision definition, and/or high aspect ratios
A method is provided that includes providing a mold on a temporary substrate, e.g., a sapphire substrate. Next, a material such as PZT paste is deposited into the mold. Then, the mold is removed to...
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7401402 |
Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor
The invention relates to a method for high-frequency tuning a high-frequency plug connector, comprising a printed circuit board that has both contact points for high-frequency contacts as well as...
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7402758 |
Telescoping blind via in three-layer core
A multilayer PCB including at least one carrier, wherein the at least one carrier comprises a pseudo three-layer core. Each three-layer core includes a first metal layer, a first dielectric layer,...
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7399399 |
Method for manufacturing semiconductor package substrate
A method for manufacturing a semiconductor package is proposed. A circuit board with a circuit layer on at least one surface thereof is provided. The circuit board has at least one free area, and...
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7392584 |
Methods and apparatus for a flexible circuit interposer
Methods and apparatus for testing a semiconductor device are disclosed. A flexible circuit interposer includes a flexible circuit substrate which allows in-situ probing of an attached device...
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7390973 |
Memory module and signal line arrangement method thereof
The pesent invention discloses a memory module and a signal line arrangement method thereof. The memory module includes memory chips mounted on both sidees in a mirror form; and a printed circuit...
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7389569 |
Method for manfacturing an acoustic matching member
A method for manufacturing an acoustic matching member, the acoustic matching member being incorporated into an ultrasonic transducer for transmitting and receiving ultrasonic waves, and including:...
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7389570 |
Surface acoustic wave device manufacturing method, surface acoustic wave device, and communications equipment
After electrode patterning on an electrode forming surface of a piezoelectric substrate 2 (FIG. 1 ( b )), a conductor layer is formed on an electrode non-forming surface of the piezoelectric...
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7389581 |
Method of forming compliant contact structures
A compliant contact structure and contactor card for operably coupling with a semiconductor device to be tested includes a substantially planar substrate with a compliant contact formed therein....
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7386936 |
Method for manufacturing in electrically conductive pattern
The present invention relates to a method for manufacturing an electrically conductive pattern by printing a layer comprising metal oxide on a carrier substrate ( 2 ) and reducing the metal oxide...
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7383630 |
Method for making a circuit plate
A method for making a circuit plate includes: forming first holes in an insulating layer; forming a conductive layer on the insulating layer such that a portion of the conductive layer fills the...
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7383629 |
Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof
A circuitized substrate in which two conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to an interim dielectric layer. Each of the two foil surfaces which physically...
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7380338 |
Circuit board and manufacturing method thereof
A circuit board includes a substrate, an insulating layer, at least one protrusion, and a first circuit layer. The insulating layer is disposed on the substrate and has at least one...
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