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7552522 |
Method of making a sensing apparatus
A method and apparatus for enhancing the integrity of an implantable sensor. Voids formed between an outer tubing and a sensor substrate or spacing element may be back-filled with a curable,...
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7549220 |
Method for making a multilayer circuit
A method for the manufacture of a multilayer circuit comprising a liquid crystalline polymer layer, the method comprising treating the multilayer circuit with an amount of heat effective to raise...
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7546677 |
Method for fabricating a micro-electromechanical system switch
A method includes forming a signal line on the substrate so as to have a predetermined opening portion; at least one supporting frame each formed on the substrate at both sides of the signal line;...
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7546681 |
Manufacturing method for wiring circuit substrate
A method of making a microelectronic element includes making a connection component by providing a metal layer having a top surface and a bottom surface, providing a dielectric layer over the top...
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7543377 |
Perimeter matrix ball grid array circuit package with a populated center
A ball grid array (BGA) integrated circuit package which has an outer two-dimensional array of solder balls and a center two-dimensional array of solder balls located on a bottom surface of a...
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7543374 |
Method of manufacturing wiring substrate
In a method of manufacturing a wiring substrate according to the present invention, a metal foil is tentatively fixed onto a temporary substrate, which is made of a nonwoven fabric impregnated with...
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7543376 |
Manufacturing method of flexible printed wiring board
Provided is an FPC, which comprises an insulating layer 2 , wiring layers 3 and 4 laminated above and under the insulating layer 2 , and a layer connection for connecting the wiring layers 3...
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7543373 |
Gel package structural enhancement of compression system board connections
A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of...
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7546106 |
Electronic circuit
An electronic circuit capable of carrying out communications by inductive coupling with minimum power consumption between substrates. Although the amplification factor of the amplifier 10 a is 1,...
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7543375 |
Process for filling via hole in a substrate
A process for producing an electronic component The electronic component includes a base material equipped with a core material and having a conductor layer on at least one surface thereof; a via...
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7540082 |
Method for manufacturing printed wiring board
A printed wiring board having a through hole conductor formed on the surface of a through hole formed in a copper-clad laminate board, and on the surface of the copper-clad laminate board 1 in...
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7540079 |
Laminated member for circuit board, method and apparatus for manufacturing of circuit board
A circuit board-use member has a reinforcing plate, a removable organic layer, a flexible film having a circuit pattern, and a peeling-assist layer laminated in that order;
a method forms a...
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7536780 |
Method of manufacturing wiring substrate to which semiconductor chip is mounted
The present invention discloses a method of manufacturing a wiring substrate to which a semiconductor chip mounted. The method includes the steps of forming a base, forming a peeling layer on the...
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7533458 |
Method for reducing noise coupling in high speed digital systems
Methods and systems for reducing noise coupling in high-speed digital systems. Exemplary embodiments include a method, including etching a plurality of high speed signal traces onto a core...
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7533462 |
Method of constructing a membrane probe
A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the...
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7530166 |
Method for making a radio frequency coupling structure
Method for making a coupling structure ( 10 ) comprises the steps of forming a body ( 12 B) of a polymeric material loaded with a conductive filler, providing a coupling area ( 12 C) of a...
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7526861 |
Method for fabricating structure of polymer-matrix conductive film
A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel...
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7523544 |
Method for manufacturing keypad
In a method for manufacturing compact keypad, a first molding die with bottom surface of smooth face, matted face or patterned layer is prepared. Colloid is injected into the first molding die and...
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7523548 |
Method for producing a printed circuit board
A process for producing a printed wiring board comprises the steps of depositing a base metal on at least one surface of an insulating film to form a base metal layer and further depositing copper...
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7523551 |
Manufacturing method of a multi-layer circuit board embedded with a passive component
A manufacturing method of a multi-layer circuit board embedded with a passive component includes the steps of: providing a conductive foil which has one or more pairs of metal protruding points;...
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7523549 |
Dimensionally stabilized flexible circuit fabrication method and product
A method of fabricating a flexible circuit interconnect comprising a conductive pattern on a flexible substrate comprising layers of different components having different coefficients of thermal...
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7523542 |
Method of manufacturing a magnetic element
There are provided a magnetic element capable of enhancing magnetic permeability of a magnetic member, improving a direct current superposition characteristic, and improving production efficiency...
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7523545 |
Methods of manufacturing printed circuit boards with stacked micro vias
Methods of manufacturing printed circuit boards having circuit layers laminated with stacked (or staggered) micro via(s). Aspects of embodiments of the present invention are directed to a method of...
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7520053 |
Method for manufacturing a bump-attached wiring circuit board
An object of the present invention is to manufacture a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as...
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7520049 |
Method for manufacturing a planar resistance heating element
Disclosed herein is a manufacturing method of a planar resistance heating element and a planar resistance heating element made using the method. In the manufacturing method of a planar resistance...
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7520054 |
Process of manufacturing high frequency device packages
A high frequency device packaging method is described wherein an insulating material, attached to a fiat surface, is selectively etched and the etched insulating material is plated with a...
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7516544 |
Spacers for reducing crosstalk and maintaining clearances
In one aspect of the invention is a method for reducing crosstalk and maintaining clearances between traces on a printed circuit board design. Crosstalk caused by placing traces a virtual printed...
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7516545 |
Method of manufacturing printed circuit board having landless via hole
Disclosed is a method of manufacturing a printed circuit board having a landless via hole. Specifically, this invention provides a method of manufacturing a printed circuit board having a landless...
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7516542 |
Wiring board and manufacturing method therefor
A wiring board is manufactured by a step of forming a meshy cylindrical body, where plural conductive rings are connected to each other at plural positions in the respective peripheral direction, a...
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7514637 |
Electroplating solution, method for fabricating multilayer printed wiring board using the solution, and multilayer printed wiring board
The objective of present invention is to provide an electroplating solution capable of forming the upper face of a via-hole and the upper face of a conductor circuit in the same layer in...
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7509716 |
Method for manufacturing piezoelectric actuator
In a method for manufacturing a piezoelectric actuator, a ceramic sintered body is prepared and a size of the ceramic sintered body is adjusted in a thickness direction defined below by grinding...
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7509733 |
Method for producing means of connecting and/or soldering a component
A method for producing a plurality of stamped shapes to serve as a mechanism for connecting and/or soldering or sealing a component, on a substrate, including the steps of depositing a layer made...
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7511965 |
Circuit board device and manufacturing method thereof
In a circuit board device having an electronic component mounted on an electrode land on a board by reflow soldering, voids that adversely affect the solder joint in various ways are prevented from...
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7506443 |
Beveled charge structure
A drop selection assemblage for use in a printhead and method of making includes a drop generator with a jet array for releasing a drop stream along a normal drop path. The drop stream includes...
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7506435 |
Manufacturing method of a multi-layer circuit board with an embedded passive component
A manufacturing method of a multi-layer circuit board with an embedded passive component includes providing a single layer plate having a dielectric layer and a first conductive foil, heating the...
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7506437 |
Printed circuit board having chip package mounted thereon and method of fabricating same
Disclosed is a printed circuit board (PCB) and a method of fabricating the same. A contact portion is formed on an internal layer of the multi-layered PCB. A groove is formed so as to expose the...
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7506438 |
Low profile integrated module interconnects and method of fabrication
A low profile integrated module is fabricated to include sheets of material, such as ceramic or PCB, fixed together and including a via extending through at least one of the plurality of sheets...
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7508079 |
Circuit substrate and method of manufacturing the same
In a method of manufacturing a circuit substrate of the present invention, a first through hole is formed in a semiconductor substrate and a first insulating layer is formed on the entire surface...
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7500306 |
Coupling of conductive vias to complex power-signal substructures
A method of forming an electrical structure that includes a complex power-signal (CPS) substructure. The CPS substructure is formed and tested to determine whether the CPS substructure satisfies...
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7498520 |
Semiconductor multilayer wiring board and method of forming the same
A silica-based interlayer insulating layer having a low dielectric constant is formed with SOG material on a substrate, in which a wiring-layer forming space is then formed. If necessary, a UV ray...
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7493680 |
Method of fabricating airtight terminals
To provide an airtight terminal and a piezoelectric vibrator having a strong rigidity of a lead despite a small-sized constitution, and provide a method of fabricating an airtight terminal...
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7490403 |
Soldering method
In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead...
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7490390 |
Method of manufacturing a voltage controlled oscillator
A manufacturing method is provided for a voltage controlled oscillator comprising an thin film BAW resonator and a variable capacitor element. The thin film BAW resonator includes an anchor section...
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7490405 |
Method for manufacturing a liquid droplet discharge head.
The liquid droplet discharge head comprises: a piezoelectric actuator shaped in a cylinder having a hollow part; a pressure chamber shaped in a cylinder formed in the hollow part of the...
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7487587 |
Methods of producing a composite substrate
Methods of producing a composite substrate and devices made by the methods are disclosed. One of the methods comprises providing a flexible sacrificial layer, producing one or more patterned...
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7489248 |
RFID tags and processes for producing RFID tags
A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit...
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7484280 |
Method for manufacturing a surface acoustic wave element having an interdigital transducer (IDT) electrode
A method for manufacturing a surface acoustic wave element having an interdigital transducer (IDT) electrode formed on a semiconductor substrate includes a) forming an insulation layer on a surface...
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7480994 |
Method of making a fluid ejection head for a fluid ejection device
A fluid ejection head of a fluid ejection device is provided, the fluid ejection head having a substrate, a fluid ejection die coupled with the substrate, an electromagnetic radiation-curable...
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7480990 |
Method of making conductor contacts having enhanced reliability
Methods for forming conductor contacts provide for etching through a capping layer located upon a conductor contact region within a substrate. A first pair of methods provide for etching through at...
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7478472 |
Method of making circuitized substrate with signal wire shielding
A method of making a circuitized substrate in which at least one signal line used therein is shielded by a pair of opposingly positioned ground lines which in turn are electrically coupled to a...
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