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7353599 |
Fiducial markings for quality verification of high density circuit board connectors
Methods for qualifying the accuracy of a circuit board may include providing a printing mask pattern for first and second sides of the circuit board with a first sequence of spaced indicia parallel...
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7353598 |
Assembly comprising functional devices and method of making same
Methods and apparatuses for an electronic assembly. A material is selectively printed on a web substrate at one or more selected areas. The web substrate includes a plurality of functional...
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7353595 |
Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon
A tape substrate includes IC lands electrically connected to pins of a driver IC (integrated circuit), circuit board terminal lands electrically connected to an external circuit board, test lands...
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7353592 |
Method of fabricating an RF substrate with selected electrical properties
Method for fabricating a textured dielectric substrate ( 400 ) for an RF circuit. The method can include the step ( 104 ) of selecting a plurality of dielectric substrate materials, each having a...
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7353590 |
Method of forming printed circuit card
A method of forming a printed circuit card with a metal power plane layer between two photoimageable dielectric layers is provided. Photoformed metal filled vias and plated through holes are in the...
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7350298 |
Method for fabricating circuit board with conductive structure
A method for fabricating a circuit board having a conductive structure is disclosed. The method includes: forming first and second insulating protective layers respectively on first and second...
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7350297 |
Method of manufacturing a wiring substrate
A first plating foundation layer is formed by printing on a front face of a sheet-shaped insulating substrate. By inserting a punch into the sheet-shaped insulating substrate having the first...
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7350296 |
Method of fabricating a printed circuit board including an embedded passive component
Disclosed is a method of fabricating a PCB including an embedded passive component and a method of fabricating the same and a method of fabricating the same. The PCB includes at least two circuit...
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7350295 |
Method of fabricating multi-layered printed circuit board for optical waveguides
A method of fabricating a multi-layered PCB, in which the optical waveguide component is inserted into the PCB in such a way that a prepreg adhesive does not block an optical signal entrance of the...
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7350294 |
Method of electroplating a plurality of conductive fingers
A method of electroplating may include placing a pair of conductive fingers in proximity to an edge of a circuit board, where the pair are coupled to be electrically isolated, and where the pair...
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7350292 |
Method for affecting impedance of an electrical apparatus
A method for affecting an impedance of a portion of an electrical circuit loop in an electrical circuit apparatus includes providing an electrical circuit apparatus having at least a portion of an...
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7350285 |
Method of manufacturing a switch panel to be disposed close to a magnetic sensor
A method of manufacturing a movable contact unit includes manufacturing a movable contact, sticking the movable contact to a base sheet made of insulating resin, and applying demagnetization to the...
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7348498 |
Partially voided anti-pads
A printed circuit board comprises a conductive layer and a via transecting the conductive layer. The printed circuit board comprises a pattern of conductive material having a plurality of voids in...
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7347950 |
Rigid flexible printed circuit board and method of fabricating same
A rigid flexible printed circuit board (PCB) and a method of fabricating the same. Since a polyimide copper clad laminate is not used during the fabrication of the rigid flexible PCB, an increase...
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7346981 |
Method for fabricating microelectromechanical system (MEMS) devices
A process for fabricating a MEMS device comprises the steps of depositing and patterning on one side of a wafer a layer of material having a preselected electrical resistivity; bonding a substrate...
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7343679 |
Method for manufacturing a liquid ejection element substrate
A manufacturing method for manufacturing a liquid ejection element substrate for a liquid ejection element for ejecting liquid through an ejection outlet, the liquid ejection element substrate...
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7343674 |
Method of making circuitized substrate assembly
A method of making a circuitized substrate assembly wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, and a cover is...
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7343654 |
Method of manufacturing a piezoelectric element and a liquid ink jet head
Provided are a piezoelectric element, a method of manufacturing the same, and a liquid jet head, which can improve, and homogenize, characteristics of a piezoelectric layer. Included are: a step of...
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7340829 |
Method for fabricating electrical connection structure of circuit board
A method for fabricating an electrical connection structure of a circuit board is proposed. The circuit board is provided with a plurality of pads on a surface thereof and with a plurality of...
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7340828 |
Method for producing metal/ceramic bonding circuit board
There is provided a method for producing a metal/ceramic bonding circuit board, which can form a fine pattern even if a circuit forming metal plate is thick and which can shorten the time required...
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7340826 |
Method for producing an electronic device connected to a printed circuit board
A configuration and also a method for the configuration in which, the configuration has at least one electronic device with associated contact connections and at least one printed circuit board...
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RE40137 |
Methods for forming integrated circuits within substrates
The invention includes methods for forming integrated circuits within substrates, and embedded circuits. In one aspect, the invention includes a method of forming an integrated circuit within a...
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7337537 |
Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board
A method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board are described herein. In the preferred embodiment, the printed circuit...
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7337535 |
Hole plugging method for printed circuit boards, and hole plugging device
A hole plugging method for a printed circuit board, a hole plugging device in accordance therewith and a manufacturing method in accordance therewith where a mask for selectively exposing a via...
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7334326 |
Method for making an integrated circuit substrate having embedded passive components
A method for making an integrated circuit substrate having embedded passive components provides a reduced cost and compact package for a die and one or more passive components. An insulating layer...
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7334325 |
Apparatus and method for improving coupling across plane discontinuities on circuit boards
The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout,...
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7334324 |
Method of manufacturing multilayer wiring board
A method of manufacturing a, in order to accommodate the words range and to clarify the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating...
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7334323 |
Method of making mutilayered circuitized substrate assembly having sintered paste connections
A method of making a circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder...
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7334320 |
Method of making an electronic fuse with improved ESD tolerance
Tolerance to ESD is increased in an electronic fuse by providing at least one non-conductive region adjacent to a conductive region on the surface of an insulator. Such an arrangement reduces the...
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7332922 |
Method for fabricating a structure for making contact with a device
Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A...
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7331101 |
Method of fabricating a micro-electromechanical actuating mechanism
A method of fabricating a micro-electromechanical actuating mechanism on a wafer substrate includes the step of carrying out a CMOS fabrication process on the wafer to form transistor control and...
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7328506 |
Method for forming a plated microvia interconnect
A method for forming a plated microvia interconnect. An external dielectric layer (EDL) is mounted on a surface of the substrate and is in direct mechanical contact with a conductive element...
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7328505 |
Method for manufacturing multilayer circuit board
A multilayer circuit board that has electrodes only on one surface is manufactured as follows. A plurality of conductor layers are formed on a resin film made of thermoplastic resin to form a...
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7328490 |
Method for manufacturing a liquid jetting head
A method for manufacturing a liquid jetting head includes manufacturing a piezoelectric element having consistently high piezoelectric characteristics that obtains a degree of orientation that is...
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7325304 |
Method of connecting probe pin to circuit board and method of manufacturing probe card
There is provided a method of manufacturing a probe card that electrically connects a testing device and a device under test to transmit a signal between the testing device and the device under...
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7325301 |
Method of manufacturing a wiring board
A wiring board according to the present invention includes a wiring part formed of one or more layers, a first terminal area disposed on one side of the wiring part in a projecting manner, and a...
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7325300 |
Method of manufacturing printed wiring boards
In a heat and press stage of manufacturing printed wiring boards, a functional surface layer having release property is provided on a surface of a cushion, and a blocking layer is prepared between...
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7325299 |
Method of making a circuitized substrate
A method of making a circuitized substrate. A conductive layer having a substantially planar upper surface is formed on and in direct mechanical contact with an upper surface of a substrate. A...
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7325294 |
Method of making electromagnetic wave shielded write and read wires on a support for a magnetic media drive
A method of making electromagnetic wave shielded read and write wires is provided. The method includes forming a bottom insulation layer on a bottom shield layer formed on a substrate. Then,...
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7323779 |
Semiconductor device
A semiconductor device includes a semiconductor chip. A stepped member having stepped regions is provided on the semiconductor chip. The stepped member, together with a redistribution layer, is...
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7322100 |
Method for producing a micromachined layered device
Methods for producing micromachined layered devices having a membrane layer and a first and second layer on both sides of the membrane layer are disclosed. The method includes applying a membrane...
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7322081 |
Method of manufacturing a surface acoustic wave device
According to the method of manufacturing a surface acoustic wave device of the invention, since a conductor layer is formed on electrode sections in a state where the entire regions of inter...
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7321495 |
Capacitor and method for manufacturing the same
A multilayer ceramic capacitor ( 10 ) having reduced inductance which is separated into a first layer body ( 11 ) and a second layer body ( 12 ). The first layer body ( 11 ) and the second layer...
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7320173 |
Method for interconnecting multi-layer printed circuit board
A method for fabricating a multi-layer printed circuit board can include forming an etching resist layer on a first metal layer having plating grooves that selectively expose the first metal layer,...
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7316065 |
Method for fabricating a plurality of elastic probes in a row
A method of forming a plurality of elastic probes in a row is disclosed. Firstly, a substrate is provided, then, a shaping layer is formed on the substrate so as to offer two flat surfaces in...
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7316063 |
Methods of fabricating substrates including at least one conductive via
A method of fabricating a substrate is disclosed. Apertures are formed in a substrate blank. A conductive layer is formed on opposing surfaces of the substrate, as well as inside the apertures....
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7313854 |
Method of manufacturing a tactile sensor
A method of manufacturing a tactile sensor, which is capable of implementing a wide range of senses, including sensing contact pressure (vertical force and horizontal force) with an external object...
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7310874 |
Method for manufacturing a potassium niobate deposited body
A potassium niobate deposited body includes a substrate, an electrode layer formed above the substrate, and a potassium niobate layer formed above the electrode layer. The potassium niobate layer...
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7305761 |
Method for manufacturing wiring substrate
A method for manufacturing a wiring substrate includes the steps of: (a) forming a ground layer precursor having reactive groups including nitrogen atoms in first and second areas of a substrate;...
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7302757 |
Micro-bumps to enhance LGA interconnections
An improved Land Grid Array interconnect structure is provided with the use of small metal bumps on the substrate electrical contact pad. The bumps interlock with segments of the fuzz button...
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